SG11202010428UA - Device and method for attaching protective tape to semiconductor wafer - Google Patents

Device and method for attaching protective tape to semiconductor wafer

Info

Publication number
SG11202010428UA
SG11202010428UA SG11202010428UA SG11202010428UA SG11202010428UA SG 11202010428U A SG11202010428U A SG 11202010428UA SG 11202010428U A SG11202010428U A SG 11202010428UA SG 11202010428U A SG11202010428U A SG 11202010428UA SG 11202010428U A SG11202010428U A SG 11202010428UA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
protective tape
attaching protective
attaching
tape
Prior art date
Application number
SG11202010428UA
Other languages
English (en)
Inventor
Karl Heinz Priewasser
Yoshinori Kakinuma
Yosuke Ishimatsu
Ken Ikehata
Original Assignee
Disco Hi Tec Europe Gmbh
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Hi Tec Europe Gmbh, Takatori Corp filed Critical Disco Hi Tec Europe Gmbh
Publication of SG11202010428UA publication Critical patent/SG11202010428UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11202010428UA 2018-04-24 2018-04-24 Device and method for attaching protective tape to semiconductor wafer SG11202010428UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/016543 WO2019207634A1 (ja) 2018-04-24 2018-04-24 半導体ウエハへの保護テープの貼付装置及び貼付方法

Publications (1)

Publication Number Publication Date
SG11202010428UA true SG11202010428UA (en) 2020-11-27

Family

ID=68293607

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010428UA SG11202010428UA (en) 2018-04-24 2018-04-24 Device and method for attaching protective tape to semiconductor wafer

Country Status (8)

Country Link
US (1) US11469120B2 (ja)
JP (1) JP7188705B2 (ja)
KR (1) KR102541179B1 (ja)
CN (1) CN112005363B (ja)
DE (1) DE112018007519T5 (ja)
SG (1) SG11202010428UA (ja)
TW (1) TWI818979B (ja)
WO (1) WO2019207634A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7298851B2 (ja) * 2018-04-24 2023-06-27 ディスコ ハイテック ヨーロッパ ゲーエムベーハー アライメント装置及びアライメント方法
JP7451028B2 (ja) * 2019-12-27 2024-03-18 株式会社ディスコ 保護シートの配設方法
CN115223851B (zh) * 2022-09-21 2022-12-09 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种机械式晶片分离方法及装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828532B2 (ja) 1980-04-23 1983-06-16 株式会社 石田衡器製作所 自動秤量機
JPS5828532U (ja) 1981-08-14 1983-02-24 株式会社日立製作所 状態および故障表示方式
JP2005159044A (ja) * 2003-11-26 2005-06-16 Takatori Corp リングフレームへの粘着テープ貼り付け方法とその装置及びリングフレームへの基板マウント装置
JP2005276987A (ja) * 2004-03-24 2005-10-06 Lintec Corp 極薄チップの製造プロセス及び製造装置
JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP4885483B2 (ja) * 2005-06-06 2012-02-29 リンテック株式会社 転写装置とその方法、剥離装置とその方法、貼付装置とその方法
JP4836827B2 (ja) * 2007-02-22 2011-12-14 日東電工株式会社 粘着テープ貼付け装置
JP5273791B2 (ja) 2008-12-02 2013-08-28 株式会社タカトリ 基板への接着テープ貼り付け装置
JP5317280B2 (ja) * 2009-07-16 2013-10-16 株式会社タカトリ 保護テープの剥離装置
JP5417131B2 (ja) 2009-11-20 2014-02-12 日東電工株式会社 粘着テープ貼付け装置および粘着テープ貼付け方法
JP5626782B2 (ja) * 2010-09-13 2014-11-19 リンテック株式会社 シート貼付装置
JP5797623B2 (ja) * 2012-08-31 2015-10-21 日東精機株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5589045B2 (ja) * 2012-10-23 2014-09-10 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP6234161B2 (ja) * 2013-10-24 2017-11-22 株式会社ディスコ 粘着テープ貼着装置
KR102544301B1 (ko) * 2014-03-26 2023-06-15 린텍 가부시키가이샤 수지막 형성용 시트 적층체
JP6406942B2 (ja) * 2014-09-05 2018-10-17 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP5828532B1 (ja) 2014-12-02 2015-12-09 大宮工業株式会社 貼付装置

Also Published As

Publication number Publication date
US11469120B2 (en) 2022-10-11
JPWO2019207634A1 (ja) 2021-04-22
US20210249286A1 (en) 2021-08-12
KR20210003141A (ko) 2021-01-11
TWI818979B (zh) 2023-10-21
CN112005363A (zh) 2020-11-27
TW202003740A (zh) 2020-01-16
WO2019207634A1 (ja) 2019-10-31
DE112018007519T5 (de) 2021-01-14
CN112005363B (zh) 2024-05-31
JP7188705B2 (ja) 2022-12-13
KR102541179B1 (ko) 2023-06-12

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