JP7368962B2 - 実装装置 - Google Patents

実装装置 Download PDF

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Publication number
JP7368962B2
JP7368962B2 JP2019127915A JP2019127915A JP7368962B2 JP 7368962 B2 JP7368962 B2 JP 7368962B2 JP 2019127915 A JP2019127915 A JP 2019127915A JP 2019127915 A JP2019127915 A JP 2019127915A JP 7368962 B2 JP7368962 B2 JP 7368962B2
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JP
Japan
Prior art keywords
tape
bonding
mounting
bonding head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019127915A
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English (en)
Japanese (ja)
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JP2021013002A (ja
JP2021013002A5 (ko
Inventor
智之 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2019127915A priority Critical patent/JP7368962B2/ja
Priority to CN202010629211.7A priority patent/CN112218516B/zh
Priority to KR1020200082947A priority patent/KR102386562B1/ko
Priority to TW109122832A priority patent/TWI764188B/zh
Publication of JP2021013002A publication Critical patent/JP2021013002A/ja
Publication of JP2021013002A5 publication Critical patent/JP2021013002A5/ja
Priority to JP2023177913A priority patent/JP2023171668A/ja
Priority to JP2023177914A priority patent/JP7524441B2/ja
Application granted granted Critical
Publication of JP7368962B2 publication Critical patent/JP7368962B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2019127915A 2019-07-09 2019-07-09 実装装置 Active JP7368962B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019127915A JP7368962B2 (ja) 2019-07-09 2019-07-09 実装装置
CN202010629211.7A CN112218516B (zh) 2019-07-09 2020-07-02 安装装置
KR1020200082947A KR102386562B1 (ko) 2019-07-09 2020-07-06 실장 장치
TW109122832A TWI764188B (zh) 2019-07-09 2020-07-07 安裝裝置
JP2023177914A JP7524441B2 (ja) 2019-07-09 2023-10-13 実装装置
JP2023177913A JP2023171668A (ja) 2019-07-09 2023-10-13 実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019127915A JP7368962B2 (ja) 2019-07-09 2019-07-09 実装装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023177914A Division JP7524441B2 (ja) 2019-07-09 2023-10-13 実装装置
JP2023177913A Division JP2023171668A (ja) 2019-07-09 2023-10-13 実装装置

Publications (3)

Publication Number Publication Date
JP2021013002A JP2021013002A (ja) 2021-02-04
JP2021013002A5 JP2021013002A5 (ko) 2022-07-15
JP7368962B2 true JP7368962B2 (ja) 2023-10-25

Family

ID=74059013

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019127915A Active JP7368962B2 (ja) 2019-07-09 2019-07-09 実装装置
JP2023177913A Pending JP2023171668A (ja) 2019-07-09 2023-10-13 実装装置
JP2023177914A Active JP7524441B2 (ja) 2019-07-09 2023-10-13 実装装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023177913A Pending JP2023171668A (ja) 2019-07-09 2023-10-13 実装装置
JP2023177914A Active JP7524441B2 (ja) 2019-07-09 2023-10-13 実装装置

Country Status (4)

Country Link
JP (3) JP7368962B2 (ko)
KR (1) KR102386562B1 (ko)
CN (1) CN112218516B (ko)
TW (1) TWI764188B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024204812A1 (ja) * 2023-03-31 2024-10-03 芝浦メカトロニクス株式会社 実装装置及び実装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088150A (ja) 2005-09-21 2007-04-05 Shibaura Mechatronics Corp 電子部品の実装装置及び実装装置の清掃方法
JP2015118971A (ja) 2013-12-17 2015-06-25 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 実装装置及び実装方法
WO2019039508A1 (ja) 2017-08-22 2019-02-28 株式会社新川 実装装置および温度測定方法

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JP2001313493A (ja) * 2000-04-27 2001-11-09 Sony Corp 電子部品の実装システム
JP4601844B2 (ja) * 2001-01-23 2010-12-22 芝浦メカトロニクス株式会社 ボンディング装置及びボンディンク方法
JP3962906B2 (ja) * 2002-02-26 2007-08-22 ソニー株式会社 部品実装装置及び部品実装方法
JP3661658B2 (ja) * 2002-03-19 2005-06-15 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
US7142909B2 (en) * 2002-04-11 2006-11-28 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
JP2004119430A (ja) * 2002-09-24 2004-04-15 Tadatomo Suga 接合装置および方法
JP4736355B2 (ja) * 2004-06-08 2011-07-27 パナソニック株式会社 部品実装方法
JP5259116B2 (ja) * 2007-04-17 2013-08-07 キヤノンマシナリー株式会社 ダイボンダ
KR101266614B1 (ko) * 2008-09-29 2013-05-22 시바우라 메카트로닉스 가부시끼가이샤 접합 구조체, 접합 방법 및 접합 장치
JPWO2010041610A1 (ja) * 2008-10-07 2012-03-08 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5877645B2 (ja) * 2011-02-15 2016-03-08 東レエンジニアリング株式会社 実装方法および実装装置
US9140421B2 (en) * 2011-08-12 2015-09-22 Tsmc Solid State Lighting Ltd. Lighting device for direct and indirect lighting
CN104246998A (zh) * 2012-06-06 2014-12-24 夏普株式会社 部件压接装置
JP6205161B2 (ja) * 2013-04-12 2017-09-27 Juki株式会社 電子部品実装装置
CN203554888U (zh) * 2013-11-12 2014-04-16 苏州博众精工科技有限公司 一种自动对位组装机
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
JP5828943B1 (ja) * 2014-08-11 2015-12-09 株式会社新川 電子部品の実装装置
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
SG11201811522QA (en) * 2016-03-24 2019-01-30 Shinkawa Kk Bonding apparatus
JP6679378B2 (ja) * 2016-03-30 2020-04-15 東レエンジニアリング株式会社 実装装置および実装方法
JP6816992B2 (ja) * 2016-08-08 2021-01-20 東レエンジニアリング株式会社 実装装置
CN109292507A (zh) * 2018-10-09 2019-02-01 山东精诺机械股份有限公司 卷筒无胶封尾装置及卷筒无胶封尾方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088150A (ja) 2005-09-21 2007-04-05 Shibaura Mechatronics Corp 電子部品の実装装置及び実装装置の清掃方法
JP2015118971A (ja) 2013-12-17 2015-06-25 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 実装装置及び実装方法
WO2019039508A1 (ja) 2017-08-22 2019-02-28 株式会社新川 実装装置および温度測定方法

Also Published As

Publication number Publication date
KR102386562B1 (ko) 2022-04-15
JP2023171669A (ja) 2023-12-01
JP7524441B2 (ja) 2024-07-29
JP2023171668A (ja) 2023-12-01
KR20210006857A (ko) 2021-01-19
JP2021013002A (ja) 2021-02-04
CN112218516A (zh) 2021-01-12
TWI764188B (zh) 2022-05-11
CN112218516B (zh) 2021-08-20
TW202103549A (zh) 2021-01-16

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