JP7287630B2 - 半導体ウエハへの保護テープの貼付装置及び貼り付け方法 - Google Patents
半導体ウエハへの保護テープの貼付装置及び貼り付け方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 39
- 239000011241 protective layer Substances 0.000 claims description 65
- 238000003825 pressing Methods 0.000 claims description 50
- 238000010438 heat treatment Methods 0.000 claims description 48
- 230000002093 peripheral effect Effects 0.000 claims description 42
- 235000012431 wafers Nutrition 0.000 description 225
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
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- 230000037303 wrinkles Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 229910052786 argon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
- B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Description
6 真空チャンバ
6A 上部チャンバ
6B 下部チャンバ
30 テープ保持体
60 貼付テーブル
61 フレーム台
62 押圧部材
620 保護層外周押さえ
621 テープ外周押さえ
622 弾性部材
W ウエハ
BM 基材
PT 保護テープ
PL 保護層
DF ダイシングフレーム
Claims (8)
- 半導体ウエハに保護テープを貼り付けるための貼付装置において、
前記半導体ウエハを支持する貼付テーブルと、
前記半導体ウエハの外径よりも小さい外径の保護層が積層された前記保護テープを保持可能であり、保持した前記保護テープを前記半導体ウエハ上に供給するテープ保持体と、
前記半導体ウエハ上に供給された前記保護テープを上方から押圧する押圧部材と、を少なくとも備え、
前記押圧部材は、リング状をなしかつ前記保護テープの前記保護層の外径よりも大きい外径を有する保護層外周押さえを備え、
前記押圧部材は、前記保護層外周押さえによって前記保護層の周囲部だけを前記半導体ウエハに向けて押圧することにより、前記半導体ウエハに前記保護テープを貼り付けるように構成されている、保護テープの貼付装置。 - 前記貼付テーブルは、下部チャンバの内部に昇降可能に設けられ、
前記押圧部材は、前記下部チャンバと真空チャンバを形成する上部チャンバの内部に上下方向に往復動可能に設けられる、請求項1に記載の保護テープの貼付装置。 - 前記半導体ウエハがマウントされるダイシングフレームを支持するフレーム台が、前記下部チャンバ内の前記貼付テーブルの周囲に設けられ、
前記保護テープは、前記ダイシングフレーム上に供給され、
前記押圧部材は、前記保護テープの外周縁部を押圧して前記ダイシングフレームに貼り付けるテープ外周押さえをさらに備える、請求項2に記載の保護テープの貼付装置。 - 前記押圧部材は、前記テープ外周押さえを上下方向に変位可能に支持する弾性部材をさらに備える、請求項3に記載の保護テープの貼付装置。
- 前記ダイシングフレームにマウントされた前記半導体ウエハを加熱する加熱テーブルをさらに備える、請求項3又は4に記載の保護テープの貼付装置。
- 半導体ウエハに保護テープを貼り付けるための貼付方法において、
前記半導体ウエハの外径よりも小さい外径の保護層が積層された前記保護テープを前記半導体ウエハ上に供給する供給工程と、
前記保護テープを前記半導体ウエハに貼り付ける貼付工程と、を有し、
前記貼付工程における前記半導体ウエハに対する前記保護テープの貼り付けは、前記保護層の周囲部だけを前記半導体ウエハに向けて押圧することにより行われる、保護テープの貼付方法。 - 前記供給工程では、前記保護テープは、前記半導体ウエハを取り囲むように配置されかつ前記半導体ウエハがマウントされるダイシングフレーム上に供給され、
前記貼付工程では、前記保護テープの外周縁部をさらに押圧して前記ダイシングフレームに貼り付ける、請求項6に記載の保護テープの貼付方法。 - 前記ダイシングフレームにマウントされた前記半導体ウエハを加熱する加熱工程をさらに有する、請求項7に記載の保護テープの貼付方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/016533 WO2019207632A1 (ja) | 2018-04-24 | 2018-04-24 | 半導体ウエハへの保護テープの貼付装置及び貼り付け方法 |
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JPWO2019207632A1 JPWO2019207632A1 (ja) | 2021-04-22 |
JP7287630B2 true JP7287630B2 (ja) | 2023-06-06 |
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Country | Link |
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US (1) | US11935768B2 (ja) |
JP (1) | JP7287630B2 (ja) |
KR (1) | KR102555601B1 (ja) |
CN (1) | CN112020768A (ja) |
DE (1) | DE112018007513T5 (ja) |
SG (1) | SG11202010427SA (ja) |
TW (1) | TWI820117B (ja) |
WO (1) | WO2019207632A1 (ja) |
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KR102400988B1 (ko) * | 2022-03-10 | 2022-05-23 | (주)파웰 코퍼레이션 | 정전척 본딩용 오토클레이브 장치 |
CN116021403A (zh) * | 2022-10-13 | 2023-04-28 | 北京特思迪半导体设备有限公司 | 用于晶圆批量抛光的柔性气囊结构及下压力精确控制方法 |
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2018
- 2018-04-24 DE DE112018007513.3T patent/DE112018007513T5/de active Pending
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- 2018-04-24 CN CN201880092682.XA patent/CN112020768A/zh active Pending
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JP2001148412A (ja) | 1999-11-19 | 2001-05-29 | Takatori Corp | 半導体ウエハへの保護テープ貼り付け方法及び装置 |
JP2008153449A (ja) | 2006-12-18 | 2008-07-03 | Lintec Corp | シート貼付装置及び貼付方法 |
JP2010135436A (ja) | 2008-12-02 | 2010-06-17 | Takatori Corp | 基板への接着テープ貼り付け装置 |
JP2011109008A (ja) | 2009-11-20 | 2011-06-02 | Nitto Denko Corp | 粘着テープ貼付け装置および粘着テープ貼付け方法 |
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SG11202010427SA (en) | 2020-11-27 |
US11935768B2 (en) | 2024-03-19 |
DE112018007513T5 (de) | 2021-03-11 |
KR20210003139A (ko) | 2021-01-11 |
JPWO2019207632A1 (ja) | 2021-04-22 |
WO2019207632A1 (ja) | 2019-10-31 |
US20210249285A1 (en) | 2021-08-12 |
CN112020768A (zh) | 2020-12-01 |
KR102555601B1 (ko) | 2023-07-18 |
TW201946208A (zh) | 2019-12-01 |
TWI820117B (zh) | 2023-11-01 |
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