JP7301582B2 - 電気的接触子及び電気的接続装置 - Google Patents

電気的接触子及び電気的接続装置 Download PDF

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Publication number
JP7301582B2
JP7301582B2 JP2019072224A JP2019072224A JP7301582B2 JP 7301582 B2 JP7301582 B2 JP 7301582B2 JP 2019072224 A JP2019072224 A JP 2019072224A JP 2019072224 A JP2019072224 A JP 2019072224A JP 7301582 B2 JP7301582 B2 JP 7301582B2
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Japan
Prior art keywords
main body
electrical
extending
base
housing
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JP2019072224A
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English (en)
Japanese (ja)
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JP2020169928A5 (https=
JP2020169928A (ja
Inventor
衛知 大里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
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Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2019072224A priority Critical patent/JP7301582B2/ja
Priority to US16/784,847 priority patent/US11340289B2/en
Priority to MYPI2020000774A priority patent/MY200425A/en
Priority to CN202010257225.0A priority patent/CN111796124A/zh
Priority to PH1/2020/050163A priority patent/PH12020050163B1/en
Publication of JP2020169928A publication Critical patent/JP2020169928A/ja
Publication of JP2020169928A5 publication Critical patent/JP2020169928A5/ja
Application granted granted Critical
Publication of JP7301582B2 publication Critical patent/JP7301582B2/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0458Details related to environmental aspects, e.g. temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2019072224A 2019-04-04 2019-04-04 電気的接触子及び電気的接続装置 Active JP7301582B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019072224A JP7301582B2 (ja) 2019-04-04 2019-04-04 電気的接触子及び電気的接続装置
US16/784,847 US11340289B2 (en) 2019-04-04 2020-02-07 Electrical contactor and electrical connecting apparatus
MYPI2020000774A MY200425A (en) 2019-04-04 2020-02-12 Electrical contactor and electrical connecting apparatus
CN202010257225.0A CN111796124A (zh) 2019-04-04 2020-04-03 电触头及电连接装置
PH1/2020/050163A PH12020050163B1 (en) 2019-04-04 2020-05-25 Electrical contactor and electrical connecting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019072224A JP7301582B2 (ja) 2019-04-04 2019-04-04 電気的接触子及び電気的接続装置

Publications (3)

Publication Number Publication Date
JP2020169928A JP2020169928A (ja) 2020-10-15
JP2020169928A5 JP2020169928A5 (https=) 2022-03-22
JP7301582B2 true JP7301582B2 (ja) 2023-07-03

Family

ID=72662250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019072224A Active JP7301582B2 (ja) 2019-04-04 2019-04-04 電気的接触子及び電気的接続装置

Country Status (5)

Country Link
US (1) US11340289B2 (https=)
JP (1) JP7301582B2 (https=)
CN (1) CN111796124A (https=)
MY (1) MY200425A (https=)
PH (1) PH12020050163B1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7485945B2 (ja) * 2020-09-08 2024-05-17 山一電機株式会社 検査用ケルビンコンタクト及び検査用ケルビンソケット並びに検査用ケルビンコンタクトの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365308A (ja) 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
JP2005141986A (ja) 2003-11-05 2005-06-02 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP2010008388A (ja) 2008-06-30 2010-01-14 Rika Denshi Co Ltd Icソケット
JP2011153998A (ja) 2010-01-28 2011-08-11 Nhk Spring Co Ltd コンタクトプローブおよびプローブユニット

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094007B2 (ja) * 1998-06-02 2000-10-03 日本電子材料株式会社 プローブ及びこのプローブを用いたプローブカード
JP3810977B2 (ja) * 2000-02-25 2006-08-16 株式会社エンプラス 電気部品用ソケット
US7265565B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
JP2004117081A (ja) * 2002-09-25 2004-04-15 Japan Electronic Materials Corp 垂直型プローブユニット及びこれを用いた垂直型プローブカード
SG118181A1 (en) * 2003-03-25 2006-01-27 Fci Asia Technology Pte Ltd High density electrical connector
US7192320B2 (en) * 2004-03-26 2007-03-20 Silicon Pipe, Inc. Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
JP4571640B2 (ja) * 2004-07-05 2010-10-27 株式会社日本マイクロニクス 接触子ブロック及び電気的接続装置
JP2006162422A (ja) * 2004-12-07 2006-06-22 Japan Electronic Materials Corp プローブカード
JP2006337080A (ja) * 2005-05-31 2006-12-14 Micronics Japan Co Ltd 通電試験用プローブ
JP5123489B2 (ja) * 2006-04-07 2013-01-23 株式会社日本マイクロニクス 電気的接続装置
US9329204B2 (en) * 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
JP2014516158A (ja) 2011-05-27 2014-07-07 ジェイエフ マイクロテクノロジ・スンディリアン・ブルハド 電気相互接続アッセンブリー
JP5429308B2 (ja) * 2011-07-11 2014-02-26 株式会社デンソー 電子装置
JP2013171685A (ja) * 2012-02-20 2013-09-02 Molex Inc コネクタ
US9281577B2 (en) * 2013-12-30 2016-03-08 Lennox Industries Inc. Control signal routing apparatus
WO2018003507A1 (ja) * 2016-06-28 2018-01-04 株式会社日本マイクロニクス 電気的接続装置及び接触子
KR101683070B1 (ko) * 2016-09-27 2016-12-06 주식회사 제이앤에프이 카메라 모듈 검사용 Face-Front 소켓

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365308A (ja) 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
JP2005141986A (ja) 2003-11-05 2005-06-02 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP2010008388A (ja) 2008-06-30 2010-01-14 Rika Denshi Co Ltd Icソケット
JP2011153998A (ja) 2010-01-28 2011-08-11 Nhk Spring Co Ltd コンタクトプローブおよびプローブユニット

Also Published As

Publication number Publication date
CN111796124A (zh) 2020-10-20
PH12020050163B1 (en) 2024-01-12
MY200425A (en) 2023-12-26
JP2020169928A (ja) 2020-10-15
PH12020050163A1 (en) 2021-06-14
US11340289B2 (en) 2022-05-24
US20200319245A1 (en) 2020-10-08

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