JP7154336B2 - CUTTING DEVICE AND METHOD FOR MANUFACTURING CUTTING GOODS - Google Patents

Description

TECHNICAL FIELD The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Application Laid-Open No. 2020-161615 (Patent Document 1) discloses a method for manufacturing a package chip. In this manufacturing method, the package substrate is cut with the first cutting blade along the dividing line to form a half-cut groove (half-cut step). After that, the full cut step is performed through the step of plating the electrodes of the package substrate. In the full-cut step, half-cut grooves are cut by a second cutting blade to obtain a plurality of package chips separated from each other. The second cutting blade has a thinner blade thickness than the first cutting blade. As a result, the amount of burrs remaining between package chips can be reduced (see Patent Document 1).

JP 2020-161615 A

In the step of forming half-cut grooves in an object to be cut, such as a package substrate, it is important to form half-cut grooves with less variation in depth. However, the blade for forming the half-cut grooves wears while cutting along a predetermined line, causing variations in the depth of the half-cut grooves in the same cutting object. Japanese Patent Application Laid-Open No. 2002-200001 does not disclose a means for solving such a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and an object of the present invention is to provide a cutting apparatus capable of reducing variations in the depth of grooves formed on an object to be cut by half-cutting, and The object is to provide a method for manufacturing a cut product.

A cutting device according to one aspect of the present invention is a cutting device configured to form a half-cut groove in an object to be cut by cutting the object in the thickness direction, the table and the blade It comprises an attached spindle section, a detection section, and a control section. A table holds a cutting object. The blade forms a groove pattern composed of half-cut grooves in the object to be cut by moving relative to the table while cutting the object to be cut. The detector detects the height of the blade with respect to the table. The controller controls the position of the blade in the height direction. The control unit causes the detection unit to detect the height of the blade according to the length of the cutting object cut by the blade while the blade forms the groove pattern on one cutting object, and the detected height is stored in advance. Correct the vertical position of the blade if it does not meet the specified requirements.

A method for manufacturing a cut product according to another aspect of the present invention is a manufacturing method for manufacturing a cut product by cutting an object to be cut in the thickness direction, and includes the following steps.
A step of forming a groove pattern composed of half-cut grooves in the object to be cut by using the first blade that moves relative to the object to be cut while cutting the object to be cut.
- Using a second blade, which is thinner than the first blade, to cut the object to be cut along the groove pattern formed in the object to be cut, thereby obtaining cut pieces separated from each other.
The step of forming the groove pattern includes the step of detecting the height of the blade according to the length of the cutting object cut by the first blade, and the step of detecting whether the detected height satisfies a predetermined requirement. If not, correcting the height position of the blade.

ADVANTAGE OF THE INVENTION According to this invention, the cutting apparatus which can reduce the variation in the depth of the groove|channel formed on a cutting target by half cutting, and the manufacturing method of a cut product can be provided.

The figure which shows typically a part of plane of the cutting device which concerns on embodiment. The schematic diagram which looked at a part of cutting device which concerns on embodiment from the side. 1 is a block diagram showing an electrical configuration of a cutting device according to an embodiment; FIG. The perspective view which shows a semiconductor package typically. 4A and 4B are diagrams for explaining a method for forming a stepped portion; 4A and 4B are diagrams for explaining a method for forming a stepped portion; 4 is a flow chart showing the flow of a series of cutting operations of the cutting device. FIG. 5 is a diagram for explaining a method of height detection by a detection unit; FIG. 5 is a diagram for explaining another method of height detection by the detection unit;

Hereinafter, embodiments according to one aspect of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated. In addition, each drawing is schematically drawn by appropriately omitting or exaggerating objects for easy understanding. Also, the direction indicated by each arrow in each drawing is common to each drawing.

<1. First Embodiment>
[Overview]
FIG. 1 is a diagram schematically showing a part of the plane of the cutting device 1 according to the first embodiment. The cutting device 1 is configured to cut an object to be cut. Here, the concept of the term "cutting" includes separating an object to be cut into a plurality of singulated pieces and removing a portion of the object to be cut. Hereinafter, cutting that separates an object to be cut into a plurality of individual cut pieces may be referred to as full-cutting, and cutting that removes a portion of the object to be cut in the thickness direction may be referred to as half-cutting.

In this embodiment, the object to be cut is the package substrate 4, and the cut product is the semiconductor package 40 (see FIG. 4). The semiconductor package 40 will be described later.

As shown in FIG. 1 , the cutting apparatus 1 manufactures a plurality of semiconductor packages 40 by cutting the package substrate 4 . A plurality of manufactured semiconductor packages 40 are further sent to the next step. The configuration of the cutting device 1 will be described below.

<1-1. Cutting device>
FIG. 2 is a diagram schematically showing part of the cutting device 1 seen from the side, and FIG. 3 is a block diagram showing the electrical configuration of the cutting device 1. As shown in FIG. As shown in FIGS. 1-3, the cutting device 1 mainly comprises a cutting unit 10, a holding unit 20, a detection unit 30 and a control unit 50. As shown in FIGS. It goes without saying that the cutting device 1 may be provided with units other than those described above. For example, the cutting apparatus 1 includes a substrate supply unit that supplies the package substrate 4, an inspection unit that inspects the package substrate 4 and/or the semiconductor packages 40, a cleaning unit that cleans and/or dries the cut semiconductor packages 40, a cut A transport unit or the like that transports the semiconductor package 40 to the storage unit may be provided. Configurations of the cutting unit 10, the holding unit 20, the detection unit 30, and the control unit 50 will be described below.

[Cutting unit]
As shown in FIGS. 1 and 2 , the cutting unit 10 is arranged above the holding unit 20 and configured to cut the package substrate 4 . The cutting unit 10 includes a blade 101 , a spindle section 102 , and a moving mechanism (not shown) that moves the spindle section 102 to a desired position within the cutting device 1 . The cutting device 1 may have a twin-spindle configuration with a pair of spindle portions 102 or a single-spindle configuration with only one spindle portion 102 . The spindle unit 102 is moved along the X-axis and Z-axis in FIGS. 1 and 2 by a moving mechanism (not shown). The operation of the movement mechanism, that is, the movement of the spindle section 102 and the position in the X-axis and Z-axis directions is controlled by a control section 500, which will be described later. Below, the Z-axis direction in FIGS. 1 and 2 may be referred to as the height direction of the spindle portion 102 or the blade 101 .

The blade 101 is an annular blade and is detachably attached to the tip of the spindle portion 102 . Thereby, the blade 101 moves along the X-axis and the Z-axis in FIGS. 1 and 2 together with the spindle portion 102 .

The blade 101 attached to the spindle portion 102 is configured to perform half-cutting and full-cutting on the package substrate 4 by rotating at high speed with the rotation transmitted from the spindle portion 102 . Hereinafter, the half-cut blade is referred to as the first blade 101A, and the full-cut blade is referred to as the second blade 101B. The first blade 101A has a first thickness and the second blade 101B has a second thickness less than the first thickness. That is, the second blade 101B is thinner than the first blade 101A. It should be noted that a blade 101 is simply referred to when it corresponds to both the first blade 101A and the second blade 101B. In this embodiment, either the first blade 101A or the second blade 101B is attached to the spindle portion 102 to perform cutting.

The first blade 101A is made of a conductive material, and is electrically conductive with the spindle portion 102 when attached to the spindle portion 102 . The spindle section 102 is electrically connected to a detection circuit 301 which will be described later.

When half-cutting the package substrate 4, the first blade 101A cuts the package substrate 4 and moves relative to a table 201, which will be described later, to remove a portion of the package substrate 4 in its thickness direction. be. As a result, a portion of the package substrate 4 is removed in its thickness direction by the first blade 101A. As a result, a half-cut groove G1 extending in the longitudinal direction of the package substrate 4 and a half-cut groove G2 extending in the lateral direction of the package substrate 4 are formed on the package substrate 4 (see FIG. 5A). On the other hand, when performing a full cut on the package substrate 4, the second blade 101B moves relative to the table 201 while cutting the package substrate 4 along the groove pattern. As a result, the portions corresponding to the half-cut grooves G1 and G2 are separated, and the package substrate 4 is singulated into a plurality of separated semiconductor packages 40 .

[Holding unit]
The holding unit 20 is configured to hold the package substrate 4 . Holding unit 20 includes moving mechanism 203 , table 201 , and rubber 202 arranged on table 201 . The cutting device 1 may have a twin cut table configuration having two holding units 20, may have one holding unit 20, or may have three or more holding units 20. good. The package substrate 4 is held by the holding unit 20 and cut along its longitudinal direction and transverse direction while moving relative to the blade 101 .

The rubber 202 is a plate-like member made of rubber, and has a plurality of holes formed therein. A package substrate 4 is arranged on the rubber 202 . The holding unit 20 does not necessarily include the rubber 202 . For example, the rubber 202 may be omitted, or another member may be included instead of the rubber 202 .

The table 201 holds the package substrate 4 by sucking the package substrate 4 placed on the rubber 202 from the lower package surface side. The table 201 is rotatable in the θ direction in the drawing and movable along the Y axis in the drawing by a moving mechanism 203 .

A moving mechanism 203 is disposed below the table 201 and is configured to move the table 201 along the Y-axis of the figure. Operations of the table 201 and the moving mechanism 203 are controlled by a control unit 50, which will be described later.

[Detection unit]
The detection unit 30 is used to detect the positions of the spindle portion 102 and the first blade 101A in the height direction (Z-axis direction). The detection unit 30 is an example of the detection section of the present invention, and includes a CCS (Contact Cutter Setup) block 300 , a detection circuit 301 and a detection device 302 . CCS block 300 is an example of the contactor of the present invention, and is made of a conductive material. In this embodiment, the CCS block 300 is attached to the side of the table 201 so that the height of the top surface of the CCS block 300 matches the height of the top surface of the table 201 . That is, the CCS block 300 of this embodiment can move together with the table 201 .

The detection circuit 301 is a circuit configured to be energized when the first blade 101A contacts the upper surface of the CCS block 300, is electrically connected to the CCS block 300 and the spindle section 102, and the detection device 302 is incorporated therein. be The detection circuit 301 is configured to apply a constant voltage to the CCS block 300 and the spindle section 102 from a power supply (not shown). The detection device 302 detects a change in the state of conduction due to the energization of the detection circuit 301, in other words, the contact between the first blade 101A (more precisely, the edge of the first blade 101A) and the CCS block 300, which will be described later. Notifies the control unit 500 to do so. The control unit 500 controls the position of the spindle unit 102 in the height direction, and gradually brings the spindle unit 102 closer to the upper surface of the CCS block 300 from a certain coordinate in the height direction as a starting point. The control unit 500 recognizes the coordinate in the height direction of the spindle unit 102 when contact between the first blade 101A and the CCS block 300 is detected as the end point. As a result, the height of the spindle portion 102 at the starting point, and thus the height of the first blade 101A, is detected with the upper surface of the CCS block 300 as a reference. The height of the top surface of the CCS block 300 with respect to the table 201 is stored in the cutting device 1 in advance.

Detection of the heights of the spindle portion 102 and the first blade 101A by the detection unit 30 is performed, for example, after the new first blade 101A is attached to the spindle portion 102 and before half-cutting is started. The height detected at this timing is stored in the control unit 50 as a reference height. In addition to this, the height detection by the detection unit 30 is also performed at the detection timing during half-cutting. The amount of deviation of the height from the reference height detected during half-cutting indicates the amount of change in the diameter of the first blade 101A, that is, the amount of wear of the first blade 101A. Therefore, it can be said that the detection unit 30 detects the wear state of the first blade 101A during half-cutting. Note that the "predetermined requirement" in the present invention means, for example, that the amount of deviation between the reference height and the height detected at the detection timing is less than a predetermined threshold.

[Controller unit]
The control unit 50 is electrically connected to the cutting unit 10, the holding unit 20 and the detection unit 30 and is configured to control the operation of each unit 10-30. The control unit 50 may be configured integrally with the units 10-30, or may be configured separately from the units 10-30. As shown in FIG. 3 , the control unit 50 includes a control section 500 , a display section 501 , an input section 502 and a storage section 503 .

The control unit 500 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like. The ROM stores an operation program 5000 for controlling the operation of each unit 10-30. The CPU reads and executes the operation program 5000 from the ROM. The ROM is appropriately used for arithmetic processing of the CPU. Note that the operation program 5000 may be stored in the storage unit 503 instead of the ROM.

The display unit 501 is configured to display, for example, various types of information to the user, and is configured to display a user interface screen for receiving input of cutting parameters and detection parameters described later from the user. The display unit 501 can be implemented in any form such as a liquid crystal display element, a liquid crystal display, an organic EL display, a touch panel display, or the like.

The input unit 502 is configured to receive user input of cutting parameters and detection parameters, which will be described later. The input unit 502 can be implemented in any form such as a keyboard, push button, touch panel display, or the like. When the input unit 502 is implemented by a touch panel display, the input unit 502 may also serve as the display unit 501 .

The cutting parameter is a parameter that specifies the position where the package substrate 4 should be cut. Since the package substrate 4 is usually cut according to a grid-like cutting pattern, the grid-like cutting pattern is determined by determining the cutting parameters. As a result, when half-cutting is performed according to the cutting parameters, a groove pattern corresponding to the cutting pattern, which is composed of the half-cut grooves G1 and G2, is formed in the package substrate 4. FIG. Cutting parameters include, but are not limited to, the length of the package substrate 4 in the longitudinal direction and the length in the lateral direction, the number of half-cut grooves G1 and G2 to be formed in the longitudinal direction and the lateral direction of the package substrate 4. , and a numerical value specifying the depth of the half-cut grooves G1 and G2. The length in the longitudinal direction of the package substrate 4 matches the length of the half-cut groove G1, and the length in the width direction matches the length of the half-cut groove G2.

The detection parameter is a parameter for setting the detection timing for detecting the wear state of the first blade 101A. Since the wear of the first blade 101A progresses according to the length of the half-cut (cutting distance), the detection parameter according to this embodiment is specified as a predetermined length. In other words, the cutting device 1 is configured such that the detection timing comes each time the first blade 101A cuts half-cut to a length corresponding to the detection parameter. The length as a detection parameter can be selected as appropriate. can be suppressed within a preferable range.

Cutting parameters and detection parameters are input via the input unit 502 and stored in the RAM or storage unit 503 . The control unit 500 can predetermine the detection timing based on the stored cutting parameters and detection parameters. For example, the control unit 500 sets the timing at which the total length of cutting distances for the half-cut grooves G1 and G2 formed after the start of half-cutting reaches a predetermined length for the first time as the first detection timing. be able to. Further, the control unit 500 detects the timing at which the total length of the cutting distances for the half-cut grooves G1 and G2 formed after the first detection timing reaches a predetermined length for the first time. can be timing. In this way, the control unit 500 sets the detection timing during the formation of the groove pattern composed of the plurality of half-cut grooves G1 and G2 to once during the formation of the groove pattern on the same package substrate 4. Or set multiple times. The controller 500 thereby causes the detection unit 30 to detect the height of the first blade 101A according to the length of the package substrate 4 cut by the first blade 101A.

As mentioned above, the detection parameter can be length. However, the detection timing based on this is preferably the timing after one half-cut groove G1 or G2 is formed, not the timing in the middle of forming one half-cut groove G1 or G2. That is, the wear of the first blade 101A is detected not during the formation of one half-cut groove G1 or G2, but after the formation of one half-cut groove G1 or G2 is completed, and the next half-cut groove G1 or G2 is detected. is preferably performed before the formation of

The control section 500 controls the cutting operations of the cutting unit 10 and the holding unit 20 based on the cutting parameters and detection parameters. The control unit 500 controls the height position of the spindle unit 102 (first blade 101A) so that the depths of the half-cut grooves G1 and G2 are the depths specified by the cutting parameters. This height position may be corrected according to the wear state of the first blade 101A detected at the detection timing, as will be described later. The controller 500 causes the holding unit 20 holding the package substrate 4 to enter below the rotating first blade 101A and move it in the Y-axis direction, thereby forming the first half-cut groove G1. Next, the control unit 500 moves the spindle unit 102 in the X-axis direction by a distance corresponding to one grid in the cutting pattern. Then, the control section 500 again enters the holding unit 20 under the first blade 101A and moves it in the Y-axis direction to form the second half-cut groove G1. By repeating this, a plurality of half-cut grooves G1 are formed in the package substrate 4 according to the cutting parameters.

After that, the control section 500 rotates the table 201 by 90 degrees and operates the cutting unit 10 and the holding unit 20 in the same manner. As a result, a plurality of half-cut grooves G2 are further formed in the package substrate 4 according to the cutting parameters. The order of forming the half-cut grooves G1 and G2 may be reversed.

The controller 500 counts the number of formed half-cut grooves G1 and G2 based on, for example, the number of times the spindle section 102 moves, the number of times the holding unit 20 moves, and the number of times the table 201 rotates. Thereby, the control section 500 can determine whether or not the detection timing has come each time one half-cut groove G1 or G2 is formed.

<1-2. Package substrate>
The type of the package substrate 4 targeted in this embodiment is not particularly limited, but is, for example, a wettable QFN (Quad Flat No-leaded) package substrate. By half-cutting and full-cutting the package substrate 4, a semiconductor package 40 as shown in FIG. 4 is manufactured. Here, the package substrate 4 is obtained by resin-molding a substrate to which electronic elements such as a semiconductor chip, a resistance element, and a capacitor element are connected so as to seal at least the electronic elements with resin. A lead frame and a printed wiring board can be used as a substrate constituting the package substrate 4. In addition to these, a semiconductor substrate, a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, etc. can be used. can be done. Moreover, the substrate constituting the package substrate 4 may or may not be wired.

As shown in FIG. 4, in the semiconductor package 40, a stepped portion 41 is formed at the boundary between the upper surface (the surface on which the terminals 42 are formed) and the side surface. When the semiconductor package 40 is surface-mounted, solder enters the stepped portion 41 . Thereby, a three-dimensional solder connection structure can be realized for the semiconductor package 40 . Further, since the solder has entered the stepped portion 41, the solder fillet can be easily observed from the side surface of the semiconductor package 40 in the appearance inspection after mounting. Thus, the semiconductor package 40 has various advantages.

5A and 5B are diagrams illustrating a method of forming the stepped portion 41. FIG. First, the first blade 101A having a first thickness forms half-cut grooves G1 and G2 on the package substrate 4 along the grid-like cutting pattern already described. Then, as shown in FIG. 5A, a lattice groove pattern composed of a plurality of half-cut grooves G1 and G2 is formed on the package substrate 4. As shown in FIG. Note that a peripheral edge portion 4A outside the dashed-dotted line shown in FIG. 5A indicates a region that does not include a semiconductor chip or the like and does not become the semiconductor package 40 after full cutting. The cutting parameters are appropriately set so that the peripheral portion 4A is formed.

FIG. 5B is a schematic cross-sectional view of the vicinity of half-cut grooves G1 and G2. After forming the groove pattern, the second blade 101B fully cuts the package substrate 4 at the position P1 to separate the package substrate 4 into pieces. The position P1 is preferably the center of the half-cut grooves G1 and G2. As a result, a plurality of semiconductor packages 40 having stepped portions 41 are manufactured. Note that the cross-sectional shape of the half-cut grooves G1 and G2 is not limited to the shape shown in FIG. 5B.

When forming a groove pattern on the package substrate 4 by half-cutting, it is important to form the half-cut grooves G1 and G2 with uniform depths on the package substrate 4, and high precision is required. However, since the wear of the first blade 101A progresses even while the groove pattern composed of the half-cut grooves G1 and G2 is being formed, the depth of the half-cut grooves G1 and G2 may vary even on the same package substrate 4. There is Here, the depth of the half-cut grooves G1 and G2 means the length from the upper surface of the package substrate 4 to the lowest position of the half-cut grooves G1 and G2.

According to the cutting device 1, the wear of the first blade 101A is detected even during half-cutting, and the height adjustment of the first blade 101A is controlled as necessary. can be suppressed within a certain range. The operation of the cutting device 1 will be described below.

<1-3. Operation of Cutting Device>
FIG. 6 is a flow chart showing a series of cutting operations performed by the cutting device 1 when forming a groove pattern on the package substrate 4. As shown in FIG. The cutting operation shown in FIG. 6 starts, for example, at the timing when the first blade 101A is attached to the spindle portion 102. As shown in FIG.

In step S1, the reference height in the height direction of the spindle portion 102, that is, the first blade 101A is detected. The control unit 500 first moves the spindle unit 102 relative to the holding unit 20 and arranges it above the CCS block 300 . Then, as shown in FIG. 7, the position of the spindle portion 102 in the height direction is gradually lowered to bring the first blade 101A into contact with the upper surface of the CCS block 300. Then, as shown in FIG. At this time, as the contact point on the upper surface of the CCS block 300, a point that has never been contacted by the first blade 101A is selected. This is because there is a possibility that the location where the first blade 101A has come into contact may be damaged and not flat. The control unit 500 saves the detected reference height coordinates in the RAM or the storage unit 503 . Step S1 is an example of "the step of setting the reference height of the first blade" of the present invention.

In step S<b>2 , the user inputs detection parameters and cutting parameters via the input unit 502 . Control unit 500 stores these input parameters in RAM or storage unit 503 . Also, the control unit 500 determines the detection timing based on these parameters.

In step S3, in the cutting device 1, the control section 500 controls the operations of the cutting unit 10 and the holding unit 20, and half-cutting is performed to form a groove pattern following the cutting pattern. That is, in step S3, the cutting device 1 forms the half-cut groove G1 or G2 in the package substrate 4 using the first blade 101A that moves relative to the package substrate 4 while cutting the package substrate 4. FIG. After one half-cut groove G1 or G2 is formed by the first blade 101A, step S4 is executed.

In step S4, the control unit 500 determines whether or not the detection timing has arrived, in other words, whether or not the length of the cut of the package substrate 4 by the first blade 101A has reached a predetermined length as a detection parameter. to judge. When the control unit 500 determines that the detection timing has not yet arrived, the process returns to step S3 to form the next half-cut groove G1 or G2. On the other hand, when the control unit 500 determines that the detection timing has arrived, the next step S5 is executed.

In step S5, half-cutting (the process of forming a groove pattern) in the cutting device 1 is interrupted. Specifically, the control unit 500 transmits a signal for suspending half-cutting to the cutting unit 10 and the holding unit 20, and puts the cutting unit 10 and the holding unit 20 into a state of temporarily suspending half-cutting.

In step S6, the control section 500 causes the detection unit 30 to detect the height of the spindle section 102 (first blade 101A). The controller 500 brings the first blade 101A into contact with the upper surface of the CCS block 300 in the same manner as in step S1. At this time, for the reason described above, the contact point on the upper surface of the CCS block 300 is selected to be a point that the first blade 101A has never been in contact with. Control unit 500 stores the detected height coordinates in RAM or storage unit 503 .

In subsequent step S7, the control unit 500 adjusts the height of the first blade 101A based on the coordinates of the height of the spindle unit 102 (first blade 101A) at the detection timing and the coordinates of the reference height detected in step S1. The amount of deviation of the detected height from the reference height, which is the amount of wear, is calculated.

In subsequent step S8, the controller 500 determines whether the detected height satisfies a predetermined requirement, that is, determines whether the calculated wear amount (height deviation amount) of the first blade 101A is determined in advance. It is determined whether or not it is less than the threshold. If it is determined that the amount of wear is equal to or greater than the threshold and the detected height does not satisfy the requirements, the next step S9 is executed. The threshold value can be appropriately set based on the allowable variation range of the depths of the half-cut grooves G1 and G2 within the same package substrate 4, and is, for example, 10 μm. The threshold is stored in advance in the storage unit 503 or RAM.

In step S9, the control section 500 corrects the position of the spindle section 102 (first blade 101A) in the height direction according to the amount of wear. That is, the control unit 500 moves the spindle unit 102 downward by the amount of wear of the first blade 101A. After that, step S10 is executed.

On the other hand, if it is determined in step S8 that the detected height satisfies the predetermined requirement, that is, the amount of wear is less than the threshold value, the control unit 500 changes the position of the spindle unit 102 in the height direction. No correction. The control section 500 transmits a signal for resuming half-cutting (the process of forming a groove pattern) to the cutting unit 10 and the holding unit 20, and cancels the temporarily interrupted state of the cutting unit 10 and the holding unit 20. Then, the process returns to step S3 to form the next half-cut groove G1 or G2.

In step S10, the cutting device 1 resumes half-cutting (the process of forming a groove pattern). Specifically, the control section 500 transmits a signal for resuming half-cutting to the cutting unit 10 and the holding unit 20, and cancels the temporary interruption state of the cutting unit 10 and the holding unit 20. FIG.

In step S11, the control section 500 determines whether or not to end the half-cut. When the formation of the groove pattern planned by the cutting parameters is completed, the control unit 500 determines that the half-cut is finished, and the cutting operation by the cutting device 1 is finished. On the other hand, if the formation of the groove pattern has not been completed, the control section 500 determines to continue the half-cut. Then, step S3 is executed again. In this case, steps S3 to S11 are repeated until the control unit 500 determines that the half-cut is finished in step S11, that is, until the formation of the groove pattern according to the cutting pattern is completed. Steps S3 to S11 of the present invention form a groove pattern composed of half-cut grooves on a cutting object using a first blade that moves relatively to the cutting object while cutting the cutting object. This is an example of a "forming step".

The cutting device 1 can further perform a full cut after the cutting operation shown in FIG. 6 is finished. In this case, the blade is replaced, and the second blade 101B is attached to the spindle portion 102 instead of the first blade 101A. Then, a full cut is performed by the second blade 101B after replacement. The second blade 101B cuts and separates the package substrate 4 in the thickness direction according to the formed groove pattern. Thereby, a plurality of individualized semiconductor packages 40 are obtained. This full-cut step is performed by cutting the object to be cut along the groove pattern formed in the object to be cut using the second blade thinner than the first blade of the present invention, thereby cutting the object to be cut apart from each other. This is an example of the step of obtaining goods. The semiconductor package 40 after full cutting, including the portion that was the peripheral portion 4A of the package substrate 4, may be sent to another unit provided in the cutting apparatus 1. FIG.

<1-4. Features>
As described above, in the cutting apparatus 1 according to the first embodiment, while the first blade 101A forms a groove pattern on the package substrate 4, the wear amount of the first blade 101A is detected at the detection timing, and if necessary The height position of the first blade 101A is corrected. As a result, the wear amount of the first blade 101A can be appropriately managed, and variations in the depths of the half-cut grooves G1 and G2 formed on the same package substrate 4 can be suppressed.

According to the cutting device 1, wear detection of the first blade 101A at the detection timing is performed using contact height detection by the CCS block 300. FIG. Thereby, the wear amount of the first blade 101A can be detected more accurately. Further, since the CCS block 300 is attached to the side of the table 201, wear detection can be performed efficiently. Furthermore, since the CCS block 300 is arranged so that the height of the top surface of the CCS block 300 and the height of the top surface of the table 201 match, the height can be detected with higher accuracy.

<2. Second Embodiment>
The cutting device 1 according to the first embodiment has a detection unit 30 including a CCS block 300, a detection circuit 301 and a detection device 302 as a detection section. However, the cutting device 1A according to the second embodiment is different from the first embodiment in that a detection unit 31 including a light emitting section 303 and a light receiving section 304 is provided as a detection section. That is, the wear of the first blade 101A was detected by a contact method using a contact in the cutting device 1, but in the cutting device 1A, the wear of the first blade 101A was detected by a non-contact method in which the first blade 101A is not brought into contact with the contact. Wear is detected. The configuration of the cutting device 1A will be described below, but the same reference numerals are given to the configurations common to the cutting device 1, and the description thereof will be omitted.

<2-1. Configuration>
As shown in FIG. 7, in the cutting device 1A, the light emitting section 303 and the light receiving section 304 are attached to face each other with a space in the X-axis direction. The distance between the light-emitting portion 303 and the light-receiving portion 304 is such that the first blade 101A can pass therethrough. The light-emitting portion 303 is configured to emit light toward the light-receiving portion 304 , and the light beam emitted by the light-emitting portion 303 reaches the light-receiving portion 304 .

Light emitting unit 303 includes a light emitting element. Examples of the light-emitting element include a light-projecting fiber of a fiber sensor, an LED, and the like. The light-emitting element is arranged to face a light-receiving element of the light-receiving section 304, which will be described later, and emits a light beam substantially parallel to the X-axis.

The light receiving section 304 includes a light receiving element. Examples of the light-receiving element include a light-receiving fiber of a fiber sensor and a light-receiving element that receives light emitted from an LED. The light-receiving element is arranged so as to face the light-emitting element of the light-emitting portion 303 and match the position of the light-emitting element in the Z-axis direction. In a state in which an object does not block the space between the light emitting element and the light receiving element, the light beam emitted by the light emitting element reaches the light receiving element. The light-receiving elements are configured to convert changes in light rays impinging on them into electrical signals.

If an object exists between the light-emitting element and the light-receiving element, the light beam emitted by the light-emitting element is blocked by the object and does not or hardly reaches the light-receiving element. As a result, the electrical signal emitted by the light-receiving element changes, and the existence of an object at the position of the light beam in the Z-axis direction is detected. When the object is the first blade 101A, the detection unit 31 detects a change in the light beam reaching the light receiving section 304, thereby detecting that the edge of the first blade 101A exists at the position of the light beam in the Z-axis direction. To detect. The control unit 500 is notified of the detection state of the change in the light beam by the detection unit 31 . As in the first embodiment, the control unit 500 gradually brings the spindle unit 102 closer to the light beam between the light emitting unit 303 and the light receiving unit 304 starting from a coordinate in the height direction. Based on the notification from the detection unit 31, the control unit 500 recognizes the coordinate in the height direction of the spindle unit 102 when the first blade 101A detects the light beam as the end point. Thereby, the height of the spindle portion 102 at the starting point and thus the height of the first blade 101A is detected.

The height of the light beam emitted by the light emitting unit 303 is stored in advance in the storage unit 503 or RAM.

At the detection timing, the control unit 500 gradually moves the first blade 101A downward while the first blade 101A exists between the light emitting unit 303 and the light receiving unit 304 in the X-axis direction. When the edge of the first blade 101A blocks the light beam emitted by the light emitting portion 303, the light receiving portion 304 detects this. Based on the notification from the detection unit 31, the control section 500 derives the height of the spindle section 102 (first blade 101A). The control unit 500 calculates the wear amount of the first blade 101A based on the reference height of the spindle portion 102 detected before the first blade 101A performs half-cutting and the height of the spindle portion 102 detected at the detection timing. Calculate Thereafter, similarly to the cutting device 1, the control section 500 corrects the height position of the spindle section 102 if necessary.

In the cutting device 1A, the detection unit 30 may detect the reference height of the spindle portion 102 detected before the start of half-cutting. In other words, the cutting device 1A may include the detection unit 31 in addition to the detection unit 30 . Further, in the cutting device 1A, the detection unit 31 may detect the reference height of the spindle portion 102 detected before starting the half-cut. In other words, the cutting device 1A may include the detection unit 31 instead of the detection unit 30 .

<2-2. Features>
According to the cutting device 1A, wear detection of the first blade 101A at the detection timing is performed by a non-contact method in which the first blade 101A is not brought into contact with the contactor. As a result, the wear state of the first blade 101A is managed without imposing a burden on the first blade 101A, and variations in depth of the half-cut grooves G1 and G2 are reduced.

<3. Variation>
Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the invention. For example, the following changes are possible. Also, the gist of the following modified examples can be combined as appropriate.

<3-1>
The configuration of the detection unit 30 is not limited to the configuration of the above embodiment, and can be changed as appropriate. For example, the table 201 itself may be configured as a contact. Also, the position of arranging the CCS block 300 as a contact is not limited to the above embodiment, and may be separated from the table 201, for example, and can be changed as appropriate. Also, the number of CCS blocks 300 provided in the cutting device is not particularly limited. Also, the configuration of the detection circuit 301 may be changed as appropriate.

<3-2>
The cutting parameters are not limited to the parameters exemplified in the above embodiments, and any type of parameters may be used as long as they can specify a cutting pattern. Further, when the type of the package substrate 4 and the cutting pattern correspond to each other, it is also possible to store in the control unit 50 in advance correspondence data indicating this correspondence. In this case, when the user inputs the type of the package substrate 4, the control unit 500 may be configured to call the corresponding cutting parameter from the correspondence data and perform control based on this.

<3-3>
The detection timing does not have to be calculated in advance by the control unit 500 . During half-cutting, the control unit 500 monitors the length of the half-cut by the first blade 101A based on the number of movements of the spindle unit 102 and the table 201, the number of rotations of the table 201, and the like. The detection timing may be timely determined according to the detection parameters.

<3-4>
The method of detecting light rays by the light emitting unit 303 and the light receiving unit 304 can be changed as appropriate. For example, the light-emitting unit 303 and the light-receiving unit 304 may be installed at the same position in the X-axis direction so that both the light-emitting element and the light-receiving element face the X-axis direction. In this case, for example, wear of the first blade 101A may be detected by the light receiving unit 304 detecting light rays emitted by the light emitting unit 303 and then reflected by the first blade 101A to reach the light receiving unit 304. Further, for example, a reflector for reflecting the light beam emitted by the light emitting unit 303 toward the light receiving unit 304 is provided at an appropriate position within the cutting device 1A, and the reflected light reaching the light receiving unit 304 is blocked by the first blade 101A. You may make it detect that.

<3-5>
The order in which steps S1 and S2 are performed may be reversed. That is, the detection of the reference height of the spindle section 102 may be performed after the detection parameters are input.

<3-6>
Operations of the cutting unit 10 and the holding unit 20 are not limited to the operations illustrated in the above embodiments. For example, the table 201 may only be rotated, and the package substrate 4 may be cut by moving the spindle 102 in the Y-axis direction. That is, the package substrate 4 may be cut by relatively moving the table 201 and the blade 101 .

<3-7>
In the above embodiments, the package substrate 4 is exemplified as the object to be cut, and the semiconductor package 40 is exemplified as the cut product. However, examples of the cutting object and the cut product are not limited to this.

<3-8>
In the above embodiment, the first blade 101A is replaced with the second blade 101B after half-cutting. However, when the cutting devices 1 and 1A are provided with two or more spindles 102, the second blade 101B may be attached to another spindle 102 in advance to perform a full cut without replacing the blade 101. . Further, after the half-cutting is finished and before the full-cutting is started, the package substrate 4 may be subjected to a process other than cutting, such as plating.

<3-9>
In the above embodiment, the "step of forming a groove pattern" in the present invention means, for example, steps S3 to S11 described above. In this case, "the step of forming a groove pattern" means a period between steps in which all half-cuts scheduled before full-cutting are performed. However, the cutting devices 1 and 1A may be configured to detect the height of the first blade 101A while one half-cut groove G1 or G2 is being formed. In this case, "the step of forming a groove pattern" means the period during which one half-cut groove G1 or G2 is formed.

The cutting devices 1 and 1A may be configured as devices dedicated to half-cutting, which only performs half-cutting. In this case, replacement of the blades of the cutting devices 1 and 1A can be omitted. A full cut using the second blade 101B may be performed using another device. That is, the step of obtaining cut products separated from each other by cutting the object to be cut along the groove pattern formed in the object to be cut using the second blade thinner than the first blade of the present invention. ' may be performed by a device other than the cutting devices 1 and 1A.

A number of embodiments of the invention have been illustratively described above. Accordingly, the detailed description and accompanying drawings have been disclosed for the purpose of illustrative description. Therefore, the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, the inclusion of such non-essential elements in the detailed description and accompanying drawings should not be construed as immediately identifying them as essential.

1 cutting device 1A cutting device 4 package substrate 10 cutting unit 20 holding unit 30 detection unit 40 semiconductor package 50 control unit 101 blade 101A first blade 102B second blade 201 table 300 CCS block 301 detection device 302 detection circuit 303 light emitting section 304 light receiving Part 500 Control part G1, G2 Half-cut groove

Claims (6)

A cutting device configured to form half-cut grooves in an object to be cut by cutting the object in the thickness direction,
a table holding the object to be cut;
a spindle unit to which a blade is mounted that forms a groove pattern composed of half-cut grooves in the object to be cut by moving relative to the table while cutting the object to be cut;
a detection unit that detects the height of the blade;
A control unit that controls the position of the blade in the height direction,
During the step of forming the groove pattern in one of the cutting objects, the control unit causes the detection unit to detect the height of the blade according to the length of the cutting object cut by the blade. and correcting the position of the blade in the height direction when the detected height does not satisfy a predetermined requirement ;
The detection unit has a contact having conductivity and a detection circuit configured to be energized when the blade is brought into contact with the contact,
The detection unit is configured to detect the height of the blade by detecting energization of the detection circuit.
cutting device. The contact is arranged on the side of the table,
2. A cutting device according to claim 1 . A cutting device configured to form half-cut grooves in an object to be cut by cutting the object in the thickness direction,
a table holding the object to be cut;
a spindle unit to which a blade is mounted that forms a groove pattern composed of half-cut grooves in the object to be cut by moving relative to the table while cutting the object to be cut;
a detection unit that detects the height of the blade;
a control unit that controls the position of the blade in the height direction;
with
During the step of forming the groove pattern in one of the cutting objects, the control unit causes the detection unit to detect the height of the blade according to the length of the cutting object cut by the blade. and correcting the position of the blade in the height direction when the detected height does not satisfy a predetermined requirement;
The detection unit has a light emitting unit that emits a light beam and a light receiving unit that the light beam emitted by the light emitting unit reaches,
The detection unit is configured to detect the height of the blade by detecting a change in the light beam reaching the light receiving unit due to blocking of the light beam by the blade or reflection of the light beam by the blade.
cutting device. A manufacturing method for manufacturing a cut product by cutting an object to be cut in the thickness direction,
forming a groove pattern composed of half-cut grooves in the object to be cut using a first blade that moves relatively to the object to be cut while cutting the object to be cut;
obtaining cut products separated from each other by cutting the object to be cut along the groove pattern formed in the object using a second blade that is thinner than the first blade;
including
Forming the groove pattern includes:
detecting the height of the first blade according to the length of the cutting object cut by the first blade;
correcting the height direction position of the first blade when the detected height does not satisfy a predetermined requirement ;
The step of detecting the height is performed when the length of the cutting object cut by the first blade reaches a predetermined length.
Production method. The predetermined requirement is that the amount of deviation of the detected height from the reference height is less than a predetermined threshold,
The manufacturing method according to claim 4 . further comprising setting the reference height of the first blade;
The step of setting the reference height is performed before the step of forming the groove pattern,
The manufacturing method according to claim 5 .

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