JP7298816B2 - 密閉環境のための位置フィードバック - Google Patents
密閉環境のための位置フィードバック Download PDFInfo
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- JP7298816B2 JP7298816B2 JP2021214334A JP2021214334A JP7298816B2 JP 7298816 B2 JP7298816 B2 JP 7298816B2 JP 2021214334 A JP2021214334 A JP 2021214334A JP 2021214334 A JP2021214334 A JP 2021214334A JP 7298816 B2 JP7298816 B2 JP 7298816B2
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
- H02K11/215—Magnetic effect devices, e.g. Hall-effect or magneto-resistive elements
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K19/00—Synchronous motors or generators
- H02K19/02—Synchronous motors
- H02K19/10—Synchronous motors for multi-phase current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/12—Stationary parts of the magnetic circuit
- H02K1/14—Stator cores with salient poles
- H02K1/146—Stator cores with salient poles consisting of a generally annular yoke with salient poles
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/22—Rotating parts of the magnetic circuit
- H02K1/24—Rotor cores with salient poles ; Variable reluctance rotors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/22—Rotating parts of the magnetic circuit
- H02K1/24—Rotor cores with salient poles ; Variable reluctance rotors
- H02K1/246—Variable reluctance rotors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/12—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas
- H02K5/128—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas using air-gap sleeves or air-gap discs
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
- H02K2211/03—Machines characterised by circuit boards, e.g. pcb
Description
本出願は、2013年11月13日に出願された米国仮特許出願第61/903,726号の利益を主張する通常出願であって、その開示内容の全ては、参照により本明細書に組み込まれる。
Claims (18)
- ハウジングと、
前記ハウジングに取り付けられた、可変リラクタンス駆動部と、
前記可変リラクタンス駆動部に接続された、少なくとも1つの搬送アームと、
を備えた搬送装置であって、
前記可変リラクタンス駆動部が、
透磁性材料の複数の突極を有し、隔離環境に配置される、少なくとも1つのロータと、
それぞれが対応するコイルユニットを備えた突極を画定する複数の突極構造を有し、前記隔離環境外に配置される、少なくとも1つのステータであって、前記コイルユニットは、それぞれの突極構造のまわりに巻き付けられ、前記少なくとも1つのステータの前記突極、および前記少なくとも1つのロータの前記突極が、前記少なくとも1つのロータと、前記少なくとも1つのステータとの間に、閉鎖磁束回路を形成する、少なくとも1つのステータと、
前記隔離環境を隔離するように構成された少なくとも1つの密閉仕切壁と、
少なくとも1つのセンサと
を備え、前記少なくとも1つのセンサが、
前記ハウジングに接続された磁気センサ部材、および、
前記少なくとも1つのロータに接続された少なくとも1つのセンサトラックを含み、
前記少なくとも1つのセンサトラックは、前記隔離環境に配置され、前記磁気センサ部材が前記隔離環境外に配置されるように、前記少なくとも1つの密閉仕切壁が、前記磁気センサ部材と前記少なくとも1つのセンサトラックとの間に配置され、前記磁気センサ部材および前記少なくとも1つのセンサトラックを分離させる、
搬送装置。 - 前記少なくとも1つの密閉仕切壁の少なくとも一部が、前記磁気センサ部材と一体である、請求項1記載の搬送装置。
- 前記少なくとも1つのセンサが、センサエアギャップを有する少なくとも1つの強磁束ループを含み、前記磁気センサ部材が、前記少なくとも1つの強磁束ループと相互作用する、請求項1記載の搬送装置。
- 前記磁気センサ部材が、前記センサエアギャップの磁気抵抗における変化を検知するように構成される、請求項3記載の搬送装置。
- 前記少なくとも1つの強磁束ループが第1および第2強磁束ループを含み、前記第1および第2強磁束ループは、前記第1および第2強磁束ループの間にセンサブリッジ部材を有し、前記センサエアギャップが、前記センサブリッジ部材に位置し、前記第1および第2強磁束ループのうちの1つが、前記少なくとも1つのセンサトラックの少なくとも一部が配置される、トラックエアギャップを有する、請求項3記載の搬送装置。
- 前記少なくとも1つの強磁束ループが、前記隔離環境に配置されるトラック相互作用部、および前記隔離環境外に配置されるセンサ部材相互作用部を含み、前記トラック相互作用部および前記センサ部材相互作用部が、前記少なくとも1つの密閉仕切壁によって分離される、請求項3記載の搬送装置。
- 前記少なくとも1つの強磁束ループが、前記センサエアギャップに配置された、磁束コンセントレータ要素を含む、請求項3記載の搬送装置。
- 前記少なくとも1つの強磁束ループが、前記少なくとも1つのセンサトラックの少なくとも一部が配置される、トラックエアギャップを含む、請求項3記載の搬送装置。
- 前記少なくとも1つのセンサトラックが、第1のピッチを有する第1のトラックと、少なくとも前記第1のピッチとは異なるそれぞれのピッチを有する、少なくとも第2のトラックとを含み、前記少なくとも1つのセンサが、前記第1のトラックに対応する第1のセンサと、前記少なくとも第2のトラックのそれぞれの1つに対応する、少なくとも第2のセンサとを含む、請求項1記載の搬送装置。
- 前記磁気センサ部材が、
差動正弦波出力信号および差動余弦波出力信号が、前記磁気センサ部材から得られるように、前記少なくとも1つのセンサトラックのピッチと実質的に合うように配置されたセンサ要素を有する、差動センサを備えている、請求項1記載の搬送装置。 - 前記センサ要素が、ホイートストンブリッジを形成する、請求項10記載の搬送装置。
- 前記センサ要素が、前記磁気センサ部材の共通のプリント回路基板上に配置される、請求項10記載の搬送装置。
- 前記少なくとも1つのセンサが、前記少なくとも1つのセンサトラックと、前記少なくとも1つの密閉仕切壁を通して、実質的に直接相互作用する、請求項1記載の搬送装置。
- 搬送装置を動作させる方法であって、前記方法が、
可変リラクタンス駆動部に接続された、少なくとも1つの搬送アームを設ける工程であって、
前記可変リラクタンス駆動部は、
隔離環境に配置される、少なくとも1つのロータと、
隔離環境外に配置される、少なくとも1つのステータであって、前記少なくとも1つのロータと、前記少なくとも1つのステータとの間に、閉鎖磁束回路を形成する、少なくとも1つのステータと
少なくとも1つのセンサと
を含み、
前記少なくとも1つのセンサが
ハウジングに接続され、前記隔離環境外に配置される磁気センサ部材、および、
前記少なくとも1つのロータに接続され、前記隔離環境に配置される少なくとも1つのセンサトラックを含む、
少なくとも1つの搬送アームを設ける工程と、
センサ制御装置によって、前記少なくとも1つのセンサから受信したセンサ信号に基づいて、前記少なくとも1つのセンサへのセンサ信号命令を生成する工程であって、前記センサ信号命令は、前記センサ信号の、少なくとも所定の特性における変化をもたらす、センサ信号命令を生成する工程と
を含む方法。 - 前記隔離環境が、少なくとも1つの密閉仕切壁によって隔離され、前記少なくとも1つの密閉仕切壁の少なくとも一部が、前記磁気センサ部材と一体である、請求項14記載の方法。
- 前記磁気センサ部材が、前記少なくとも1つのセンサの、少なくとも1つの強磁束ループと、前記少なくとも1つの強磁束ループのセンサエアギャップ内で相互作用する、請求項14記載の方法。
- 前記少なくとも1つの強磁束ループのそれぞれが、前記隔離環境に配置されるトラック相互作用部、および前記隔離環境外に配置されるセンサ部材相互作用部を含み、前記トラック相互作用部および前記センサ部材相互作用部が、前記少なくとも1つの密閉仕切壁によって分離される、請求項16記載の方法。
- 前記少なくとも1つのセンサが、前記少なくとも1つのセンサトラックと、前記少なくとも1つの密閉仕切壁を通して、実質的に直接相互作用する、請求項15記載の方法。
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JP2023091113A JP2023113776A (ja) | 2013-11-13 | 2023-06-01 | 密閉環境のための位置フィードバック |
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US201361903726P | 2013-11-13 | 2013-11-13 | |
US61/903,726 | 2013-11-13 | ||
US14/540,058 US10742092B2 (en) | 2013-11-13 | 2014-11-13 | Position feedback for sealed environments |
US14/540,058 | 2014-11-13 | ||
JP2020186510A JP7003207B2 (ja) | 2013-11-13 | 2020-11-09 | 密閉環境のための位置フィードバック |
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JP2022058460A JP2022058460A (ja) | 2022-04-12 |
JP7298816B2 true JP7298816B2 (ja) | 2023-06-27 |
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JP2020186510A Active JP7003207B2 (ja) | 2013-11-13 | 2020-11-09 | 密閉環境のための位置フィードバック |
JP2021214334A Active JP7298816B2 (ja) | 2013-11-13 | 2021-12-28 | 密閉環境のための位置フィードバック |
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US (3) | US10742092B2 (ja) |
EP (1) | EP3069380B1 (ja) |
JP (4) | JP6820198B2 (ja) |
KR (3) | KR20230044565A (ja) |
CN (1) | CN107135667B (ja) |
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WO (1) | WO2015073634A1 (ja) |
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DE102016112879B4 (de) * | 2016-07-13 | 2020-01-23 | Steiner-Optik Gmbh | Fernoptische Einrichtung, insbesondere Zielfernrohr |
US10651065B2 (en) * | 2017-12-06 | 2020-05-12 | Lam Research Corporation | Auto-calibration to a station of a process module that spins a wafer |
EP3620754B1 (en) * | 2018-09-06 | 2022-01-05 | KNORR-BREMSE Systeme für Nutzfahrzeuge GmbH | A magnet holder and stroke sensor with the magnet holder |
US20200411348A1 (en) * | 2019-06-28 | 2020-12-31 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus |
US11353345B2 (en) | 2019-07-22 | 2022-06-07 | Boston Dynamics, Inc. | Magnetic encoder calibration |
KR102424176B1 (ko) * | 2021-12-17 | 2022-07-25 | 김상조 | 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치 |
CN115159006B (zh) * | 2022-07-13 | 2024-03-29 | 中国工程物理研究院材料研究所 | 一种物料转运系统 |
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EP3069380A1 (en) | 2016-09-21 |
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TW201539634A (zh) | 2015-10-16 |
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