SG11201811522QA - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
SG11201811522QA
SG11201811522QA SG11201811522QA SG11201811522QA SG11201811522QA SG 11201811522Q A SG11201811522Q A SG 11201811522QA SG 11201811522Q A SG11201811522Q A SG 11201811522QA SG 11201811522Q A SG11201811522Q A SG 11201811522QA SG 11201811522Q A SG11201811522Q A SG 11201811522QA
Authority
SG
Singapore
Prior art keywords
bonding apparatus
bonding
Prior art date
Application number
SG11201811522QA
Inventor
Kohei Seyama
Yuji Eguchi
Shoji Wada
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201811522QA publication Critical patent/SG11201811522QA/en

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG11201811522QA 2016-03-24 2017-03-24 Bonding apparatus SG11201811522QA (en)

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KR102471274B1 (en) * 2018-02-13 2022-11-28 삼성전자주식회사 Stack Tool for reflow and Stack Apparatus having the Same
JP6691197B1 (en) * 2018-12-12 2020-04-28 エイチアンドセオン カンパニー リミテッドＨ＆ｃｅｏｎ ｃｏ．， ｌｔｄ． Heater assembly
TWI684525B (en) * 2019-05-31 2020-02-11 頂瑞機械股份有限公司 Vacuum pressing machine
JP7368962B2 (en) * 2019-07-09 2023-10-25 芝浦メカトロニクス株式会社 mounting equipment
TW202119533A (en) * 2019-11-04 2021-05-16 台灣愛司帝科技股份有限公司 Chip carrying structure having chip-absorbing function
US11410964B2 (en) * 2019-11-22 2022-08-09 Micron Technology, Inc. Contaminant control in thermocompression bonding of semiconductors and associated systems and methods
KR20210157200A (en) 2020-06-19 2021-12-28 삼성전자주식회사 Chip bonding apparatus
TWI790747B (en) * 2021-09-15 2023-01-21 日商新川股份有限公司 Substrate holder, bonding system, and bonding method
TWI790118B (en) * 2022-02-10 2023-01-11 友達光電股份有限公司 Bonding apparatus

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JP3509474B2 (en) * 1997-06-05 2004-03-22 松下電器産業株式会社 Bonding apparatus and bonding method for work with bump
JP3381565B2 (en) * 1997-07-29 2003-03-04 松下電器産業株式会社 Bonding method of work with bump
US6347734B1 (en) * 2000-03-27 2002-02-19 Emc Corporation Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
JP3791501B2 (en) * 2003-02-26 2006-06-28 セイコーエプソン株式会社 Circuit board, semiconductor device, semiconductor manufacturing apparatus, circuit board manufacturing method, and semiconductor device manufacturing method
US6943423B2 (en) 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
JP2008166527A (en) 2006-12-28 2008-07-17 Spansion Llc Semiconductor device, and manufacturing method thereof
JP5044319B2 (en) * 2007-07-20 2012-10-10 オンセミコンダクター・トレーディング・リミテッド Semiconductor device
JP4808283B1 (en) * 2010-06-30 2011-11-02 株式会社新川 Electronic component mounting apparatus and electronic component mounting method
US8651359B2 (en) * 2010-08-23 2014-02-18 International Business Machines Corporation Flip chip bonder head for forming a uniform fillet
JP2012146947A (en) * 2010-12-22 2012-08-02 Seiko Instruments Inc Optical device
JP2012199358A (en) 2011-03-22 2012-10-18 Nec Corp Chip heating head
JP2013098264A (en) * 2011-10-28 2013-05-20 Sekisui Chem Co Ltd Attachment for flip chip bonder
JP5793473B2 (en) * 2012-07-20 2015-10-14 株式会社新川 Heater for bonding apparatus and cooling method thereof
JP2015176906A (en) 2014-03-13 2015-10-05 株式会社東芝 Semiconductor device and method of manufacturing the same

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JPWO2017164385A1 (en) 2019-03-22
US20210225799A1 (en) 2021-07-22
CN109196629B (en) 2021-12-07
TW201739025A (en) 2017-11-01
JP6603401B2 (en) 2019-11-13
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US11508688B2 (en) 2022-11-22
CN109196629A (en) 2019-01-11

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