KR100571306B1 - 초음파 트랜스듀서 조립체 - Google Patents
초음파 트랜스듀서 조립체 Download PDFInfo
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- KR100571306B1 KR100571306B1 KR1020040040211A KR20040040211A KR100571306B1 KR 100571306 B1 KR100571306 B1 KR 100571306B1 KR 1020040040211 A KR1020040040211 A KR 1020040040211A KR 20040040211 A KR20040040211 A KR 20040040211A KR 100571306 B1 KR100571306 B1 KR 100571306B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
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- B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
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- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract
Description
Claims (27)
- 제 1 초음파 발생 수단과 제 2 초음파 발생 수단 사이에 고정된 증폭 호른(amplifying horn)에 장착되는 본딩 공구를 포함하는 본딩 장치용 트랜스듀서.
- 제 1 항에 있어서, 상기 제 1 및 제 2 초음파 발생 수단 각각은 압전 소자들로 이루어진 적층체를 포함하는 본딩 장치용 트랜스듀서.
- 제 2 항에 있어서, 상기 각각의 적층체는 동일한 수의 압전 소자들을 포함하는 본딩 장치용 트랜스듀서.
- 제 2 항에 있어서, 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체의 극성 방향들은 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체가 반대 방향들로 여자될 수 있도록 배열되는 본딩 장치용 트랜스듀서.
- 제 4 항에 있어서, 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체에 전기장을 가하기 위한 단일의 전기 공급원을 포함하는 본딩 장치용 트랜스듀서.
- 제 2 항에 있어서, 상기 압전 소자들로 이루어진 각각의 적층체는 체결 장치에 의해 후방 질량체와 함께 상기 증폭 호른에 고정되는 본딩 장치용 트랜스듀서.
- 제 1 항에 있어서, 상기 트랜스듀서를 본딩 장치에 장착할 수 있는 장착 디바이스를 포함하는 본딩 장치용 트랜스듀서.
- 제 7 항에 있어서, 상기 제 1 및 제 2 초음파 발생 수단을 장착할 수 있도록 상기 장착 디바이스에 연결되는 제 1 및 제 2 장착 지지부를 포함하는 본딩 장치용 트랜스듀서.
- 제 8 항에 있어서, 상기 트랜스듀서는 상기 트랜스듀서의 진동 마디점(nodal point)들에서 상기 장착 지지부들에 장착될 수 있는 본딩 장치용 트랜스듀서.
- 제 8 항에 있어서, 상기 본딩 공구는 상기 제 1 장착 지지부와 상기 제 2 장착 지지부 사이에서 거의 중심에 위치되는 본딩 장치용 트랜스듀서.
- 제 7 항에 있어서, 상기 장착 디바이스는 상기 트랜스듀서를 회전 축선을 중심으로 회전시키도록 작동하는 본딩 장치용 트랜스듀서.
- 제 11 항에 있어서, 상기 회전 축선은 실질적으로 상기 본딩 공구의 종방향 축선에 정렬되는 본딩 장치용 트랜스듀서.
- 제 1 항에 있어서, 상기 증폭 호른은 실질적으로 양-원추형(bi-conical) 호른인 본딩 장치용 트랜스듀서.
- 제 1 항에 있어서, 상기 본딩 공구는 상기 트랜스듀서의 각각의 단부 사이에서 거의 중심에 장착되는 본딩 장치용 트랜스듀서.
- 제 14 항에 있어서, 상기 본딩 공구와 상기 트랜스듀서의 각각의 단부 사이의 거리는 상기 트랜스듀서의 진동 파장의 절반과 동일한 거리인 본딩 장치용 트랜스듀서.
- 제 14 항에 있어서, 상기 본딩 공구의 종방향 축선은 실질적으로 상기 트랜스듀서의 축선에 대해 수직한 본딩 장치용 트랜스듀서.
- 증폭 호른을 제공하는 단계,상기 증폭 호른이 제 1 및 제 2 초음파 발생 수단 사이에 위치되도록 상기 제 1 초음파 발생 수단과 제 2 초음파 발생 수단을 상기 증폭 호른에 고정시키는 단계, 및본딩 공구를 상기 증폭 호른에 장착하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 17 항에 있어서, 상기 제 1 및 제 2 초음파 발생 수단 각각은 압전 소자들로 이루어진 적층체를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 18 항에 있어서, 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체가 반대 방향들로 여자될 수 있도록 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체의 극성 방향들을 배열하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 19 항에 있어서, 단일의 전기 공급원을 사용하여 상기 압전 소자들로 이루어진 제 1 및 제 2 적층체에 전기장을 가하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 17 항에 있어서, 제 1 및 제 2 장착 지지부를 갖는 장착 디바이스를 통해 상기 트랜스듀서를 본딩 장치에 장착하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 21 항에 있어서, 상기 트랜스듀서 장착시에 상기 장착 지지부들을 상기 트랜스듀서의 진동 마디점들에 위치시키는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 21 항에 있어서, 상기 제 1 장착 지지부와 상기 제 2 장착 지지부 사이의 거의 중심에 상기 본딩 공구를 위치시키는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 21 항에 있어서, 상기 트랜스듀서의 각각의 단부 사이의 거의 중심에 상기 본딩 공구를 장착하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 24 항에 있어서, 상기 본딩 공구의 종방향 축선을 실질적으로 상기 트랜스듀서의 축선에 수직하게 정렬시키는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 25 항에 있어서, 상기 정렬 단계는 상기 초음파 발생 수단과 장착 지지부들을 고정한 후에 실질적으로 상기 트랜스듀서의 축선에 수직한, 상기 본딩 공구 장착용 구멍을 상기 증폭 호른 내에 천공하는 단계를 포함하는 본딩 장치용 트랜스듀서 형성 방법.
- 제 17 항에 있어서, 상기 증폭 호른은 실질적으로 양-원추형 호른인 본딩 장치용 트랜스듀서 형성 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/454,418 US7002283B2 (en) | 2003-06-03 | 2003-06-03 | Ultrasonic transducer assembly |
US10/454,418 | 2003-06-03 |
Publications (2)
Publication Number | Publication Date |
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KR20040104424A KR20040104424A (ko) | 2004-12-10 |
KR100571306B1 true KR100571306B1 (ko) | 2006-04-17 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020040040211A KR100571306B1 (ko) | 2003-06-03 | 2004-06-03 | 초음파 트랜스듀서 조립체 |
Country Status (6)
Country | Link |
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US (1) | US7002283B2 (ko) |
JP (1) | JP2004363612A (ko) |
KR (1) | KR100571306B1 (ko) |
CN (1) | CN100457295C (ko) |
MY (1) | MY135129A (ko) |
TW (1) | TWI307539B (ko) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
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US8182501B2 (en) | 2004-02-27 | 2012-05-22 | Ethicon Endo-Surgery, Inc. | Ultrasonic surgical shears and method for sealing a blood vessel using same |
US8057467B2 (en) | 2004-10-08 | 2011-11-15 | Ethicon Endo-Surgery, Inc. | Clamp mechanism for use with an ultrasonic surgical instrument |
US7156201B2 (en) * | 2004-11-04 | 2007-01-02 | Advanced Ultrasonic Solutions, Inc. | Ultrasonic rod waveguide-radiator |
JP4657964B2 (ja) * | 2005-10-07 | 2011-03-23 | 株式会社新川 | 超音波ホーン |
US20070191713A1 (en) | 2005-10-14 | 2007-08-16 | Eichmann Stephen E | Ultrasonic device for cutting and coagulating |
US8152825B2 (en) * | 2005-10-14 | 2012-04-10 | Ethicon Endo-Surgery, Inc. | Medical ultrasound system and handpiece and methods for making and tuning |
US7621930B2 (en) | 2006-01-20 | 2009-11-24 | Ethicon Endo-Surgery, Inc. | Ultrasound medical instrument having a medical ultrasonic blade |
US7757926B2 (en) * | 2006-02-28 | 2010-07-20 | Asm Assembly Automation Ltd | Transducer assembly for a bonding apparatus |
US8057498B2 (en) | 2007-11-30 | 2011-11-15 | Ethicon Endo-Surgery, Inc. | Ultrasonic surgical instrument blades |
US8911460B2 (en) | 2007-03-22 | 2014-12-16 | Ethicon Endo-Surgery, Inc. | Ultrasonic surgical instruments |
US8808319B2 (en) | 2007-07-27 | 2014-08-19 | Ethicon Endo-Surgery, Inc. | Surgical instruments |
US8523889B2 (en) | 2007-07-27 | 2013-09-03 | Ethicon Endo-Surgery, Inc. | Ultrasonic end effectors with increased active length |
US8430898B2 (en) | 2007-07-31 | 2013-04-30 | Ethicon Endo-Surgery, Inc. | Ultrasonic surgical instruments |
US9044261B2 (en) | 2007-07-31 | 2015-06-02 | Ethicon Endo-Surgery, Inc. | Temperature controlled ultrasonic surgical instruments |
US8512365B2 (en) | 2007-07-31 | 2013-08-20 | Ethicon Endo-Surgery, Inc. | Surgical instruments |
WO2009046234A2 (en) | 2007-10-05 | 2009-04-09 | Ethicon Endo-Surgery, Inc | Ergonomic surgical instruments |
CN101820825A (zh) * | 2007-10-10 | 2010-09-01 | 伊西康内外科公司 | 用于切割和凝固的超声装置 |
US10010339B2 (en) | 2007-11-30 | 2018-07-03 | Ethicon Llc | Ultrasonic surgical blades |
US8650728B2 (en) | 2009-06-24 | 2014-02-18 | Ethicon Endo-Surgery, Inc. | Method of assembling a transducer for a surgical instrument |
CN104465422B (zh) | 2009-08-12 | 2017-06-06 | 库利克和索夫工业公司 | 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 |
US8486096B2 (en) | 2010-02-11 | 2013-07-16 | Ethicon Endo-Surgery, Inc. | Dual purpose surgical instrument for cutting and coagulating tissue |
US8951272B2 (en) | 2010-02-11 | 2015-02-10 | Ethicon Endo-Surgery, Inc. | Seal arrangements for ultrasonically powered surgical instruments |
EP2457683A1 (de) * | 2010-11-25 | 2012-05-30 | Telsonic Holding AG | Torsionales Schweissen |
DE102011008576A1 (de) * | 2011-01-11 | 2012-07-12 | Devad Gmbh | Verfahren und Vorrichtung zur Erzeugung einer schwingenden Bewegung einer Masse |
US9820768B2 (en) | 2012-06-29 | 2017-11-21 | Ethicon Llc | Ultrasonic surgical instruments with control mechanisms |
JP5583179B2 (ja) * | 2012-08-03 | 2014-09-03 | 株式会社カイジョー | ボンディング装置 |
DE102012215994A1 (de) * | 2012-09-10 | 2014-03-13 | Weber Ultrasonics Gmbh | Verfahren und Schaltungsanordnung zum Bestimmen eines Arbeitsbereichs eines Ultraschall-Schwinggebildes |
US10226273B2 (en) | 2013-03-14 | 2019-03-12 | Ethicon Llc | Mechanical fasteners for use with surgical energy devices |
GB2521229A (en) | 2013-12-16 | 2015-06-17 | Ethicon Endo Surgery Inc | Medical device |
CN104051281B (zh) * | 2014-06-13 | 2016-08-31 | 武汉理工大学 | 超声波振动辅助倒装芯片塑封成型下填充装置及方法 |
US11020140B2 (en) | 2015-06-17 | 2021-06-01 | Cilag Gmbh International | Ultrasonic surgical blade for use with ultrasonic surgical instruments |
US10357303B2 (en) | 2015-06-30 | 2019-07-23 | Ethicon Llc | Translatable outer tube for sealing using shielded lap chole dissector |
WO2017000998A1 (de) * | 2015-06-30 | 2017-01-05 | Telsonic Holding Ag | Vorrichtung zum verschweissen von bauteilen mittels ultraschalls durch torsionschwingungen |
US10245064B2 (en) | 2016-07-12 | 2019-04-02 | Ethicon Llc | Ultrasonic surgical instrument with piezoelectric central lumen transducer |
USD847990S1 (en) | 2016-08-16 | 2019-05-07 | Ethicon Llc | Surgical instrument |
US11350959B2 (en) | 2016-08-25 | 2022-06-07 | Cilag Gmbh International | Ultrasonic transducer techniques for ultrasonic surgical instrument |
US10952759B2 (en) | 2016-08-25 | 2021-03-23 | Ethicon Llc | Tissue loading of a surgical instrument |
CN106298598A (zh) * | 2016-11-04 | 2017-01-04 | 哈尔滨工业大学深圳研究生院 | 高强度无偏角的芯片倒装键合换能器 |
CN112427281B (zh) * | 2020-09-18 | 2022-05-24 | 集美大学 | 一种复频超声振动加工装置 |
CN113523532A (zh) * | 2021-09-09 | 2021-10-22 | 丰县远博电动车有限公司 | 新能源机车电池极柱焊接机工装 |
CN114388407B (zh) * | 2021-12-24 | 2023-02-17 | 凌波微步半导体设备(常熟)有限公司 | 一种键合头装置及键合机 |
CN114309840B (zh) * | 2022-01-18 | 2023-08-29 | 苏州科技大学 | 一种超声振动辅助电火花倒锥微孔加工装置及其控制方法 |
CN114769693B (zh) * | 2022-04-26 | 2023-12-19 | 南京工程学院 | 一种用于超声辅助铣削的扭振刀具平台及其测试系统 |
CN114857971B (zh) * | 2022-04-29 | 2023-03-21 | 南京航空航天大学 | 一种多级频率超声振动脉动热管装置及其运行工艺 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3561462A (en) * | 1969-10-10 | 1971-02-09 | Branson Instr | Ultrasonic drive assembly for machine tool |
US3619671A (en) * | 1969-12-29 | 1971-11-09 | Branson Instr | Transducer for ultrasonic machine tool |
US3708745A (en) * | 1970-11-12 | 1973-01-02 | Trustees Of The Ohio State Uni | System for measuring output power of a resonant piezoelectric electromechanical transducer |
US4193009A (en) * | 1976-01-26 | 1980-03-11 | Durley Benton A Iii | Ultrasonic piezoelectric transducer using a rubber mounting |
JPS58196874A (ja) * | 1982-05-12 | 1983-11-16 | 多賀電気株式会社 | 超音波処理装置 |
JPS60255301A (ja) * | 1984-05-30 | 1985-12-17 | Taga Denki Kk | 角板形正方共振体共振装置 |
FR2671743B1 (fr) * | 1991-01-17 | 1993-06-18 | Duburque Dominique | Dispositif de mise en vibration ultrasonique d'une structure non accordee. |
US5319278A (en) * | 1992-06-05 | 1994-06-07 | Nec Corporation | Longitudinal-torsional resonance ultrasonic motor with improved support structure |
JP3078231B2 (ja) * | 1995-08-22 | 2000-08-21 | 株式会社アルテクス | 超音波振動接合装置 |
CN1179622A (zh) * | 1996-09-24 | 1998-04-22 | 索尼株式会社 | 丝焊装置 |
US6078125A (en) * | 1997-07-22 | 2000-06-20 | Branson Ultrasonics Corp. | Ultrasonic apparatus |
JP3215084B2 (ja) * | 1998-04-28 | 2001-10-02 | 株式会社アルテクス | 超音波振動接合用共振器 |
JP3536677B2 (ja) * | 1998-09-02 | 2004-06-14 | 松下電器産業株式会社 | ボンディングツールおよびボンディング装置 |
JP3373810B2 (ja) * | 1999-08-02 | 2003-02-04 | 株式会社アルテクス | 超音波振動接合用超音波ホーン |
JP2002035695A (ja) * | 2000-07-25 | 2002-02-05 | Arutekusu:Kk | 超音波加工用共振器 |
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MY135129A (en) | 2008-02-29 |
TWI307539B (en) | 2009-03-11 |
US20040245893A1 (en) | 2004-12-09 |
KR20040104424A (ko) | 2004-12-10 |
US7002283B2 (en) | 2006-02-21 |
CN1572382A (zh) | 2005-02-02 |
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