KR0139403B1 - 초음파 와이어 본딩장치 및 본딩방법 - Google Patents

초음파 와이어 본딩장치 및 본딩방법

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KR0139403B1
KR0139403B1 KR1019930021663A KR930021663A KR0139403B1 KR 0139403 B1 KR0139403 B1 KR 0139403B1 KR 1019930021663 A KR1019930021663 A KR 1019930021663A KR 930021663 A KR930021663 A KR 930021663A KR 0139403 B1 KR0139403 B1 KR 0139403B1
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ultrasonic
horn
capillary
bonding
vibrator
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KR1019930021663A
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KR940010178A (ko
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마코토 모리타
마사루 나가이케
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모리사타 요이찌
마쯔시다멘기산교가부시기가이샤
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Publication of KR940010178A publication Critical patent/KR940010178A/ko
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  • Wire Bonding (AREA)

Abstract

본 발명은, 리드와이어를 리드프레임에 본딩하는 장치에 있어서 베어칩이 손상하기 때문에 본딩가능범위를 확대할 수 없다고 하는 문제를 해결하는 것으로써 초음파비틀림진동자를 장착한 세로형 호온을 구비한 초음파와이어 본딩장치 및 본딩방법을 제공하는 것을 목적으로하며, 그 구성에 있어서, 초음파비틀림진동자(7)를, 초음파비틀림진동자(7)의 비틀림중심선으로부터 오프셋해서 장착된 모세관(2)을 가진 세로형호온(8)에 장착한 구성으로하므로서, 호온과 작업대가 간섭하는 일이 없게 되어, 본딩가능범위를 확대하고, 호온을 세로형으로 하므로서, 호온의 휨발생이 없어지게 되어, 베어칩이 손상되는 일없는 고정밀도의 본딩을 행할 수 있는 초음파와이어 본딩장치를 실현할 수 있다.

Description

초음파와이어 본딩장치 및 본딩방법
제 1도는 본 발명의 제 1의 실시예에 있어서의 초음파와이어본딩장치의 구성도
제 2도는 제 1의 실시예에 있어서의 장치의 동작설명을 위한 요부구성도
제 3도는 제 1의 실시예에 있어서의 진폭확대율변경방법 설명을 위한 요부구성도
제 4도는 종래의 초음파와이어본딩장치의 구성도
*도면의 주요부분에 대한 부호의 설명
1 : 호온 2 : 모세관
3 : 작업대 4 : 베어칩
5 : 리드프레임 6 : 리드와이어
7 : 초음파비틀림진동자 8 : 세로형호온
9 : 플레이트 10 : 본딩헤드
11 : 라이너로보트 12 : 초음파와이어본딩장치
13 : 비틀림중심축으로부터의 오프셋
본 발명은 모세관을 초음파진동시켜서 와이어본딩을 행하는 초음파와이어본딩장치 및 본딩방법에 관한 것이다.
종래의 세로진동을 사용한 초음파와이어본딩장치는 제 4도에 표시한바와 같이, 세로진동하는 호온(1)에 모세관(2)을 수직으로 고정하고, 작업대(3)에 재치한베어칩(4)과 리드프레임(5)을 리드와이어(6)에 모세관(2)을 미소압으로 압압하고, 호온(1)에 세로진동의 초음파진동을 부여하면서, 베어칩(4)과 리드프레임(5)을 리드와이어(6)에 의해 본딩한다.
그러나 상기의 종래의 구성에서는 호온(1)과 작업대(3)가 간섭하기 때문에 본딩가능한 작업대(3)의 사이즈가, 호온(1)의 길이에 따라 결정되고 있다. 이에 의해, 본딩가능범위를 넓히기 위해, 호온의 길이를 길게하면, 호온에 휨이 발생, 호온에 상하방향의 진동이 발생되고, 베어칩이 손상되기 때문에 본딩가능범위를 넓힐 수 없다고 하는 문제점을 가지고 있었다.
본 발명은 상기 종래의 문제점을 해결하는 것으로, 초음파비틀림진동자를 장착한 세로형호온을 구비한 초음파와이어본딩장치 및 본딩방법을 제공하는 것을 목적으로 한다.
초음파와이어본딩장치는, 초음파비틀림진동자의 비틀림중심선으로부터 오프셋해서 장착된 모세관을 가진 세로형호온에 장착된 구성을 하고 있다.
상기 구성에 의해서, 호온을 세로놓기구조로 하므로서, 호온과 작업대의 간섭을 없게해서 본딩가능범위를 확대할 수 있다.
이하 본 발명의 일실시예에 대해서, 도면을 참조하면서 설명한다.
제 1도, 제 2도에 있어서, (7)은 초음파비틀림진동자, (8)은 세로형 호온, (9)는 모세관(2)을 지지하는 플레이트, (10)은 본딩헤드, (11)은 본딩유닛을 이동하는 라이너로보트, (12)는 초음파와이어본딩장치, (13)은 세로형호온의 비틀림중 심축으로부터의 오프셋이다.
이상과 같이 구성된 초음파와이어본딩장치(12)에 대해서, 제 1도, 제 2도, 제 3도를 사용해서 그 동작을 설명한다. 먼저, 라이너로보트(11)가 이동함으로써, 본딩헤드(10)가, 작업대(3)위의 베어칩(4)과 리드프레임(5)에 세로형호온(8)의 비틀림중심축으로부터 오프셋(13)된 위치에 플레이트(9)에 의해 장착된 모세관(2)을 미소압으로 압압하고, 세로형호온(8)에 모세관(2)이 그 둘레면위에서의 진폭 약 5㎛의 초음파μ비틀림진동을 부여하면서, 베어칩(4)과 리드프레임(5)을 리드와이어(6)에 의해 본딩한다.
세로형 호온(8)의 선단의 플레이트에 장착된 모세관(2)의 비틀림중심축으로부터의 오프셋(13)을 변경함으로서, 호온을 교환하는 일없이 진폭의 확대율을 용이하게 변경할 수 있다.
이상과 같이 본 실시예에 의하면, 초음파비틀림진동자를, 초음파비틀림진동자의 비틀림중심축으로부터 오프셋해서 장착된 모세관을 가진 세로형 호온에 장착한 구성으로하므로서, 호온과 작업대가 간섭하는 일이 없기 때문에, 본딩가능범위를 확대할 수 있다. 또, 호온을 세로형으로 하므로서, 호온에 휨이 발생되는 일이 없어지게 되어, 베어칩이 손상되는 일이 없는 고정밀도의 본딩을 행할 수 있다.
모세관을 세로형호온선단의 플레이트에 장착하는 구조로하므로서, 모세관을 장착하는 플레이트의 오프셋량을 변경하므로서 진동의 확대율을 호온을 변경하는 일없이 행할 수 있다.
이상과 같이 본 발명은, 초음파비틀림진동자를, 초음파비틀림진동자의 비틀림 중심선으로부터 오프셋해서 장착된 모세관을 가진 세로형호온에 장착한 구성으로 하므로서, 호온과 작업대가 간섭하는 일이 없게되어, 본딩가능범위를 확대하고, 베어칩이 손상되는 일없이, 고정밀도의 본딩을 행할 수 있는 뛰어난 초음파와이어본딩장치 및 본딩방법을 실현할 수 있는 것이다.

Claims (4)

  1. 리드프레임에 리드와이어를 본딩하는 초음파와이어 본딩장치에 있어서, 모세관과, 상기 모세관지지부재와, 상기 모세관지지부재에 수직으로 배열되어 접속되고, 반대 방향으로 초음파비틀림진동을 발생해서 상기 진동을 상기 모세관지지부재를 개재해서 모세관에 가하는 진동자를 구비하고, 상기 진동자는, 환형상으로 배열되어 반대방향으로 초음파비틀림진동을 발생하고 기둥부재를 개재해서 서로 겹쳐있는 2개의 압전 트랜스듀서를 가진 것을 특징으로 하는 초음파와이어 본딩장치.
  2. 제 1항에 있어서,또, 상기 모세관과 상기 진동자 사이에 배설된 호온을 구비한 것을 특징으로 하는 초음파와이어 본딩장치.
  3. 제 1항에 있어서, 상기 모세관지지부재는 상기 진동자에 분리가능하게 부착되어 있는 것을 특징으로 하는 초음파와이어 본딩장치.
  4. 리드프레임에 기판의 리드와이어를 본딩하는 방법에 있어서, 토오치(torch)에 의해 전기방전을 발생하는 단계와, 모세관에 의해 지지된 와이어의 하단부에 보올(ball)을 형성하는 단계와, 기판위에서 원호궤적으로 모세관을 이동시켜서, 상기 모세관에 수직으로 배열되어 접속되고 반대방향으로 초음파비틀림진동을 발생해서 상기 진동을 상기 모세관에 가하는 진동자에 의해 반대방향으로 발생한 초음파비틀림진동에 의해서 본딩하는 단계로 이루어지고, 상기 진동자는, 환형상으로 배열되어 반대방향으로 초음파비틀림진동을 발생하고 기둥부재를 개재해서 서로 겹쳐있는 2개의 압전트랜스듀서를 가진 것을 특징으로 하는 초음파와이어 본딩방법.
KR1019930021663A 1992-10-26 1993-10-19 초음파 와이어 본딩장치 및 본딩방법 KR0139403B1 (ko)

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