CN110828334A - 基板用清洗件、基板清洗装置、基板处理装置、基板处理方法以及基板用清洗件的制造方法 - Google Patents

基板用清洗件、基板清洗装置、基板处理装置、基板处理方法以及基板用清洗件的制造方法 Download PDF

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Publication number
CN110828334A
CN110828334A CN201910732982.6A CN201910732982A CN110828334A CN 110828334 A CN110828334 A CN 110828334A CN 201910732982 A CN201910732982 A CN 201910732982A CN 110828334 A CN110828334 A CN 110828334A
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CN
China
Prior art keywords
substrate
cleaning
processed
cleaning tool
contact
Prior art date
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Pending
Application number
CN201910732982.6A
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English (en)
Chinese (zh)
Inventor
石桥知淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN110828334A publication Critical patent/CN110828334A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201910732982.6A 2018-08-09 2019-08-09 基板用清洗件、基板清洗装置、基板处理装置、基板处理方法以及基板用清洗件的制造方法 Pending CN110828334A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-150053 2018-08-09
JP2018150053A JP7224128B2 (ja) 2018-08-09 2018-08-09 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法

Publications (1)

Publication Number Publication Date
CN110828334A true CN110828334A (zh) 2020-02-21

Family

ID=67658597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910732982.6A Pending CN110828334A (zh) 2018-08-09 2019-08-09 基板用清洗件、基板清洗装置、基板处理装置、基板处理方法以及基板用清洗件的制造方法

Country Status (7)

Country Link
US (1) US11424138B2 (https=)
EP (1) EP3608948A1 (https=)
JP (1) JP7224128B2 (https=)
KR (1) KR102661661B1 (https=)
CN (1) CN110828334A (https=)
SG (1) SG10201907194RA (https=)
TW (1) TWI808227B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022193542A1 (zh) * 2021-03-19 2022-09-22 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7166132B2 (ja) 2018-10-12 2022-11-07 株式会社荏原製作所 基板洗浄部材および基板洗浄装置
US11335588B2 (en) * 2019-06-18 2022-05-17 Ebara Corporation Substrate holding apparatus and substrate processing apparatus
JP7641714B2 (ja) * 2020-08-19 2025-03-07 株式会社荏原製作所 洗浄具のクリーニング方法、装置、基板洗浄装置及び洗浄具の製造方法
US11823916B2 (en) * 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
JP7508426B2 (ja) * 2021-09-14 2024-07-01 芝浦メカトロニクス株式会社 洗浄装置
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
KR102634959B1 (ko) * 2023-09-05 2024-02-08 주식회사 유일로보틱스 복합 비젼 검사기능을 가진 협동 로봇

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) * 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines
US6041465A (en) * 1997-12-19 2000-03-28 Speedfam Co., Ltd. Cleaning apparatus
US20020173259A1 (en) * 2001-04-20 2002-11-21 Drury Thomas J. Polyvinyl acetal composition roller brush with abrasive outer surface
US20050000652A1 (en) * 2003-07-02 2005-01-06 Chaqng-Hyeon Nam Apparatus and method for treating edge of substrate
US20070224811A1 (en) * 2006-03-16 2007-09-27 Xinming Wang Substrate processing method and substrate processing apparatus
CN101501823A (zh) * 2006-08-11 2009-08-05 日东电工株式会社 清洁部件、带清洁功能的搬送部件以及基板处理装置的清洁方法
CN105575851A (zh) * 2014-10-31 2016-05-11 株式会社荏原制作所 辊部件、笔部件以及基板处理装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6079073A (en) * 1997-04-01 2000-06-27 Ebara Corporation Washing installation including plural washers
JPH11283952A (ja) * 1998-03-30 1999-10-15 Shibaura Mechatronics Corp ブラシ洗浄装置
US6557202B1 (en) * 1999-12-03 2003-05-06 Lam Research Corporation Wafer scrubbing brush core having an internal motor and method of making the same
JP2002050607A (ja) * 2000-08-03 2002-02-15 Kaijo Corp 基板処理方法
EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
JP2007051234A (ja) * 2005-08-19 2007-03-01 Nisshin Shoji Kk 清浄コート剤、およびこれを用いた清浄コート用品
JP2007294809A (ja) 2006-04-27 2007-11-08 Sharp Corp 多孔質成長基板クリーニング装置およびシート状基板作製方法
US8234739B2 (en) * 2006-10-03 2012-08-07 Xyratex Technology Limited Spiral brush for cleaning and conveying a substrate
JP3140166U (ja) 2007-12-26 2008-03-13 宮川ローラー株式会社 導電性シリコーンローラ
JP2009238938A (ja) 2008-03-26 2009-10-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5267164B2 (ja) * 2009-01-30 2013-08-21 コニカミノルタビジネステクノロジーズ株式会社 電子写真感光体の表面研磨方法
WO2011052173A1 (ja) * 2009-10-30 2011-05-05 株式会社クラレ 研磨パッド及びケミカルメカニカル研磨方法
JP5478209B2 (ja) 2009-11-17 2014-04-23 Ｍｉｐｏｘ株式会社 研磨用具及び研磨用具の製造方法
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP5472344B2 (ja) * 2012-03-13 2014-04-16 ダイキン工業株式会社 Ｃｍｐ装置
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
CN111584354B (zh) 2014-04-18 2021-09-03 株式会社荏原制作所 蚀刻方法
JP2016064495A (ja) * 2014-09-24 2016-04-28 東洋ゴム工業株式会社 積層研磨パッド及びその製造方法
CN107078046B (zh) 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
JP6726575B2 (ja) 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6643942B2 (ja) 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) * 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines
US6041465A (en) * 1997-12-19 2000-03-28 Speedfam Co., Ltd. Cleaning apparatus
US20020173259A1 (en) * 2001-04-20 2002-11-21 Drury Thomas J. Polyvinyl acetal composition roller brush with abrasive outer surface
US20050000652A1 (en) * 2003-07-02 2005-01-06 Chaqng-Hyeon Nam Apparatus and method for treating edge of substrate
US20070224811A1 (en) * 2006-03-16 2007-09-27 Xinming Wang Substrate processing method and substrate processing apparatus
CN101501823A (zh) * 2006-08-11 2009-08-05 日东电工株式会社 清洁部件、带清洁功能的搬送部件以及基板处理装置的清洁方法
CN105575851A (zh) * 2014-10-31 2016-05-11 株式会社荏原制作所 辊部件、笔部件以及基板处理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022193542A1 (zh) * 2021-03-19 2022-09-22 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置

Also Published As

Publication number Publication date
EP3608948A1 (en) 2020-02-12
TWI808227B (zh) 2023-07-11
SG10201907194RA (en) 2020-03-30
KR102661661B1 (ko) 2024-05-02
JP7224128B2 (ja) 2023-02-17
US11424138B2 (en) 2022-08-23
US20200066549A1 (en) 2020-02-27
JP2020027807A (ja) 2020-02-20
TW202017079A (zh) 2020-05-01
KR20200018279A (ko) 2020-02-19

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