JP7343941B2 - 超音波複合振動装置および半導体装置の製造装置 - Google Patents
超音波複合振動装置および半導体装置の製造装置 Download PDFInfo
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- JP7343941B2 JP7343941B2 JP2022563239A JP2022563239A JP7343941B2 JP 7343941 B2 JP7343941 B2 JP 7343941B2 JP 2022563239 A JP2022563239 A JP 2022563239A JP 2022563239 A JP2022563239 A JP 2022563239A JP 7343941 B2 JP7343941 B2 JP 7343941B2
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- Prior art keywords
- vibration
- ultrasonic
- vibration device
- torsional vibration
- distal end
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Description
Claims (4)
- 超音波複合振動装置であって、
縦振動および捩り振動を発生させる振動子を有した基端部と、
前記基端部より大きな断面積を有する拡大部と、前記拡大部より小さな断面積を有する先端部と、が基端側から先端側に向かって直線状に並んでおり、
前記拡大部に、前記捩り振動の節が位置し、前記超音波複合振動装置の基端面および先端面に、前記縦振動の腹および前記捩り振動の腹が位置し、
前記拡大部の軸方向位置および軸方向寸法は、前記縦振動の共振周波数と、前記捩り振動の共振周波数が、ほぼ同じとなる位置および寸法に設定されている、
ことを特徴とする超音波複合振動装置。 - 請求項1に記載の超音波複合振動装置であって、
前記拡大部の前記先端側の端面から前記先端部の前記先端側端面までの軸方向寸法が、前記捩り振動の1/4波長の奇数倍である、ことを特徴とする請求項1記載の超音波複合振動装置。 - 請求項1または2に記載の超音波複合振動装置であって、
前記先端部には、軸方向に進むにつれて周方向にも進む傾斜状のスリットが形成されている、ことを特徴とする超音波複合振動装置。 - 請求項1から3のいずれか1項に記載の超音波複合振動装置と、
前記先端部に取り付けられ、ワイヤが挿通されるキャピラリと、
を備え、前記振動子を、前記縦振動の共振周波数および前記捩り振動の共振周波数とほぼ同じ駆動周波数で駆動する、
ことを特徴とする半導体装置の製造装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/023117 WO2022264386A1 (ja) | 2021-06-17 | 2021-06-17 | 超音波複合振動装置および半導体装置の製造装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022264386A1 JPWO2022264386A1 (ja) | 2022-12-22 |
JPWO2022264386A5 JPWO2022264386A5 (ja) | 2023-05-31 |
JP7343941B2 true JP7343941B2 (ja) | 2023-09-13 |
Family
ID=84526958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022563239A Active JP7343941B2 (ja) | 2021-06-17 | 2021-06-17 | 超音波複合振動装置および半導体装置の製造装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7343941B2 (ja) |
KR (1) | KR20230057390A (ja) |
CN (1) | CN115707330A (ja) |
WO (1) | WO2022264386A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3073207B2 (ja) | 1989-08-02 | 2000-08-07 | 沖電気工業株式会社 | プラズマ処理方法 |
JP2001239405A (ja) | 2000-02-24 | 2001-09-04 | Fuji Kogyo Kk | 超音波加工用ねじり振動装置 |
JP2003152012A (ja) | 2001-11-12 | 2003-05-23 | Shinkawa Ltd | ワイヤボンデイング装置 |
JP2004283792A (ja) | 2003-03-25 | 2004-10-14 | Asahi Ems Co Ltd | 超音波複合振動体の駆動方法 |
JP2005288351A (ja) | 2004-03-31 | 2005-10-20 | Asahi Ems Co Ltd | 超音波複合振動体とその振動体の形成方法 |
JP2007129181A (ja) | 2005-10-07 | 2007-05-24 | Shinkawa Ltd | 超音波ホーン |
JP2010010510A (ja) | 2008-06-30 | 2010-01-14 | Shinkawa Ltd | ボンディング装置 |
JP2018149598A (ja) | 2018-03-27 | 2018-09-27 | 辻野 次郎丸 | 超音波複合振動加工装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0373207A (ja) * | 1989-08-15 | 1991-03-28 | Taga Electric Co Ltd | 超音波回転加工装置 |
JP3550578B2 (ja) * | 1995-09-19 | 2004-08-04 | 株式会社ニコン | 振動アクチュエータ |
JP3550579B2 (ja) * | 1995-09-20 | 2004-08-04 | 株式会社ニコン | 振動アクチュエータ |
-
2021
- 2021-06-17 JP JP2022563239A patent/JP7343941B2/ja active Active
- 2021-06-17 CN CN202180039541.3A patent/CN115707330A/zh active Pending
- 2021-06-17 WO PCT/JP2021/023117 patent/WO2022264386A1/ja active Application Filing
- 2021-06-17 KR KR1020237009362A patent/KR20230057390A/ko active Search and Examination
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3073207B2 (ja) | 1989-08-02 | 2000-08-07 | 沖電気工業株式会社 | プラズマ処理方法 |
JP2001239405A (ja) | 2000-02-24 | 2001-09-04 | Fuji Kogyo Kk | 超音波加工用ねじり振動装置 |
JP2003152012A (ja) | 2001-11-12 | 2003-05-23 | Shinkawa Ltd | ワイヤボンデイング装置 |
JP2004283792A (ja) | 2003-03-25 | 2004-10-14 | Asahi Ems Co Ltd | 超音波複合振動体の駆動方法 |
JP2005288351A (ja) | 2004-03-31 | 2005-10-20 | Asahi Ems Co Ltd | 超音波複合振動体とその振動体の形成方法 |
JP2007129181A (ja) | 2005-10-07 | 2007-05-24 | Shinkawa Ltd | 超音波ホーン |
JP2010010510A (ja) | 2008-06-30 | 2010-01-14 | Shinkawa Ltd | ボンディング装置 |
JP2018149598A (ja) | 2018-03-27 | 2018-09-27 | 辻野 次郎丸 | 超音波複合振動加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN115707330A (zh) | 2023-02-17 |
KR20230057390A (ko) | 2023-04-28 |
JPWO2022264386A1 (ja) | 2022-12-22 |
WO2022264386A1 (ja) | 2022-12-22 |
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