JP7353595B2 - 難燃性ポリアミド組成物 - Google Patents

難燃性ポリアミド組成物 Download PDF

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Publication number
JP7353595B2
JP7353595B2 JP2020516673A JP2020516673A JP7353595B2 JP 7353595 B2 JP7353595 B2 JP 7353595B2 JP 2020516673 A JP2020516673 A JP 2020516673A JP 2020516673 A JP2020516673 A JP 2020516673A JP 7353595 B2 JP7353595 B2 JP 7353595B2
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ions
weight percent
polyamide composition
lubricant
polyamide
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JP2020535249A (ja
JP2020535249A5 (cg-RX-API-DMAC10.html
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マシュー アンナクッティ
雅裕 野崎
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デュポン ポリマーズ インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020516673A 2017-09-21 2018-08-30 難燃性ポリアミド組成物 Active JP7353595B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762561337P 2017-09-21 2017-09-21
US62/561,337 2017-09-21
PCT/US2018/048692 WO2019060117A1 (en) 2017-09-21 2018-08-30 FLAME RETARDANT POLYAMIDE COMPOSITIONS

Publications (3)

Publication Number Publication Date
JP2020535249A JP2020535249A (ja) 2020-12-03
JP2020535249A5 JP2020535249A5 (cg-RX-API-DMAC10.html) 2021-09-24
JP7353595B2 true JP7353595B2 (ja) 2023-10-02

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JP2020516673A Active JP7353595B2 (ja) 2017-09-21 2018-08-30 難燃性ポリアミド組成物

Country Status (5)

Country Link
US (1) US12152108B2 (cg-RX-API-DMAC10.html)
EP (2) EP4219594A3 (cg-RX-API-DMAC10.html)
JP (1) JP7353595B2 (cg-RX-API-DMAC10.html)
CN (1) CN111108143B (cg-RX-API-DMAC10.html)
WO (1) WO2019060117A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7310080B2 (ja) * 2019-04-09 2023-07-19 グローバルポリアセタール株式会社 樹脂組成物および成形品
JP2020172580A (ja) * 2019-04-09 2020-10-22 三菱エンジニアリングプラスチックス株式会社 樹脂組成物および成形品
EP4143254A1 (en) 2020-04-29 2023-03-08 Dupont Polymers, Inc. Polyamide compositions
WO2023060590A1 (zh) * 2021-10-15 2023-04-20 中国科学院宁波材料技术与工程研究所 二烷基次膦酸杂化盐及其制备方法、应用
KR20250073657A (ko) * 2022-09-23 2025-05-27 바스프 에스이 절연 필름
US20250304789A1 (en) * 2024-04-01 2025-10-02 Celanese Polymers Holding, Inc. Polymer Composition for Contact with Cooling Fluids

Citations (6)

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JP2007254613A (ja) 2006-03-23 2007-10-04 Toray Ind Inc ポリアミド樹脂組成物およびそれからなる成形品
WO2008126381A1 (ja) 2007-03-30 2008-10-23 Mitsui Chemicals, Inc. 難燃性ポリアミド組成物
JP2016050247A (ja) 2014-08-29 2016-04-11 三井化学株式会社 難燃性ポリアミド樹脂組成物およびその成形体
JP2017025298A (ja) 2010-10-09 2017-02-02 クラリアント・ファイナンス・(ビーブイアイ)・リミテッド 熱可塑性ポリマーのための難燃剤−安定化剤の組み合わせ
CN106751807A (zh) 2017-01-09 2017-05-31 广东中塑新材料有限公司 高导热绝缘共聚酰胺6t复合材料及其制备方法
CN106751800A (zh) 2016-12-05 2017-05-31 广东中塑新材料有限公司 激光直接成型共聚酰胺6t复合材料及其制备方法

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GB2170593B (en) 1985-02-01 1988-09-14 Central Electr Generat Board Temperature measurement
EP0196194B1 (en) 1985-03-23 1989-12-27 Nitto Boseki Co., Ltd. Glass fiber strand and method of producing the same
US4749736A (en) * 1986-10-20 1988-06-07 Allied Corporation Nucleating system for polyamides
US6140459A (en) * 1996-08-29 2000-10-31 E. I. Du Pont De Nemours And Company Semi-crystalline, semi-aromatic copolymers with superior post-molding shrinkage and balance of mechanical performance
JP3707584B2 (ja) * 1997-06-26 2005-10-19 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物
US7294661B2 (en) 2003-10-03 2007-11-13 E.I. Du Pont De Nemours And Company Flame resistant aromatic polyamide resin composition and articles therefrom
CN101679663B (zh) * 2007-06-22 2012-07-18 钟渊化学工业株式会社 具有防静电性能的聚烯烃系树脂预发泡粒子以及由其得到的成形体
US20090030124A1 (en) 2007-07-06 2009-01-29 Yige Yin Flame resistant semiaromatic polyamide resin composition and articles therefrom
JP5319901B2 (ja) * 2007-09-07 2013-10-16 三菱樹脂株式会社 耐熱性樹脂組成物
US20100249292A1 (en) 2009-03-30 2010-09-30 E. I. Du Pont De Nemours And Company Flame resistant semicaromatic polyamide resin composition and articles therefrom
CN102459444A (zh) * 2009-06-05 2012-05-16 Ems专利股份公司 阻燃半芳族聚酰胺模塑组合物
US20110028628A1 (en) 2009-07-30 2011-02-03 E.I. Du Pont De Nemours And Company Heat resistant polyamide compositions having high amine ends
US20130281589A1 (en) * 2012-04-23 2013-10-24 E I Du Pont De Nemours And Company Thermoplastic polyamide composition
EP2746341B2 (de) * 2012-12-21 2018-11-14 Ems-Patent Ag Schmutzabweisende Artikel und ihre Verwendung
US9631070B2 (en) * 2013-05-08 2017-04-25 Ems-Patent Ag Filler materials having surface coating made from water soluble polyamides
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EP2886605B2 (de) * 2013-12-20 2021-09-01 Ems-Chemie Ag Kunststoffformmasse und deren Verwendung
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CN107325324B (zh) * 2016-04-28 2019-08-20 中国石油化工股份有限公司 阻燃剂、阻燃防静电组合物和阻燃防静电聚丙烯发泡珠粒

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2007254613A (ja) 2006-03-23 2007-10-04 Toray Ind Inc ポリアミド樹脂組成物およびそれからなる成形品
WO2008126381A1 (ja) 2007-03-30 2008-10-23 Mitsui Chemicals, Inc. 難燃性ポリアミド組成物
JP2017025298A (ja) 2010-10-09 2017-02-02 クラリアント・ファイナンス・(ビーブイアイ)・リミテッド 熱可塑性ポリマーのための難燃剤−安定化剤の組み合わせ
JP2016050247A (ja) 2014-08-29 2016-04-11 三井化学株式会社 難燃性ポリアミド樹脂組成物およびその成形体
CN106751800A (zh) 2016-12-05 2017-05-31 广东中塑新材料有限公司 激光直接成型共聚酰胺6t复合材料及其制备方法
CN106751807A (zh) 2017-01-09 2017-05-31 广东中塑新材料有限公司 高导热绝缘共聚酰胺6t复合材料及其制备方法

Also Published As

Publication number Publication date
EP3684839B1 (en) 2023-01-25
CN111108143B (zh) 2023-05-30
EP3684839A1 (en) 2020-07-29
JP2020535249A (ja) 2020-12-03
CN111108143A (zh) 2020-05-05
WO2019060117A1 (en) 2019-03-28
US12152108B2 (en) 2024-11-26
EP4219594A3 (en) 2023-08-30
EP4219594A2 (en) 2023-08-02
US20200247951A1 (en) 2020-08-06

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