SG10201907194RA - Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool - Google Patents

Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool

Info

Publication number
SG10201907194RA
SG10201907194RA SG10201907194RA SG10201907194RA SG10201907194RA SG 10201907194R A SG10201907194R A SG 10201907194RA SG 10201907194R A SG10201907194R A SG 10201907194RA SG 10201907194R A SG10201907194R A SG 10201907194RA SG 10201907194R A SG10201907194R A SG 10201907194RA
Authority
SG
Singapore
Prior art keywords
substrate
substrate cleaning
cleaning tool
substrate processing
manufacturing
Prior art date
Application number
SG10201907194RA
Other languages
English (en)
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201907194RA publication Critical patent/SG10201907194RA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG10201907194RA 2018-08-09 2019-08-05 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool SG10201907194RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018150053A JP7224128B2 (ja) 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Publications (1)

Publication Number Publication Date
SG10201907194RA true SG10201907194RA (en) 2020-03-30

Family

ID=67658597

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201907194RA SG10201907194RA (en) 2018-08-09 2019-08-05 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool

Country Status (7)

Country Link
US (1) US11424138B2 (https=)
EP (1) EP3608948A1 (https=)
JP (1) JP7224128B2 (https=)
KR (1) KR102661661B1 (https=)
CN (1) CN110828334A (https=)
SG (1) SG10201907194RA (https=)
TW (1) TWI808227B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7166132B2 (ja) 2018-10-12 2022-11-07 株式会社荏原製作所 基板洗浄部材および基板洗浄装置
US11335588B2 (en) * 2019-06-18 2022-05-17 Ebara Corporation Substrate holding apparatus and substrate processing apparatus
JP7641714B2 (ja) * 2020-08-19 2025-03-07 株式会社荏原製作所 洗浄具のクリーニング方法、装置、基板洗浄装置及び洗浄具の製造方法
US11823916B2 (en) * 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
CN113078078A (zh) * 2021-03-19 2021-07-06 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
JP7508426B2 (ja) * 2021-09-14 2024-07-01 芝浦メカトロニクス株式会社 洗浄装置
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
KR102634959B1 (ko) * 2023-09-05 2024-02-08 주식회사 유일로보틱스 복합 비젼 검사기능을 가진 협동 로봇

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US6079073A (en) * 1997-04-01 2000-06-27 Ebara Corporation Washing installation including plural washers
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
JPH11283952A (ja) * 1998-03-30 1999-10-15 Shibaura Mechatronics Corp ブラシ洗浄装置
US6557202B1 (en) * 1999-12-03 2003-05-06 Lam Research Corporation Wafer scrubbing brush core having an internal motor and method of making the same
JP2002050607A (ja) * 2000-08-03 2002-02-15 Kaijo Corp 基板処理方法
US6802877B2 (en) * 2001-04-20 2004-10-12 Thomas J. Drury Polyvinyl acetal composition roller brush with abrasive outer surface
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KR100562502B1 (ko) 2003-07-02 2006-03-21 삼성전자주식회사 반도체 기판의 가장자리부 처리 장치 및 방법
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JP6316730B2 (ja) * 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
JP6726575B2 (ja) 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6643942B2 (ja) 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置

Also Published As

Publication number Publication date
EP3608948A1 (en) 2020-02-12
TWI808227B (zh) 2023-07-11
KR102661661B1 (ko) 2024-05-02
JP7224128B2 (ja) 2023-02-17
US11424138B2 (en) 2022-08-23
CN110828334A (zh) 2020-02-21
US20200066549A1 (en) 2020-02-27
JP2020027807A (ja) 2020-02-20
TW202017079A (zh) 2020-05-01
KR20200018279A (ko) 2020-02-19

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