JP7185761B2 - 演算装置 - Google Patents

演算装置 Download PDF

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Publication number
JP7185761B2
JP7185761B2 JP2021506890A JP2021506890A JP7185761B2 JP 7185761 B2 JP7185761 B2 JP 7185761B2 JP 2021506890 A JP2021506890 A JP 2021506890A JP 2021506890 A JP2021506890 A JP 2021506890A JP 7185761 B2 JP7185761 B2 JP 7185761B2
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component
electronic component
imaging data
camera
holding
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JP2021506890A
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Japanese (ja)
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JPWO2020188745A1 (ja
Inventor
秀一郎 鬼頭
恵市 小野
賢志郎 西田
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2021506890A 2019-03-19 2019-03-19 演算装置 Active JP7185761B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/011465 WO2020188745A1 (fr) 2019-03-19 2019-03-19 Dispositif de calcul et dispositif d'entrée

Publications (2)

Publication Number Publication Date
JPWO2020188745A1 JPWO2020188745A1 (ja) 2021-10-28
JP7185761B2 true JP7185761B2 (ja) 2022-12-07

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ID=72520674

Family Applications (1)

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JP2021506890A Active JP7185761B2 (ja) 2019-03-19 2019-03-19 演算装置

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JP (1) JP7185761B2 (fr)
CN (1) CN113614488B (fr)
WO (1) WO2020188745A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001174221A (ja) 1999-12-16 2001-06-29 Juki Corp 部品位置検出方法及び装置
JP2012248717A (ja) 2011-05-30 2012-12-13 Fuji Mach Mfg Co Ltd 位置認識用カメラ及び位置認識装置
WO2018163385A1 (fr) 2017-03-09 2018-09-13 株式会社Ｆｕｊｉ Dispositif de reconnaissance de composant

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4087973B2 (ja) * 1999-02-26 2008-05-21 名古屋電機工業株式会社 実装部品の部品間検査方法およびその装置
JP2002329999A (ja) * 2001-05-02 2002-11-15 Matsushita Electric Ind Co Ltd 電子部品装着装置及び方法、並びに電子部品装着用プログラム
JP2007287838A (ja) * 2006-04-14 2007-11-01 Yamaha Motor Co Ltd 部品移載装置、実装機および部品検査機用部品移載装置
CN101936708B (zh) * 2010-08-13 2012-05-23 河海大学常州校区 Qfp芯片的定位检测方法
JP5779386B2 (ja) * 2011-04-19 2015-09-16 富士機械製造株式会社 電気部品装着機
JP5791408B2 (ja) * 2011-07-15 2015-10-07 富士機械製造株式会社 電子部品実装装置
CN102661708B (zh) * 2012-04-20 2014-05-07 华南理工大学 一种基于surf的高密度封装元器件定位方法
JP5988839B2 (ja) * 2012-11-15 2016-09-07 富士機械製造株式会社 部品実装機
CN103335609B (zh) * 2013-07-05 2016-01-20 中国科学院光电技术研究所 一种光学面形数据旋转中心、旋转角度和平移量确定方法
JP6363863B2 (ja) * 2014-04-15 2018-07-25 キヤノン株式会社 情報処理装置および情報処理方法
CN104406585B (zh) * 2014-11-19 2017-04-05 中国计量学院 基于惯性检测的激光跟踪仪靶球定位系统
CN107407552B (zh) * 2015-03-06 2019-11-12 株式会社富士 识别装置及识别方法
CN107432111B (zh) * 2015-03-18 2020-05-26 株式会社富士 元件供给装置
CN105066892B (zh) * 2015-08-05 2017-07-28 哈尔滨工业大学 一种基于直线聚类分析的bga元件检测与定位方法
WO2017051446A1 (fr) * 2015-09-22 2017-03-30 富士機械製造株式会社 Système de fourniture de pièces
CN108709500B (zh) * 2018-05-11 2020-08-11 佛山科学技术学院 一种电路板元件定位匹配方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001174221A (ja) 1999-12-16 2001-06-29 Juki Corp 部品位置検出方法及び装置
JP2012248717A (ja) 2011-05-30 2012-12-13 Fuji Mach Mfg Co Ltd 位置認識用カメラ及び位置認識装置
WO2018163385A1 (fr) 2017-03-09 2018-09-13 株式会社Ｆｕｊｉ Dispositif de reconnaissance de composant

Also Published As

Publication number Publication date
WO2020188745A1 (fr) 2020-09-24
JPWO2020188745A1 (ja) 2021-10-28
CN113614488A (zh) 2021-11-05
CN113614488B (zh) 2023-09-01

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