CN111796124A - 电触头及电连接装置 - Google Patents

电触头及电连接装置 Download PDF

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Publication number
CN111796124A
CN111796124A CN202010257225.0A CN202010257225A CN111796124A CN 111796124 A CN111796124 A CN 111796124A CN 202010257225 A CN202010257225 A CN 202010257225A CN 111796124 A CN111796124 A CN 111796124A
Authority
CN
China
Prior art keywords
electrical
main body
contact
electrical contact
electrical contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010257225.0A
Other languages
English (en)
Chinese (zh)
Inventor
大里卫知
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Publication of CN111796124A publication Critical patent/CN111796124A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN202010257225.0A 2019-04-04 2020-04-03 电触头及电连接装置 Pending CN111796124A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-072224 2019-04-04
JP2019072224A JP7301582B2 (ja) 2019-04-04 2019-04-04 電気的接触子及び電気的接続装置

Publications (1)

Publication Number Publication Date
CN111796124A true CN111796124A (zh) 2020-10-20

Family

ID=72662250

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010257225.0A Pending CN111796124A (zh) 2019-04-04 2020-04-03 电触头及电连接装置

Country Status (5)

Country Link
US (1) US11340289B2 (https=)
JP (1) JP7301582B2 (https=)
CN (1) CN111796124A (https=)
MY (1) MY200425A (https=)
PH (1) PH12020050163B1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7485945B2 (ja) * 2020-09-08 2024-05-17 山一電機株式会社 検査用ケルビンコンタクト及び検査用ケルビンソケット並びに検査用ケルビンコンタクトの製造方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237040A (ja) * 2000-02-25 2001-08-31 Enplas Corp 電気部品用ソケット
JP2004117081A (ja) * 2002-09-25 2004-04-15 Japan Electronic Materials Corp 垂直型プローブユニット及びこれを用いた垂直型プローブカード
US20050179458A1 (en) * 2003-02-04 2005-08-18 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
TW200603502A (en) * 2004-07-05 2006-01-16 Nihon Micronics Kk Contact block and electrical connection device
JP2006162422A (ja) * 2004-12-07 2006-06-22 Japan Electronic Materials Corp プローブカード
JP2006337080A (ja) * 2005-05-31 2006-12-14 Micronics Japan Co Ltd 通電試験用プローブ
JP2007278861A (ja) * 2006-04-07 2007-10-25 Micronics Japan Co Ltd 電気的接続装置
US20130099810A1 (en) * 2009-04-21 2013-04-25 Johnstech International Corporation Electrically Conductive Kelvin Contacts For Microcircuit Tester
JP2013118158A (ja) * 2011-07-11 2013-06-13 Denso Corp 電子装置
US20140057497A1 (en) * 2012-02-20 2014-02-27 Molex Incorporated Connector
US20150188243A1 (en) * 2013-12-30 2015-07-02 Lennox Industries Inc. Control signal routing apparatus
KR101683070B1 (ko) * 2016-09-27 2016-12-06 주식회사 제이앤에프이 카메라 모듈 검사용 Face-Front 소켓
CN109477867A (zh) * 2016-06-28 2019-03-15 日本麦可罗尼克斯股份有限公司 电性连接装置及触头

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094007B2 (ja) * 1998-06-02 2000-10-03 日本電子材料株式会社 プローブ及びこのプローブを用いたプローブカード
JP2002365308A (ja) 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
SG118181A1 (en) * 2003-03-25 2006-01-27 Fci Asia Technology Pte Ltd High density electrical connector
JP2005141986A (ja) 2003-11-05 2005-06-02 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US7192320B2 (en) * 2004-03-26 2007-03-20 Silicon Pipe, Inc. Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
JP2010008388A (ja) 2008-06-30 2010-01-14 Rika Denshi Co Ltd Ｉｃソケット
JP2011153998A (ja) 2010-01-28 2011-08-11 Nhk Spring Co Ltd コンタクトプローブおよびプローブユニット
JP2014516158A (ja) 2011-05-27 2014-07-07 ジェイエフ マイクロテクノロジ・スンディリアン・ブルハド 電気相互接続アッセンブリー

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237040A (ja) * 2000-02-25 2001-08-31 Enplas Corp 電気部品用ソケット
JP2004117081A (ja) * 2002-09-25 2004-04-15 Japan Electronic Materials Corp 垂直型プローブユニット及びこれを用いた垂直型プローブカード
US20050179458A1 (en) * 2003-02-04 2005-08-18 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
TW200603502A (en) * 2004-07-05 2006-01-16 Nihon Micronics Kk Contact block and electrical connection device
JP2006162422A (ja) * 2004-12-07 2006-06-22 Japan Electronic Materials Corp プローブカード
JP2006337080A (ja) * 2005-05-31 2006-12-14 Micronics Japan Co Ltd 通電試験用プローブ
JP2007278861A (ja) * 2006-04-07 2007-10-25 Micronics Japan Co Ltd 電気的接続装置
US20130099810A1 (en) * 2009-04-21 2013-04-25 Johnstech International Corporation Electrically Conductive Kelvin Contacts For Microcircuit Tester
JP2013118158A (ja) * 2011-07-11 2013-06-13 Denso Corp 電子装置
US20140057497A1 (en) * 2012-02-20 2014-02-27 Molex Incorporated Connector
US20150188243A1 (en) * 2013-12-30 2015-07-02 Lennox Industries Inc. Control signal routing apparatus
CN109477867A (zh) * 2016-06-28 2019-03-15 日本麦可罗尼克斯股份有限公司 电性连接装置及触头
KR101683070B1 (ko) * 2016-09-27 2016-12-06 주식회사 제이앤에프이 카메라 모듈 검사용 Face-Front 소켓

Also Published As

Publication number Publication date
PH12020050163B1 (en) 2024-01-12
MY200425A (en) 2023-12-26
JP2020169928A (ja) 2020-10-15
PH12020050163A1 (en) 2021-06-14
US11340289B2 (en) 2022-05-24
JP7301582B2 (ja) 2023-07-03
US20200319245A1 (en) 2020-10-08

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