JP7188705B2 - 半導体ウエハへの保護テープの貼付装置及び貼付方法 - Google Patents
半導体ウエハへの保護テープの貼付装置及び貼付方法 Download PDFInfo
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- JP7188705B2 JP7188705B2 JP2020515334A JP2020515334A JP7188705B2 JP 7188705 B2 JP7188705 B2 JP 7188705B2 JP 2020515334 A JP2020515334 A JP 2020515334A JP 2020515334 A JP2020515334 A JP 2020515334A JP 7188705 B2 JP7188705 B2 JP 7188705B2
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- Prior art keywords
- tape
- protective tape
- wafer
- peeling
- protective
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
Description
2 テープ搬送機構
4 剥離機構
30 テープ保持体
31 保持体移動機構
40 剥離板
41 剥離板移動機構
61 フレーム台
301 吸着部材
310 第1上下移動機構
320 第1往復移動機構
330 第2往復移動機構
W ウエハ
BM 基材
PT 保護テープ
PL 保護層
DF ダイシングフレーム
Claims (5)
- 半導体ウエハに保護テープを貼り付けるための貼付装置において、
基材上に仮着された前記保護テープを剥離位置まで搬送するテープ搬送機構と、
前記保護テープを保持可能なテープ保持体と、
前記テープ保持体を移動可能な保持体移動機構であって、前記剥離位置に前記テープ保持体を移動させる保持体移動機構と、
前記剥離位置で前記テープ保持体に保持された前記保護テープから前記基材を剥離する剥離機構と、
前記半導体ウエハを支持する貼付テーブルと、
前記貼付テーブルを昇降させる昇降機構と、
前記貼付テーブルの周囲かつ上方に設けられるフレーム台であって、前記半導体ウエハがマウントされるダイシングフレームを支持するフレーム台と、
を少なくとも備え、
前記保持体移動機構は、前記保護テープを保持した前記テープ保持体を前記フレーム台上に移動させて前記保護テープを前記ダイシングフレームに貼り付けるように構成され、
前記昇降機構は、前記貼付テーブルを上昇させて前記半導体ウエハを前記ダイシングフレームに貼り付けられた前記保護テープに貼り付けるように構成される、保護テープの貼付装置。 - 前記基材は、帯状であり、複数の前記保護テープが搬送方向に沿って間隔をあけて配置されており、
前記剥離機構は、剥離板と、前記剥離板を前記基材の搬送方向に往復動させる剥離板移動機構と、を備えており、前記剥離板の先端で前記基材を折り返しながら前記剥離板を前記基材の搬送方向と反対方向に移動させることで、前記保護テープから前記基材を剥離する、請求項1に記載の保護テープの貼付装置。 - 前記テープ保持体は、前記保護テープの全面を吸着可能な吸着部材を備えている、請求項1又は2に記載の保護テープの貼付装置。
- 前記保持体移動機構は、前記テープ保持体を上下方向に移動させる上下移動機構と、前記テープ保持体を水平面に沿うX方向及びX方向に直交するY方向に往復移動させる往復移動機構と、を備える、請求項1~3のいずれかに記載の保護テープの貼付装置。
- 半導体ウエハに保護テープを貼り付けるための貼付方法において、
基材上に仮着された前記保護テープを剥離位置まで搬送するテープ搬送工程と、
前記保護テープを保持可能なテープ保持体を前記剥離位置に移動させる保持体移動工程と、
前記剥離位置で前記テープ保持体に保持された前記保護テープから前記基材を剥離する剥離工程と、
前記保護テープを保持した前記テープ保持体をダイシングフレームを支持するフレーム台上に移動させることにより、前記保護テープを前記ダイシングフレームに貼り付ける工程であって、前記フレーム台は半導体ウエハを支持する貼付テーブルの周囲かつ上方に設けられる工程と、
前記貼付テーブルを上昇させて前記ダイシングフレームに貼り付けられた前記保護テープに前記半導体ウエハを貼り付けることにより、前記半導体ウエハを前記保護テープを介して前記ダイシングフレームにマウントする工程と、
を有する、保護テープの貼付方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/016543 WO2019207634A1 (ja) | 2018-04-24 | 2018-04-24 | 半導体ウエハへの保護テープの貼付装置及び貼付方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2019207634A1 JPWO2019207634A1 (ja) | 2021-04-22 |
JP7188705B2 true JP7188705B2 (ja) | 2022-12-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020515334A Active JP7188705B2 (ja) | 2018-04-24 | 2018-04-24 | 半導体ウエハへの保護テープの貼付装置及び貼付方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11469120B2 (ja) |
JP (1) | JP7188705B2 (ja) |
KR (1) | KR102541179B1 (ja) |
CN (1) | CN112005363A (ja) |
DE (1) | DE112018007519T5 (ja) |
SG (1) | SG11202010428UA (ja) |
TW (1) | TWI818979B (ja) |
WO (1) | WO2019207634A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112018007512T5 (de) * | 2018-04-24 | 2021-03-11 | Disco Hi-Tec Europe Gmbh | Ausrichtungsvorrichtung und Ausrichtungsverfahren |
JP7451028B2 (ja) * | 2019-12-27 | 2024-03-18 | 株式会社ディスコ | 保護シートの配設方法 |
CN115223851B (zh) * | 2022-09-21 | 2022-12-09 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种机械式晶片分离方法及装置 |
Citations (5)
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JP2005159044A (ja) | 2003-11-26 | 2005-06-16 | Takatori Corp | リングフレームへの粘着テープ貼り付け方法とその装置及びリングフレームへの基板マウント装置 |
JP2006339607A (ja) | 2005-06-06 | 2006-12-14 | Lintec Corp | 転写装置とその方法、剥離装置とその方法、貼付装置とその方法 |
JP2010135436A (ja) | 2008-12-02 | 2010-06-17 | Takatori Corp | 基板への接着テープ貼り付け装置 |
JP2011109008A (ja) | 2009-11-20 | 2011-06-02 | Nitto Denko Corp | 粘着テープ貼付け装置および粘着テープ貼付け方法 |
JP2014086532A (ja) | 2012-10-23 | 2014-05-12 | Nitto Denko Corp | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
Family Cites Families (12)
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JPS5828532B2 (ja) | 1980-04-23 | 1983-06-16 | 株式会社 石田衡器製作所 | 自動秤量機 |
JPS5828532U (ja) | 1981-08-14 | 1983-02-24 | 株式会社日立製作所 | 状態および故障表示方式 |
JP2005276987A (ja) * | 2004-03-24 | 2005-10-06 | Lintec Corp | 極薄チップの製造プロセス及び製造装置 |
JP4326519B2 (ja) * | 2005-03-31 | 2009-09-09 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた装置 |
JP4836827B2 (ja) * | 2007-02-22 | 2011-12-14 | 日東電工株式会社 | 粘着テープ貼付け装置 |
JP5317280B2 (ja) * | 2009-07-16 | 2013-10-16 | 株式会社タカトリ | 保護テープの剥離装置 |
JP5626782B2 (ja) * | 2010-09-13 | 2014-11-19 | リンテック株式会社 | シート貼付装置 |
JP5797623B2 (ja) * | 2012-08-31 | 2015-10-21 | 日東精機株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
JP6234161B2 (ja) * | 2013-10-24 | 2017-11-22 | 株式会社ディスコ | 粘着テープ貼着装置 |
JP6600297B2 (ja) * | 2014-03-26 | 2019-10-30 | リンテック株式会社 | 樹脂膜形成用シート積層体 |
JP6406942B2 (ja) * | 2014-09-05 | 2018-10-17 | 日東電工株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
JP5828532B1 (ja) | 2014-12-02 | 2015-12-09 | 大宮工業株式会社 | 貼付装置 |
-
2018
- 2018-04-24 KR KR1020207032075A patent/KR102541179B1/ko active IP Right Grant
- 2018-04-24 WO PCT/JP2018/016543 patent/WO2019207634A1/ja active Application Filing
- 2018-04-24 JP JP2020515334A patent/JP7188705B2/ja active Active
- 2018-04-24 CN CN201880092683.4A patent/CN112005363A/zh active Pending
- 2018-04-24 SG SG11202010428UA patent/SG11202010428UA/en unknown
- 2018-04-24 DE DE112018007519.2T patent/DE112018007519T5/de active Pending
- 2018-04-24 US US17/049,398 patent/US11469120B2/en active Active
-
2019
- 2019-04-17 TW TW108113415A patent/TWI818979B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005159044A (ja) | 2003-11-26 | 2005-06-16 | Takatori Corp | リングフレームへの粘着テープ貼り付け方法とその装置及びリングフレームへの基板マウント装置 |
JP2006339607A (ja) | 2005-06-06 | 2006-12-14 | Lintec Corp | 転写装置とその方法、剥離装置とその方法、貼付装置とその方法 |
JP2010135436A (ja) | 2008-12-02 | 2010-06-17 | Takatori Corp | 基板への接着テープ貼り付け装置 |
JP2011109008A (ja) | 2009-11-20 | 2011-06-02 | Nitto Denko Corp | 粘着テープ貼付け装置および粘着テープ貼付け方法 |
JP2014086532A (ja) | 2012-10-23 | 2014-05-12 | Nitto Denko Corp | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
Also Published As
Publication number | Publication date |
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JPWO2019207634A1 (ja) | 2021-04-22 |
TW202003740A (zh) | 2020-01-16 |
TWI818979B (zh) | 2023-10-21 |
KR102541179B1 (ko) | 2023-06-12 |
US11469120B2 (en) | 2022-10-11 |
DE112018007519T5 (de) | 2021-01-14 |
WO2019207634A1 (ja) | 2019-10-31 |
KR20210003141A (ko) | 2021-01-11 |
US20210249286A1 (en) | 2021-08-12 |
SG11202010428UA (en) | 2020-11-27 |
CN112005363A (zh) | 2020-11-27 |
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