CN114631400B - 带传热构件的基板以及带传热构件的基板的制造方法 - Google Patents

带传热构件的基板以及带传热构件的基板的制造方法 Download PDF

Info

Publication number
CN114631400B
CN114631400B CN202080073206.0A CN202080073206A CN114631400B CN 114631400 B CN114631400 B CN 114631400B CN 202080073206 A CN202080073206 A CN 202080073206A CN 114631400 B CN114631400 B CN 114631400B
Authority
CN
China
Prior art keywords
heat transfer
substrate
transfer member
heat
transfer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080073206.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114631400A (zh
Inventor
原口章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN114631400A publication Critical patent/CN114631400A/zh
Application granted granted Critical
Publication of CN114631400B publication Critical patent/CN114631400B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1025—Metallic discs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
CN202080073206.0A 2019-10-28 2020-09-02 带传热构件的基板以及带传热构件的基板的制造方法 Active CN114631400B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-195337 2019-10-28
JP2019195337A JP7251446B2 (ja) 2019-10-28 2019-10-28 伝熱部材付基板及び伝熱部材付基板の製造方法
PCT/JP2020/033256 WO2021084897A1 (ja) 2019-10-28 2020-09-02 伝熱部材付基板及び伝熱部材付基板の製造方法

Publications (2)

Publication Number Publication Date
CN114631400A CN114631400A (zh) 2022-06-14
CN114631400B true CN114631400B (zh) 2024-03-26

Family

ID=75638614

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080073206.0A Active CN114631400B (zh) 2019-10-28 2020-09-02 带传热构件的基板以及带传热构件的基板的制造方法

Country Status (4)

Country Link
US (1) US20220408545A1 (https=)
JP (1) JP7251446B2 (https=)
CN (1) CN114631400B (https=)
WO (1) WO2021084897A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12171056B2 (en) * 2022-06-20 2024-12-17 Mellanox Technologies Ltd. Electronic assembly and method for thermal balancing of surfacemount devices
CN117177473B (zh) * 2023-10-18 2024-08-30 芜湖雅葆轩电子科技股份有限公司 一种元件贴装前的罩式分区定点融锡装置
TWI860876B (zh) * 2023-10-23 2024-11-01 啓碁科技股份有限公司 散熱結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259321A (ja) * 1992-03-11 1993-10-08 Toshiba Corp マルチチップモジュール
JP2004172313A (ja) * 2002-11-19 2004-06-17 Nitto Denko Corp 熱伝導性放熱シートおよびこれを用いた半導体装置
JP2006165114A (ja) * 2004-12-03 2006-06-22 Nec Corp 半導体素子の実装方法及び実装構造、装置
JP2014135418A (ja) * 2013-01-11 2014-07-24 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2015177157A (ja) * 2014-03-18 2015-10-05 三菱電機株式会社 電子機器

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
US20020045036A1 (en) * 1999-06-16 2002-04-18 Robin Gorrell Bga solder ball shear strength
JP2003023250A (ja) * 2001-07-06 2003-01-24 Denso Corp 多層基板のおよびその製造方法
JP2003198117A (ja) * 2001-12-28 2003-07-11 Matsushita Electric Ind Co Ltd はんだ付け方法および接合構造体
US7807560B2 (en) * 2007-07-17 2010-10-05 Shinko Electric Industries Co., Ltd. Solder bump forming method
JP5212392B2 (ja) 2010-01-29 2013-06-19 株式会社デンソー 半導体装置
JP2012033855A (ja) * 2010-07-01 2012-02-16 Hitachi Cable Ltd Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
JP5485110B2 (ja) * 2010-10-29 2014-05-07 新光電気工業株式会社 配線基板及びその製造方法、電子装置
CN202026521U (zh) * 2011-02-28 2011-11-02 张�林 带散热金属的电路板
JP6061369B2 (ja) * 2012-01-30 2017-01-18 凸版印刷株式会社 配線基板およびその製造方法、ならびにはんだ付き配線基板の製造方法
JP5989465B2 (ja) * 2012-09-05 2016-09-07 昭和電工株式会社 絶縁基板の製造方法
JP6197619B2 (ja) * 2013-12-09 2017-09-20 富士通株式会社 電子装置及び電子装置の製造方法
JP6213291B2 (ja) 2014-02-17 2017-10-18 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP6547134B2 (ja) * 2014-05-22 2019-07-24 パナソニックＩｐマネジメント株式会社 回路基板
JP6333215B2 (ja) * 2015-05-19 2018-05-30 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
AT518281B1 (de) * 2016-03-01 2017-09-15 Zkw Group Gmbh Verfahren zum Herstellen einer Schirmung
EP3428223B1 (en) * 2016-03-10 2021-05-05 Denka Company Limited Ceramic resin composite body
US11133445B2 (en) * 2017-03-22 2021-09-28 Denka Company Limited Resin composition for circuit board, and metal-base circuit board in which same is used
DE112018006380T5 (de) * 2017-12-14 2020-08-27 Autonetworks Technologies, Ltd. Schaltungsanordnung und elektrischer Verteilerkasten
JP2019176015A (ja) 2018-03-28 2019-10-10 株式会社Uacj 回路基板付きヒートシンク及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259321A (ja) * 1992-03-11 1993-10-08 Toshiba Corp マルチチップモジュール
JP2004172313A (ja) * 2002-11-19 2004-06-17 Nitto Denko Corp 熱伝導性放熱シートおよびこれを用いた半導体装置
JP2006165114A (ja) * 2004-12-03 2006-06-22 Nec Corp 半導体素子の実装方法及び実装構造、装置
JP2014135418A (ja) * 2013-01-11 2014-07-24 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2015177157A (ja) * 2014-03-18 2015-10-05 三菱電機株式会社 電子機器

Also Published As

Publication number Publication date
WO2021084897A1 (ja) 2021-05-06
JP2021068868A (ja) 2021-04-30
JP7251446B2 (ja) 2023-04-04
US20220408545A1 (en) 2022-12-22
CN114631400A (zh) 2022-06-14

Similar Documents

Publication Publication Date Title
CN109478521B (zh) 半导体装置
CN101577262B (zh) 功率半导体模块系统
CN102315181B (zh) 半导体器件
CN114631400B (zh) 带传热构件的基板以及带传热构件的基板的制造方法
CN110506455A (zh) 附带金属构件的基板、电路结构体及电气连接箱
JP2009044156A (ja) 改善された放熱性を備えた回路支持体構造部
US11295997B2 (en) Semiconductor device manufacturing method and semiconductor device
CN110364497A (zh) 用于功率控制的电子器件模块和其制造的方法
CN104218007A (zh) 小脚印半导体封装
WO2018193828A1 (ja) 金属部材付き基板、回路構成体及び電気接続箱
EP3232468B1 (en) Heat dissipation structure of a semiconductor device
CN113498273A (zh) 半导体装置的制造方法、半导体装置以及按压装置
JPWO2022044541A5 (https=)
JP2008277330A (ja) 放熱装置
WO2020195103A1 (ja) 回路基板及び、回路基板を含む電気接続箱の製造方法
JP5227716B2 (ja) 発熱部品搭載回路基板
WO2022270352A1 (ja) 回路装置
CN110943047B (zh) 半导体装置的制造方法
JP4743536B2 (ja) 半導体実装構造
JP7528573B2 (ja) 回路構成体
JPH11238962A (ja) 半導体装置の製造方法及び半導体装置
JP4452888B2 (ja) 電子回路装置
CN114450784A (zh) 功率半导体构件以及用于制造功率半导体构件的方法
JP6403741B2 (ja) 表面実装型半導体パッケージ装置
JP2022048552A (ja) 半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant