JP7251446B2 - 伝熱部材付基板及び伝熱部材付基板の製造方法 - Google Patents

伝熱部材付基板及び伝熱部材付基板の製造方法 Download PDF

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Publication number
JP7251446B2
JP7251446B2 JP2019195337A JP2019195337A JP7251446B2 JP 7251446 B2 JP7251446 B2 JP 7251446B2 JP 2019195337 A JP2019195337 A JP 2019195337A JP 2019195337 A JP2019195337 A JP 2019195337A JP 7251446 B2 JP7251446 B2 JP 7251446B2
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Japan
Prior art keywords
heat transfer
substrate
transfer member
heat
plating layer
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Active
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JP2019195337A
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English (en)
Japanese (ja)
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JP2021068868A (ja
JP2021068868A5 (https=
Inventor
章 原口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2019195337A priority Critical patent/JP7251446B2/ja
Priority to PCT/JP2020/033256 priority patent/WO2021084897A1/ja
Priority to CN202080073206.0A priority patent/CN114631400B/zh
Priority to US17/755,391 priority patent/US20220408545A1/en
Publication of JP2021068868A publication Critical patent/JP2021068868A/ja
Publication of JP2021068868A5 publication Critical patent/JP2021068868A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1025—Metallic discs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
JP2019195337A 2019-10-28 2019-10-28 伝熱部材付基板及び伝熱部材付基板の製造方法 Active JP7251446B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019195337A JP7251446B2 (ja) 2019-10-28 2019-10-28 伝熱部材付基板及び伝熱部材付基板の製造方法
PCT/JP2020/033256 WO2021084897A1 (ja) 2019-10-28 2020-09-02 伝熱部材付基板及び伝熱部材付基板の製造方法
CN202080073206.0A CN114631400B (zh) 2019-10-28 2020-09-02 带传热构件的基板以及带传热构件的基板的制造方法
US17/755,391 US20220408545A1 (en) 2019-10-28 2020-09-02 Heat transfer member-equipped substrate and method for manufacturing heat transfer member-equipped substate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019195337A JP7251446B2 (ja) 2019-10-28 2019-10-28 伝熱部材付基板及び伝熱部材付基板の製造方法

Publications (3)

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JP2021068868A JP2021068868A (ja) 2021-04-30
JP2021068868A5 JP2021068868A5 (https=) 2022-03-23
JP7251446B2 true JP7251446B2 (ja) 2023-04-04

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JP2019195337A Active JP7251446B2 (ja) 2019-10-28 2019-10-28 伝熱部材付基板及び伝熱部材付基板の製造方法

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US (1) US20220408545A1 (https=)
JP (1) JP7251446B2 (https=)
CN (1) CN114631400B (https=)
WO (1) WO2021084897A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12171056B2 (en) * 2022-06-20 2024-12-17 Mellanox Technologies Ltd. Electronic assembly and method for thermal balancing of surfacemount devices
CN117177473B (zh) * 2023-10-18 2024-08-30 芜湖雅葆轩电子科技股份有限公司 一种元件贴装前的罩式分区定点融锡装置
TWI860876B (zh) * 2023-10-23 2024-11-01 啓碁科技股份有限公司 散熱結構

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JP2011159702A (ja) 2010-01-29 2011-08-18 Denso Corp 半導体装置およびその製造方法
JP2014135418A (ja) 2013-01-11 2014-07-24 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2015153925A (ja) 2014-02-17 2015-08-24 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP2019176015A (ja) 2018-03-28 2019-10-10 株式会社Uacj 回路基板付きヒートシンク及びその製造方法

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JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH05259321A (ja) * 1992-03-11 1993-10-08 Toshiba Corp マルチチップモジュール
US20020045036A1 (en) * 1999-06-16 2002-04-18 Robin Gorrell Bga solder ball shear strength
JP2003023250A (ja) * 2001-07-06 2003-01-24 Denso Corp 多層基板のおよびその製造方法
JP2003198117A (ja) * 2001-12-28 2003-07-11 Matsushita Electric Ind Co Ltd はんだ付け方法および接合構造体
JP2004172313A (ja) * 2002-11-19 2004-06-17 Nitto Denko Corp 熱伝導性放熱シートおよびこれを用いた半導体装置
JP2006165114A (ja) * 2004-12-03 2006-06-22 Nec Corp 半導体素子の実装方法及び実装構造、装置
US7807560B2 (en) * 2007-07-17 2010-10-05 Shinko Electric Industries Co., Ltd. Solder bump forming method
JP2012033855A (ja) * 2010-07-01 2012-02-16 Hitachi Cable Ltd Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
JP5485110B2 (ja) * 2010-10-29 2014-05-07 新光電気工業株式会社 配線基板及びその製造方法、電子装置
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JP6061369B2 (ja) * 2012-01-30 2017-01-18 凸版印刷株式会社 配線基板およびその製造方法、ならびにはんだ付き配線基板の製造方法
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Publication number Priority date Publication date Assignee Title
JP2011159702A (ja) 2010-01-29 2011-08-18 Denso Corp 半導体装置およびその製造方法
JP2014135418A (ja) 2013-01-11 2014-07-24 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2015153925A (ja) 2014-02-17 2015-08-24 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP2019176015A (ja) 2018-03-28 2019-10-10 株式会社Uacj 回路基板付きヒートシンク及びその製造方法

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WO2021084897A1 (ja) 2021-05-06
JP2021068868A (ja) 2021-04-30
US20220408545A1 (en) 2022-12-22
CN114631400A (zh) 2022-06-14
CN114631400B (zh) 2024-03-26

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