JP7154336B2 - 切断装置、及び、切断品の製造方法 - Google Patents

切断装置、及び、切断品の製造方法 Download PDF

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Publication number
JP7154336B2
JP7154336B2 JP2021054223A JP2021054223A JP7154336B2 JP 7154336 B2 JP7154336 B2 JP 7154336B2 JP 2021054223 A JP2021054223 A JP 2021054223A JP 2021054223 A JP2021054223 A JP 2021054223A JP 7154336 B2 JP7154336 B2 JP 7154336B2
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Japan
Prior art keywords
blade
cut
cutting
height
unit
Prior art date
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Active
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JP2021054223A
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English (en)
Japanese (ja)
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JP2022151243A (ja
Inventor
啓人 望月
早織 礒野
和志 宮田
幹司 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2021054223A priority Critical patent/JP7154336B2/ja
Priority to PCT/JP2021/045465 priority patent/WO2022201660A1/ja
Priority to KR1020237026113A priority patent/KR20230124742A/ko
Priority to CN202180087814.1A priority patent/CN116710230A/zh
Priority to TW111109814A priority patent/TWI808684B/zh
Publication of JP2022151243A publication Critical patent/JP2022151243A/ja
Application granted granted Critical
Publication of JP7154336B2 publication Critical patent/JP7154336B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2021054223A 2021-03-26 2021-03-26 切断装置、及び、切断品の製造方法 Active JP7154336B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021054223A JP7154336B2 (ja) 2021-03-26 2021-03-26 切断装置、及び、切断品の製造方法
PCT/JP2021/045465 WO2022201660A1 (ja) 2021-03-26 2021-12-10 切断装置、及び、切断品の製造方法
KR1020237026113A KR20230124742A (ko) 2021-03-26 2021-12-10 절단 장치 및 절단품의 제조 방법
CN202180087814.1A CN116710230A (zh) 2021-03-26 2021-12-10 切断装置、以及切断物品的制造方法
TW111109814A TWI808684B (zh) 2021-03-26 2022-03-17 切斷裝置、及切斷物品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021054223A JP7154336B2 (ja) 2021-03-26 2021-03-26 切断装置、及び、切断品の製造方法

Publications (2)

Publication Number Publication Date
JP2022151243A JP2022151243A (ja) 2022-10-07
JP7154336B2 true JP7154336B2 (ja) 2022-10-17

Family

ID=83396675

Family Applications (1)

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JP2021054223A Active JP7154336B2 (ja) 2021-03-26 2021-03-26 切断装置、及び、切断品の製造方法

Country Status (5)

Country Link
JP (1) JP7154336B2 (ko)
KR (1) KR20230124742A (ko)
CN (1) CN116710230A (ko)
TW (1) TWI808684B (ko)
WO (1) WO2022201660A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7498817B1 (ja) 2023-03-02 2024-06-12 Ｔｏｗａ株式会社 切断装置、切断方法、及び切断品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003173986A (ja) 2001-12-04 2003-06-20 Disco Abrasive Syst Ltd ２スピンドル切削装置における切削方法
JP2003211350A (ja) 2002-01-18 2003-07-29 Tokyo Seimitsu Co Ltd ダイシング装置及びカッターセット方法
JP2006286694A (ja) 2005-03-31 2006-10-19 Murata Mfg Co Ltd ダイシング装置およびダイシング方法
JP2008166546A (ja) 2006-12-28 2008-07-17 Disco Abrasive Syst Ltd 切削ブレードの先端形状検査方法
JP2016213240A (ja) 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2019040899A (ja) 2017-08-22 2019-03-14 Ｔｏｗａ株式会社 加工装置及び加工方法
JP2019129282A (ja) 2018-01-26 2019-08-01 株式会社ディスコ 切削装置のセットアップ方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3401975B2 (ja) * 1995-02-14 2003-04-28 ソニー株式会社 ダイシング方法
JP7391465B2 (ja) 2019-03-26 2023-12-05 株式会社ディスコ パッケージチップの製造方法
JP7229640B2 (ja) * 2019-04-12 2023-02-28 株式会社ディスコ 切削装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003173986A (ja) 2001-12-04 2003-06-20 Disco Abrasive Syst Ltd ２スピンドル切削装置における切削方法
JP2003211350A (ja) 2002-01-18 2003-07-29 Tokyo Seimitsu Co Ltd ダイシング装置及びカッターセット方法
JP2006286694A (ja) 2005-03-31 2006-10-19 Murata Mfg Co Ltd ダイシング装置およびダイシング方法
JP2008166546A (ja) 2006-12-28 2008-07-17 Disco Abrasive Syst Ltd 切削ブレードの先端形状検査方法
JP2016213240A (ja) 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2019040899A (ja) 2017-08-22 2019-03-14 Ｔｏｗａ株式会社 加工装置及び加工方法
JP2019129282A (ja) 2018-01-26 2019-08-01 株式会社ディスコ 切削装置のセットアップ方法

Also Published As

Publication number Publication date
CN116710230A (zh) 2023-09-05
JP2022151243A (ja) 2022-10-07
TWI808684B (zh) 2023-07-11
TW202238793A (zh) 2022-10-01
KR20230124742A (ko) 2023-08-25
WO2022201660A1 (ja) 2022-09-29

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