JP7224128B2 - 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 - Google Patents

基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 Download PDF

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Publication number
JP7224128B2
JP7224128B2 JP2018150053A JP2018150053A JP7224128B2 JP 7224128 B2 JP7224128 B2 JP 7224128B2 JP 2018150053 A JP2018150053 A JP 2018150053A JP 2018150053 A JP2018150053 A JP 2018150053A JP 7224128 B2 JP7224128 B2 JP 7224128B2
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Japan
Prior art keywords
substrate
cleaning
cleaning tool
abrasive grains
tool
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JP2018150053A
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English (en)
Japanese (ja)
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JP2020027807A5 (https=
JP2020027807A (ja
Inventor
知淳 石橋
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Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2018150053A priority Critical patent/JP7224128B2/ja
Priority to TW108126694A priority patent/TWI808227B/zh
Priority to KR1020190094133A priority patent/KR102661661B1/ko
Priority to SG10201907194RA priority patent/SG10201907194RA/en
Priority to EP19190837.5A priority patent/EP3608948A1/en
Priority to US16/536,939 priority patent/US11424138B2/en
Priority to CN201910732982.6A priority patent/CN110828334A/zh
Publication of JP2020027807A publication Critical patent/JP2020027807A/ja
Publication of JP2020027807A5 publication Critical patent/JP2020027807A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2018150053A 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 Active JP7224128B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018150053A JP7224128B2 (ja) 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
TW108126694A TWI808227B (zh) 2018-08-09 2019-07-29 基板清洗裝置及基板清洗方法
KR1020190094133A KR102661661B1 (ko) 2018-08-09 2019-08-02 기판 세정 장치
SG10201907194RA SG10201907194RA (en) 2018-08-09 2019-08-05 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool
EP19190837.5A EP3608948A1 (en) 2018-08-09 2019-08-08 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool
US16/536,939 US11424138B2 (en) 2018-08-09 2019-08-09 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool
CN201910732982.6A CN110828334A (zh) 2018-08-09 2019-08-09 基板用清洗件、基板清洗装置、基板处理装置、基板处理方法以及基板用清洗件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018150053A JP7224128B2 (ja) 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Publications (3)

Publication Number Publication Date
JP2020027807A JP2020027807A (ja) 2020-02-20
JP2020027807A5 JP2020027807A5 (https=) 2021-07-29
JP7224128B2 true JP7224128B2 (ja) 2023-02-17

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JP2018150053A Active JP7224128B2 (ja) 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Country Status (7)

Country Link
US (1) US11424138B2 (https=)
EP (1) EP3608948A1 (https=)
JP (1) JP7224128B2 (https=)
KR (1) KR102661661B1 (https=)
CN (1) CN110828334A (https=)
SG (1) SG10201907194RA (https=)
TW (1) TWI808227B (https=)

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JP7166132B2 (ja) 2018-10-12 2022-11-07 株式会社荏原製作所 基板洗浄部材および基板洗浄装置
US11335588B2 (en) * 2019-06-18 2022-05-17 Ebara Corporation Substrate holding apparatus and substrate processing apparatus
JP7641714B2 (ja) * 2020-08-19 2025-03-07 株式会社荏原製作所 洗浄具のクリーニング方法、装置、基板洗浄装置及び洗浄具の製造方法
US11823916B2 (en) * 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
CN113078078A (zh) * 2021-03-19 2021-07-06 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
JP7508426B2 (ja) * 2021-09-14 2024-07-01 芝浦メカトロニクス株式会社 洗浄装置
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
KR102634959B1 (ko) * 2023-09-05 2024-02-08 주식회사 유일로보틱스 복합 비젼 검사기능을 가진 협동 로봇

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US20050000652A1 (en) 2003-07-02 2005-01-06 Chaqng-Hyeon Nam Apparatus and method for treating edge of substrate
JP2007294809A (ja) 2006-04-27 2007-11-08 Sharp Corp 多孔質成長基板クリーニング装置およびシート状基板作製方法
JP2008047601A (ja) 2006-08-11 2008-02-28 Nitto Denko Corp クリーニング部材、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法
JP3140166U (ja) 2007-12-26 2008-03-13 宮川ローラー株式会社 導電性シリコーンローラ
JP2009238938A (ja) 2008-03-26 2009-10-15 Dainippon Screen Mfg Co Ltd 基板処理装置
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Also Published As

Publication number Publication date
EP3608948A1 (en) 2020-02-12
TWI808227B (zh) 2023-07-11
SG10201907194RA (en) 2020-03-30
KR102661661B1 (ko) 2024-05-02
US11424138B2 (en) 2022-08-23
CN110828334A (zh) 2020-02-21
US20200066549A1 (en) 2020-02-27
JP2020027807A (ja) 2020-02-20
TW202017079A (zh) 2020-05-01
KR20200018279A (ko) 2020-02-19

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