JP2019145637A - Processing device - Google Patents

Abstract

To provide a processing device in which there is no mistake in correction of lag of the street, and correction of lag of the processing groove including cut groove and split groove.SOLUTION: An image display section 38 for displaying the image captured by imaging means, a street correction button 40 for storing the amount of lag of a street 4 and a reference line L as a correction value, a processing groove button 42 for storing the amount of lag of a processing groove 54 and the reference line L as a correction value, a Y-axis actuation part 46 for actuating Y-axis feed means, a pair of movable wires 48 across the reference line L approaching the reference line L and leaving therefrom while keeping line symmetry, and a movable wire actuation part 50 for actuating the pair of movable wires are displayed in display means 20. When the interval of the pair of movable wires is not set at the interval recognized as the width of the street, error is notified upon touching the street correction button, and when the interval of the pair of movable wires is not set at the interval recognized as the width of the processing groove, error is notified upon touching the processing groove correction button.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a processing apparatus for forming a processing groove that divides a wafer formed on a surface by dividing a plurality of devices into streets into individual devices.

  A wafer in which devices such as IC and LSI are partitioned by streets (division planned lines) and formed on the surface is divided into individual devices by cutting the streets with a cutting device. Used for equipment.

  The cutting apparatus includes: a holding unit that holds a wafer; a cutting unit that rotatably includes a cutting blade that cuts a street of the wafer held by the holding unit; and a holding unit and a cutting unit that are relatively disposed in the X-axis direction. X-axis feeding means for cutting and feeding, Y-axis feeding means for indexing and feeding the holding means and the cutting means relative to the Y-axis direction orthogonal to the X-axis direction, and images of the wafer held by the holding means At least an imaging unit having a microscope having a reference line for detecting a cutting groove and a display unit are provided, and the street of the wafer can be cut with high accuracy (see, for example, Patent Document 1).

  That is, the display means includes an image display section for displaying an image captured by the imaging means, a street correction button for storing the amount of deviation between the street and the reference line as a correction value, and the deviation between the cutting groove and the reference line. A cutting groove correction button for storing the amount as a correction value, an X-axis operating unit that operates the X-axis feeding unit, a Y-axis operating unit that operates the Y-axis feeding unit, and a reference line that is symmetrical with respect to the reference line A pair of movable lines approaching and moving away from the line and a movable line actuating part that actuates the pair of movable lines are displayed, and the Y-axis actuating part is actuated to position the center of the street at the reference line and a pair of movable When the street correction button is touched when the line interval is positioned at the street width, the movement distance of the street is stored as a correction value in the Y-axis direction, and the reference line and stream are stored in the next street indexing feed. It is corrected to the center of the match.

  In addition, when the center of the cutting groove is positioned at the reference line by operating the Y-axis operating portion and the distance between the pair of movable lines is positioned at the width of the cutting groove, touching the cutting groove correction button causes the Y axis of the cutting groove to be touched. The movement distance in the direction is stored as a correction value in the Y-axis direction and corrected so that the reference line and the center of the cutting groove coincide with each other and the cutting groove is formed in the center of the street in the next street index feed.

JP 2014-113669 A

  However, if the center of the street is positioned at the reference line by operating the Y-axis actuator and the distance between the pair of movable lines is positioned at the width of the street, touching the cutting groove correction button will change the street correction value to the cutting groove. There is a problem that the street cannot be cut with high accuracy because it is stored as a correction value of the high-precision and cannot be indexed with high accuracy.

  Further, when the center of the cutting groove is positioned at the reference line by operating the Y-axis operating unit and the distance between the pair of movable lines is positioned at the width of the cutting groove, the correction value of the cutting groove is obtained by touching the street correction button. There is a problem that it is stored as a street correction value and the center of the street cannot be cut with high accuracy.

  The above-described problem may also occur in a laser processing apparatus that forms a dividing groove by irradiating a street with a laser beam.

  An object of the present invention made in view of the above-mentioned fact is to provide a machining apparatus that does not mistake the correction of the deviation of the street and the correction of the deviation of the machining groove including the cutting groove and the dividing groove.

  In order to solve the above problems, the present invention provides the following processing apparatus. That is, a processing apparatus for forming a processing groove that divides a wafer formed on a surface by dividing a plurality of devices into streets into individual devices, a holding means for holding the wafer, and a wafer held by the holding means Machining means for forming machining grooves in the streets, X-axis feeding means for relatively feeding the holding means and the machining means in the X-axis direction, and the holding means and the machining means in the X-axis direction. Y-axis feeding means for relatively indexing and feeding in the orthogonal Y-axis direction, imaging means having a microscope with a reference line for picking up an image of the wafer held by the holding means and detecting streets and machining grooves, and display means The display means stores an image display unit for displaying an image captured by the imaging means, and a deviation amount between the street and the reference line as a correction value. A treatment correction button, a machining groove correction button for storing a deviation amount between the machining groove and the reference line as a correction value, a Y-axis operation unit for operating the Y-axis feed means, and a line symmetry with the reference line interposed therebetween A pair of movable lines approaching and moving away from the reference line and a movable line actuating unit that operates the pair of movable lines are displayed, and the interval between the pair of movable lines is recognized as the width of the street. When the street correction button is touched when the interval is not set, an error is notified, and when the distance between the pair of movable lines is not set to the interval recognized as the width of the machining groove, the machining groove correction button It is a processing device that notifies an error when touching.

  Preferably, the position of the street displayed on the image display unit is moved to the reference line by operating the Y-axis operating unit and the movable line operating unit is operated to set the pair of movable lines to the street width. If the street correction button is touched in the case of matching, the moving distance of the street is stored as a street correction value, and the position of the machining groove displayed on the image display unit is operated on the reference line by operating the Y-axis operating unit. Touching the machining groove correction button when the movable line actuating unit is operated and the pair of movable lines is made to coincide with the width of the machining groove, the machining groove moving distance is stored as a machining groove correction value. Is done. The processing means is a cutting means provided with a cutting blade in a rotatable manner, and the processing groove is preferably a cutting groove.

  The processing apparatus provided by the present invention includes a holding means for holding a wafer, a processing means for forming a processing groove on a street of the wafer held by the holding means, and the holding means and the processing means in the X-axis direction. X-axis feed means for relatively machining feed, Y-axis feed means for relatively indexing and feeding the holding means and the machining means in the Y-axis direction orthogonal to the X-axis direction, and the holding means An image display unit that includes at least an imaging unit having a microscope having a reference line for capturing a wafer and detecting a street and a processing groove, and a display unit, and the display unit displays an image captured by the imaging unit A street correction button for storing a deviation amount between the street and the reference line as a correction value, a machining groove correction button for storing a deviation amount between the machining groove and the reference line as a correction value, and the Y Axis feed A Y-axis actuating unit that operates the stage, a pair of movable lines that are symmetrical with respect to the reference line and that approaches and separates from the reference line, and a movable line actuating unit that operates the pair of movable lines are displayed. When the distance between the pair of movable lines is not set to be recognized as the width of the street, an error is notified when the street correction button is touched, and the distance between the pair of movable lines is the width of the machining groove. If the processing groove correction button is touched when the interval is not set to be recognized as an error, an error is notified, so that the amount of deviation between the street and the reference line is not stored as the processing groove correction value, The amount of deviation between the groove and the reference line is not stored as a street correction value, and a highly accurate machining groove can be formed on the street by indexing and feeding with high accuracy.

The perspective view of a wafer. The perspective view of the processing apparatus comprised according to this invention. The perspective view of an imaging means and a wafer when correction | amendment is performed. The schematic diagram of the image displayed on the display means shown in FIG. The schematic diagram of the image before correction | amendment is performed. The schematic diagram of the image in the state which moved the position of the street to the reference line from the state shown in FIG. The schematic diagram of the image in the state which made a pair of movable line correspond to the width | variety of a street from the state shown in FIG. The schematic diagram of the image in the state which moved the position of the processing groove to the reference line from the state shown in FIG. The schematic diagram of the image in the state which made a pair of movable line correspond to the width | variety of a process groove from the state shown in FIG.

  Hereinafter, an embodiment of a processing apparatus configured according to the present invention will be described with reference to the drawings.

  FIG. 1 shows a disk-shaped wafer 2 that can be processed by a processing apparatus constructed according to the present invention. The surface 2a of the wafer 2 is partitioned into a plurality of rectangular areas by a plurality of streets 4 formed in a lattice shape, and a plurality of devices 6 such as ICs and LSIs are formed in each of the plurality of rectangular areas. The wafer 2 in the illustrated embodiment is affixed to an adhesive tape 10 whose periphery is fixed to the annular frame 8.

  A cutting apparatus 12 shown in FIG. 2 is an example of a processing apparatus configured according to the present invention, and forms a processing groove in a holding means 14 for holding the wafer 2 and a street 4 of the wafer 2 held by the holding means 14. Cutting means 16 as processing means, X-axis feed means (not shown) for relatively feeding the holding means 14 and the cutting means 16 in the X-axis direction (the direction indicated by the arrow X in FIG. 1). Y-axis feeding means (not shown) for relatively indexing and feeding the holding means 14 and the cutting means 16 in the Y-axis direction (direction indicated by the arrow Y in FIG. 1) orthogonal to the X-axis direction, and imaging. Means 18 and display means 20 are provided at least. Note that the plane defined by the X-axis direction and the Y-axis direction is substantially horizontal. Further, the Z-axis direction indicated by an arrow Z in FIG. 1 is a vertical direction orthogonal to the X-axis direction and the Y-axis direction.

  The holding means 14 includes a circular chuck table 24 mounted on the apparatus housing 22 so as to be rotatable and movable in the X-axis direction. The chuck table 24 is rotated around an axis extending in the Z-axis direction by a chuck table motor (not shown) built in the apparatus housing 22. The X-axis feeding means in the illustrated embodiment is composed of a ball screw (not shown) connected to the chuck table 24 and extending in the X-axis direction, and a motor (not shown) for rotating the ball screw. The chuck table 24 is processed and fed relative to the cutting means 16 in the X-axis direction. At the upper end portion of the chuck table 24, a porous circular suction chuck 26 connected to a suction means (not shown) is disposed. In the chuck table 24, suction force is applied to the suction chuck 26 by the suction means. By generating, the wafer 2 placed on the upper surface is sucked and held. Further, a plurality of clamps 28 for fixing the annular frame 8 are arranged on the periphery of the chuck table 24 at intervals in the circumferential direction.

  The cutting means 16 is supported by the spindle housing 30 supported by the device housing 22 so as to be movable in the Y-axis direction and movable in the Z-axis direction (movable up and down), and supported by the spindle housing 30 so as to be rotatable about the Y-axis direction. A spindle 32, a motor (not shown) for rotating the spindle 32, and a cutting blade 34 fixed to the tip of the spindle 32. As described above, the cutting means 16 as the processing means for forming the processing groove on the street 4 of the wafer 2 is provided with the cutting blade 34 so as to be rotatable. In the illustrated embodiment, the processing groove formed on the wafer 2 is the cutting blade. A cutting groove formed by 34. The Y-axis feeding means includes a ball screw (not shown) connected to the spindle housing 30 and extending in the Y-axis direction, and a motor (not shown) for rotating the ball screw. The spindle housing 30 is indexed and fed relative to the holding means 14 in the Y-axis direction. Further, the spindle housing 30 is constituted by a Z-axis feed means which can be constituted by a ball screw (not shown) extending in the Z-axis direction and a motor (not shown) for rotating the ball screw. It is cut and fed (lifted).

  As shown in FIG. 2, the imaging means 18 is provided above the movement path of the chuck table 24. Referring to FIGS. 3 and 4, the image pickup means 18 picks up an image of the wafer 2 held by the holding means 14 and detects a street 4 and a machining groove (a cutting groove in the illustrated embodiment) a reference line L ( (See FIG. 4). A reference line L extending in the X-axis direction is formed on a lens of the microscope 36 or an image pickup device (not shown) such as a CCD. The microscope 36 is supported by the spindle housing 30 and is moved together with the spindle housing 30 in the Y-axis direction by the Y-axis feeding means, and is moved in the Z-axis direction by the Z-axis feeding means.

  The display means 20 in the illustrated embodiment is composed of a touch panel provided at the upper front of the device housing 22. As shown in FIG. 4, the display unit 20 includes an image display unit 38 that displays an image captured by the image capturing unit 18, and a street correction button 40 that stores a shift amount between the street 4 and the reference line L as a correction value. A machining groove correction button 42 for storing a deviation amount between the machining groove and the reference line L as a correction value, an X-axis operation unit 44 that operates the X-axis feeding means, and a Y-axis that operates the Y-axis feeding means An actuating unit 46, a pair of movable lines 48 that are symmetrical with respect to the reference line L, approach and leave the reference line L, a movable line actuating unit 50 that operates the pair of movable lines 48, and a correction value display unit 52. , Is displayed.

  The image display unit 38 that displays an image captured by the imaging unit 18 with the horizontal axis as the X-axis direction and the vertical axis as the Y-axis direction is line-symmetric with the reference line L as the axis of symmetry together with the reference line L of the imaging unit 18. A pair of movable lines 48 are displayed in parallel with the X-axis direction. The street correction button 40 is a button for storing the amount of deviation between the street 4 and the reference line L in the storage means (not shown) of the cutting apparatus 12 as a correction value, and is displayed on the image display unit 38. When the position of the street 4 is moved to the reference line L by operating the Y-axis operation unit 46 and the movable line operation unit 50 is operated to make the pair of movable lines 48 coincide with the width of the street 4, the street correction button 40 When is touched, the moving distance of the street 4 is stored in the storage means as a correction value of the street 4. Further, the machining groove correction button 42 is a button for storing the amount of deviation between the machining groove and the reference line L in the storage means as a correction value, and the position of the machining groove displayed on the image display unit 38 is set to the Y axis. When the operation unit 46 is operated to move to the reference line L and the movable line operation unit 50 is operated to make the pair of movable lines 48 coincide with the width of the machining groove, touching the machining groove correction button 42 causes the machining groove to be changed. The moving distance is stored in the storage means as a machining groove correction value. And in embodiment of illustration, when the space | interval of a pair of movable line 48 is not set to the space | interval (for example, 45 micrometers or more) recognized as the width | variety (for example, 50-60 micrometers) of the street 4, if the street correction button 40 is touched. If an error is reported and the distance between the pair of movable lines 48 is not set to a distance (for example, less than 45 μm) that is recognized as a width of the machining groove (for example, 25 to 35 μm), an error occurs when the machining groove correction button 42 is touched. Is notified. Therefore, even when an operator mistakenly touches the machining groove correction button 42 when storing the deviation amount between the street 4 and the reference line L as a correction value, the correction value of the street 4 is used as the machining groove correction value. It is not stored in the storage means. Further, even when an operator accidentally touches the street correction button 40 when storing the deviation amount between the machining groove and the reference line L as a correction value, the machining groove correction value is used as the street 4 correction value. It is not stored in the storage means. Examples of the error notification include error display on the display unit 20, blinking or lighting of a warning lamp (not shown), notification by a warning sound, and the like.

  The X-axis operating unit 44 operates the X-axis feeding unit to move the imaging region by the imaging unit 18 in the right direction in FIG. 4 and the X-axis feeding unit to operate the X-axis feeding unit to perform imaging by the imaging unit 18. And a leftward operating portion 44b for moving the region in the leftward direction in FIG. Further, the Y-axis operating unit 46 operates the Y-axis feeding unit to move the imaging unit 18 in the upward direction in FIG. 4 and the Y-axis feeding unit operates in the downward direction in FIG. And a downward operation part 46b for moving the imaging means 18. The movable line operating unit 50 is symmetrical with the reference line L and the movable line approaching part 50a that makes the pair of movable lines 48 approach the reference line L while maintaining a line-symmetrical relationship with the reference line L as the axis of symmetry. A movable line separation portion 50b that separates the pair of movable lines 48 from the reference line L while maintaining a line-symmetric relationship with respect to the axis is provided.

  When forming a cutting groove in the street 4 of the wafer 2 using the cutting device 12 as described above, first, the wafer 2 is sucked and held on the upper surface of the chuck table 24 with the surface 2a of the wafer 2 facing upward. Further, the annular frame 8 is fixed by a plurality of clamps 28. Next, the wafer 2 is picked up from above by the image pickup means 18, and the X axis feed means, the Y axis feed means and the chuck table motor are operated based on the image of the wafer 2 picked up by the image pickup means 18. The cutting blade 34 is positioned above the street 4 aligned in the X-axis direction and aligned in the X-axis direction. Next, the cutting blade 34 is rotated together with the spindle 32 by a motor. Next, the spindle housing 30 is lowered by the Z-axis feeding means, the cutting edge of the cutting blade 34 is cut into the street 4 aligned in the X-axis direction, and the X-axis feeding means is operated to chuck the cutting means 16. By cutting and feeding the table 24 relatively in the X-axis direction, a cutting process for forming cutting grooves along the streets 4 for dividing the wafer 2 into individual devices 6 is performed. Next, the cutting means 16 is moved to the chuck table 24 by the Y-axis feeding means in the Y-axis direction by a preset index feed amount (interval in the Y-axis direction of the street 4 in a state before cutting is performed). Index to feed. Then, when cutting is performed on all of the streets 4 aligned in the X-axis direction by alternately repeating cutting and indexing, the cutting groove is formed by the cutting device 12 as described above. A deviation in the Y-axis direction of the street 4 due to the cutting process and a deviation in the Y-axis direction of the cutting blade 34 due to thermal expansion of the spindle 32 occur. If cutting is repeated while indexing and feeding at a preset index feed amount in a state where such a deviation occurs, the device 6 may be damaged by cutting the position off the street 4. Therefore, when the cutting groove is formed by the cutting device 12, the machining position is corrected (that is, the deviation between the street 4 and the cutting groove) after cutting is performed several times. In the correction of the machining position, first, street correction is performed in which the amount of deviation between the street 4 and the reference line L in the Y-axis direction is obtained and stored as a correction value for the street 4, and then the Y-axis direction between the cutting groove and the reference line L The machining groove correction is performed by obtaining the amount of deviation and storing it as the correction value of the cutting groove. In addition, the cutting groove formed along the street 4 is shown by the code | symbol 54 in FIG.

  In the street correction, first, as shown in FIG. 3, the X-axis feed means and the Y-axis feed means are operated to align the wafer 2 and the imaging means 18, and the street 4 in which the cutting groove 54 is formed most recently is imaged. The image is taken by means 18. The image picked up by the image pickup means 18 is as shown in FIG. 5, for example, and is displayed on the image display unit 38 of the display means 20. When a metal pattern called a TEG (Test Element Group) is periodically provided on the street 4, metal burrs or the like are generated in a cutting groove at a location where the TEG is cut, and the cutting at this location is performed. If a groove is imaged, a metal burr or the like may be misidentified as a cutting groove. In such a case, the X-axis operation unit 44 is operated to adjust the position of the street 4 imaged by the imaging means 18. Then, an image is taken of the cutting groove where the TEG is not provided. Next, based on the captured image, as shown in FIG. 6, the Y-axis direction central position of the street 4 displayed on the image display unit 38 is moved toward the reference line L by operating the Y-axis operation unit 46. . At this time, the operator looks at the captured image and adjusts the position of the street 4 by the amount of division so that the central position of the street 4 in the Y-axis direction matches the reference line L. It is difficult to accurately position the center position of the street 4 in the Y-axis direction on the reference line L in one operation. For this reason, the movable line actuating unit 50 is operated so that the interval between the pair of movable lines 48 matches the width of the street 4, and it is confirmed whether or not the center position of the street 4 in the Y-axis direction matches the reference line L. . As described above, the pair of movable lines 48 approach and separate while maintaining a line-symmetrical relationship with the reference line L as the axis of symmetry, so that when the distance between the pair of movable lines 48 matches the width of the street 4, the street 4 The center position in the Y-axis direction coincides with the reference line L. Then, the operation of the Y-axis operation unit 46 and the operation of the movable line operation unit 50 are repeated as appropriate, and when the distance between the pair of movable lines 48 matches the width of the street 4 as shown in FIG. Touch. Then, the movement distance in the Y-axis direction of the street 4 from the position before correction (the amount of deviation between the street 4 and the reference line L) is stored in the storage unit of the cutting device 12 as a correction value in the Y-axis direction of the street 4. The The correction value of the street 4 is displayed on the correction value display unit 52 of the display means 20 (−5.5 μm in the illustrated embodiment). In the illustrated embodiment, even if an operator accidentally touches the machining groove correction button 42 during such street correction, the distance between the pair of movable lines 48 is recognized as the width of the cutting groove 54. If the interval is not set, an error is notified, and the correction value of the street 4 is not stored as the correction value of the cutting groove 54. In FIG. 7, for the sake of convenience, a pair of movable lines 48 are illustrated at intervals slightly wider than the width of the street 4.

  Next, machining groove correction will be described. The machining groove correction starts from a state in which the center position of the street 4 in the Y-axis direction coincides with the reference line L. First, as shown in FIG. 8, the center of the cutting groove 54 displayed on the image display unit 38 in the Y-axis direction center. The position is moved toward the reference line L by operating the Y-axis operation unit 46. Next, the movable line operating unit 50 is operated so that the distance between the pair of movable lines 48 matches the width of the cutting groove 54, and it is confirmed whether or not the center position of the cutting groove 54 in the Y-axis direction matches the reference line L. To do. Then, the operation of the Y-axis operation unit 46 and the operation of the movable line operation unit 50 are repeated as appropriate. When the distance between the pair of movable lines 48 matches the width of the cutting groove 54 as shown in FIG. Touch 42. Then, the movement distance in the Y-axis direction of the cutting groove 54 from the state in which the center position of the street 4 in the Y-axis direction coincides with the reference line L is used as the correction value in the Y-axis direction of the cutting groove 54 as the storage means of the cutting device 12. Is remembered. The correction value of the cutting groove 54 is displayed on the correction value display section 52 of the display means 20 (+1.2 μm in the illustrated embodiment). In the illustrated embodiment, even when an operator accidentally touches the street correction button 40 during such machining groove correction, the distance between the pair of movable lines 48 is recognized as the width of the street 4. If the interval is not set, an error is notified, so that the correction value of the cutting groove 54 is not stored as the correction value of the street 4. In FIG. 9, for the sake of convenience, a pair of movable lines 48 are illustrated at intervals slightly wider than the width of the cutting groove 54.

  As described above, in the correction of the machining position, first, in the street correction, the movement distance in the Y-axis direction of the street 4 from the position before the correction (shift amount between the street 4 and the reference line L) is obtained, and then in the machining groove correction, By obtaining the movement distance in the Y-axis direction of the cutting groove 54 from the state in which the center position of the street 4 in the Y-axis direction matches the reference line L (the amount of deviation between the cutting groove 54 and the reference line L), the reference line L Can be used to accurately determine the amount of deviation between the street 4 and the cutting groove 54. Then, the cutting groove 54 can be formed at the center position in the Y-axis direction of the street 4 by indexing and feeding with a corrected index feeding amount obtained by adding the correction value of the cutting groove 54 to a preset index feeding amount. .

  As described above, in the illustrated embodiment, when the distance between the pair of movable lines 48 is not set to the distance recognized as the width of the street 4, an error is notified when the street correction button 40 is touched, and the pair of movable lines 48 is touched. If the interval between the lines 48 is not set to the interval recognized as the width of the cutting groove 54, an error is notified when the processing groove correction button 42 is touched, so the amount of deviation between the street 4 and the reference line L is cut. The groove 54 is not stored as a correction value, and the amount of deviation between the cutting groove 54 and the reference line L is not stored as a correction value for the street 4. A cutting groove 54 can be formed.

  In the illustrated embodiment, the cutting device 12 including the cutting unit 16 that rotatably includes the cutting blade 34 that cuts the street 4 of the wafer 2 held by the holding unit 14 has been described. Further, a laser processing apparatus provided with a laser beam irradiation means for irradiating a street 4 of the wafer 2 with a laser beam to form a division groove may be used.

2: Wafer 4: Street 12: Cutting device (processing device)
14: Holding means 16: Cutting means (processing means)
18: Imaging means 20: Display means 34: Cutting blade 36: Microscope 38: Image display section 40: Street correction button 42: Machining groove correction button 46: Y-axis operation section 48: Moveable line 50: Moveable line action section 54: Cutting Groove (machined groove)
L: Reference line

Claims (3)

A processing apparatus for forming a processing groove that divides a wafer formed on a surface by dividing a plurality of devices into streets into individual devices,
A holding means for holding a wafer, a processing means for forming a processing groove on a street of a wafer held by the holding means, and an X-axis feed for processing and feeding the holding means and the processing means relative to each other in the X-axis direction Imaging means, Y-axis feeding means for relatively indexing and feeding the holding means and the processing means in the Y-axis direction orthogonal to the X-axis direction, and images of the wafer held by the holding means to capture streets and processing grooves An imaging unit having a microscope with a reference line to be detected, and a display unit;
The display means includes an image display section for displaying an image captured by the imaging means, a street correction button for storing a deviation amount between the street and the reference line as a correction value, a processing groove, and the reference line. A machining groove correction button for storing the amount of deviation as a correction value, a Y-axis operation unit that operates the Y-axis feed means, and a pair of pairs that approach and move away from the reference line while maintaining the line symmetry with respect to the reference line A movable line and a movable line actuating part that operates the pair of movable lines are displayed,
If the interval between the pair of movable lines is not set to the interval recognized as the street width, an error will be notified when the street correction button is touched,
A machining apparatus in which an error is notified when the machining groove correction button is touched when the gap between the pair of movable lines is not set to an interval recognized as the width of the machining groove. The street position displayed on the image display unit is moved to the reference line by operating the Y-axis operation unit, and the movable line operation unit is operated to match the pair of movable lines with the street width. In this case, when the street correction button is touched, the travel distance of the street is stored as a street correction value.
The position of the processing groove displayed on the image display unit is moved to the reference line by operating the Y-axis operation unit and the movable line operation unit is operated to match the pair of movable lines with the width of the processing groove. 2. The machining apparatus according to claim 1, wherein when the machining groove correction button is touched, the movement distance of the machining groove is stored as a machining groove correction value.   The processing apparatus according to claim 1, wherein the processing means is a cutting means provided with a cutting blade so as to be rotatable, and the processing groove is a cutting groove.