SG11201608267TA - Bonding device - Google Patents
Bonding deviceInfo
- Publication number
- SG11201608267TA SG11201608267TA SG11201608267TA SG11201608267TA SG11201608267TA SG 11201608267T A SG11201608267T A SG 11201608267TA SG 11201608267T A SG11201608267T A SG 11201608267TA SG 11201608267T A SG11201608267T A SG 11201608267TA SG 11201608267T A SG11201608267T A SG 11201608267TA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding device
- bonding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
- H01L2224/75651—Belt conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
- H01L2224/75804—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014041914A JP5912143B2 (en) | 2014-03-04 | 2014-03-04 | Bonding equipment |
PCT/JP2014/076151 WO2015132994A1 (en) | 2014-03-04 | 2014-09-30 | Bonding device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608267TA true SG11201608267TA (en) | 2016-11-29 |
Family
ID=54054820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608267TA SG11201608267TA (en) | 2014-03-04 | 2014-09-30 | Bonding device |
Country Status (7)
Country | Link |
---|---|
US (1) | US10361166B2 (en) |
JP (1) | JP5912143B2 (en) |
KR (1) | KR101835814B1 (en) |
CN (1) | CN106233442B (en) |
SG (1) | SG11201608267TA (en) |
TW (1) | TWI557818B (en) |
WO (1) | WO2015132994A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6694404B2 (en) * | 2017-03-17 | 2020-05-13 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
US10872873B2 (en) * | 2017-11-14 | 2020-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for bonding wafers and bonding tool |
TWI744850B (en) * | 2019-04-15 | 2021-11-01 | 日商新川股份有限公司 | Package device |
JP7454925B2 (en) | 2019-07-30 | 2024-03-25 | キヤノンマシナリー株式会社 | Drive device, die bonder, and bonding method |
JP7398896B2 (en) * | 2019-08-02 | 2023-12-15 | キヤノンマシナリー株式会社 | Drive device, die bonder, bonding method, and semiconductor device manufacturing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3800616B2 (en) * | 1994-06-27 | 2006-07-26 | 株式会社ニコン | Target moving device, positioning device, and movable stage device |
US6125630A (en) * | 1995-10-27 | 2000-10-03 | Tuff Torq Corporation | Axle driving apparatus |
JP2981999B1 (en) * | 1998-06-16 | 1999-11-22 | 株式会社新川 | Motor drive device and XY table in semiconductor manufacturing apparatus |
DE60136667D1 (en) | 2000-02-21 | 2009-01-08 | Sharp Kk | Precision carrier plate |
JP3481540B2 (en) * | 2000-02-21 | 2003-12-22 | シャープ株式会社 | Stage equipment |
JP5678415B2 (en) * | 2009-07-21 | 2015-03-04 | 株式会社リコー | Information processing apparatus, information processing apparatus utilization system, and processing condition editing method |
JP5431295B2 (en) * | 2010-11-26 | 2014-03-05 | 株式会社カイジョー | XY stage |
-
2014
- 2014-03-04 JP JP2014041914A patent/JP5912143B2/en active Active
- 2014-09-30 CN CN201480078159.3A patent/CN106233442B/en active Active
- 2014-09-30 SG SG11201608267TA patent/SG11201608267TA/en unknown
- 2014-09-30 KR KR1020167026410A patent/KR101835814B1/en active IP Right Grant
- 2014-09-30 WO PCT/JP2014/076151 patent/WO2015132994A1/en active Application Filing
- 2014-10-07 TW TW103134823A patent/TWI557818B/en active
-
2016
- 2016-09-01 US US15/255,111 patent/US10361166B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10361166B2 (en) | 2019-07-23 |
JP2015170612A (en) | 2015-09-28 |
TW201535546A (en) | 2015-09-16 |
US20170053889A1 (en) | 2017-02-23 |
JP5912143B2 (en) | 2016-04-27 |
TWI557818B (en) | 2016-11-11 |
CN106233442B (en) | 2019-09-06 |
WO2015132994A1 (en) | 2015-09-11 |
KR20160127073A (en) | 2016-11-02 |
KR101835814B1 (en) | 2018-03-08 |
CN106233442A (en) | 2016-12-14 |
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