JPWO2022264386A1 - - Google Patents

Info

Publication number
JPWO2022264386A1
JPWO2022264386A1 JP2022563239A JP2022563239A JPWO2022264386A1 JP WO2022264386 A1 JPWO2022264386 A1 JP WO2022264386A1 JP 2022563239 A JP2022563239 A JP 2022563239A JP 2022563239 A JP2022563239 A JP 2022563239A JP WO2022264386 A1 JPWO2022264386 A1 JP WO2022264386A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022563239A
Other versions
JP7343941B2 (ja
JPWO2022264386A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022264386A1 publication Critical patent/JPWO2022264386A1/ja
Publication of JPWO2022264386A5 publication Critical patent/JPWO2022264386A5/ja
Application granted granted Critical
Publication of JP7343941B2 publication Critical patent/JP7343941B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
JP2022563239A 2021-06-17 2021-06-17 超音波複合振動装置および半導体装置の製造装置 Active JP7343941B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023117 WO2022264386A1 (ja) 2021-06-17 2021-06-17 超音波複合振動装置および半導体装置の製造装置

Publications (3)

Publication Number Publication Date
JPWO2022264386A1 true JPWO2022264386A1 (ja) 2022-12-22
JPWO2022264386A5 JPWO2022264386A5 (ja) 2023-05-31
JP7343941B2 JP7343941B2 (ja) 2023-09-13

Family

ID=84526958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022563239A Active JP7343941B2 (ja) 2021-06-17 2021-06-17 超音波複合振動装置および半導体装置の製造装置

Country Status (4)

Country Link
JP (1) JP7343941B2 (ja)
KR (1) KR20230057390A (ja)
CN (1) CN115707330A (ja)
WO (1) WO2022264386A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3073207B2 (ja) 1989-08-02 2000-08-07 沖電気工業株式会社 プラズマ処理方法
JPH0373207A (ja) * 1989-08-15 1991-03-28 Taga Electric Co Ltd 超音波回転加工装置
JP3550578B2 (ja) * 1995-09-19 2004-08-04 株式会社ニコン 振動アクチュエータ
JP3550579B2 (ja) * 1995-09-20 2004-08-04 株式会社ニコン 振動アクチュエータ
JP4244260B2 (ja) 2000-02-24 2009-03-25 富士工業株式会社 超音波加工用ねじり振動装置
JP3742332B2 (ja) * 2001-11-12 2006-02-01 株式会社新川 ワイヤボンデイング装置
JP4309160B2 (ja) * 2003-03-25 2009-08-05 株式会社アサヒ・イー・エム・エス 超音波複合振動体の駆動方法
JP5036124B2 (ja) * 2004-03-31 2012-09-26 株式会社アサヒ・イー・エム・エス 超音波複合振動体とその振動体の形成方法
JP4657964B2 (ja) * 2005-10-07 2011-03-23 株式会社新川 超音波ホーン
JP4314313B1 (ja) * 2008-06-30 2009-08-12 株式会社新川 ボンディング装置
JP6673961B2 (ja) * 2018-03-27 2020-04-01 辻野　次郎丸 超音波複合振動加工装置

Also Published As

Publication number Publication date
KR20230057390A (ko) 2023-04-28
JP7343941B2 (ja) 2023-09-13
CN115707330A (zh) 2023-02-17
WO2022264386A1 (ja) 2022-12-22

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