JP5198203B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus for processing a semiconductor wafer, and more particularly to a mechanism of an alignment imaging unit of the processing apparatus.

  In the semiconductor device manufacturing process, a plurality of regions are defined by streets (planned cutting lines) arranged in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and devices such as IC and LSI are provided in each partitioned region. Each semiconductor chip is manufactured by dividing the formed semiconductor wafer into devices by cutting along the streets.

  Cutting along the streets of a semiconductor wafer is usually performed by a cutting device called a dicer. In addition to a dicing method using a cutting apparatus, a laser dicing method using a pulse laser having a wavelength that is transparent to a semiconductor wafer has been developed.

  In this laser dicing method, a pulse laser having a wavelength that is transmissive to a workpiece (workpiece) such as a semiconductor wafer is irradiated along the street with a focusing point inside the workpiece. An altered layer is formed inside the object, and the chip is divided into individual chips by applying an external force along the street where the strength is reduced by the formation of the altered layer (for example, Japanese Patent No. 3408805, JP-A-10-305420). No. publication).

  When processing a workpiece using these processing devices, the workpiece is placed on the chuck table with the surface of the workpiece (the surface on which the circuit pattern is formed) facing upward, and the chuck table Alignment is performed by detecting the street with an alignment means including an imaging means such as a visible light camera disposed above the head, and the machining is performed by positioning a cutting blade or a laser irradiation head on the street.

  However, there is a case where the workpiece is mounted on the chuck table with the surface of the workpiece facing downward and the back surface facing upward. For example, when an LED chip or the like in which a light emitting device is formed on a sapphire substrate is processed with a laser, the characteristics of the light emitting device layer may be deteriorated, so a laser beam is incident from the back side where no device is formed. It is preferable.

  In addition, in some MEMS (Micro Electro Mechanical Systems) with fine structures formed on the surface, the cutting water during processing by blade dicing may damage the surface structure. The side may be attached to the holding tape and processed from the back side.

  In addition, when performing blade dicing on workpieces such as CCD and CMOS imaging devices that become defective due to the attachment of cutting debris on the device, the surface is similarly adhered to the holding tape. May be processed from the side.

In view of this, a method using an IR camera has been proposed as a method for enabling alignment even when processing is performed from the back side while the circuit pattern or street forming surface is held downward (Japanese Patent Laid-Open No. Hei 6-232255). And JP-A-10-312979).
Japanese Patent No. 3408805 JP-A-10-305420 JP-A-6-232255 Japanese Patent Laid-Open No. 10-312979

  However, when processing a workpiece having a layer that does not transmit light such as a metal layer on a layer having an alignment pattern, or when processing a workpiece having a metal layer on the back surface from the back surface, the metal layer Even if an image is taken with an IR camera from the side, the alignment pattern or street cannot be detected, and alignment cannot be performed.

  The present invention has been made in view of such points, and the object of the present invention is to process a workpiece in which a layer that does not transmit light exists between the processing means and the imaging object. It is an object of the present invention to provide a processing apparatus capable of performing alignment without being affected by the structure and material of a workpiece.

  According to the present invention, there is provided a processing apparatus having a holding unit formed of a transparent body that holds a workpiece, a processing unit that processes the workpiece held by the holding unit, the holding unit, A processing feed means for sending processing means relative to the X-axis direction parallel to the surface of the holding portion and a Y-axis direction perpendicular to the X-axis direction; and the workpiece held by the holding means, An imaging mechanism that images the workpiece, and an imaging mechanism that sends the imaging mechanism relative to the holding unit in the X-axis direction and the Y-axis direction. A machining apparatus characterized in that it is fed integrally with the holding means by the machining feed means.

  Preferably, the imaging mechanism includes at least two imaging cameras having different magnifications, and the two or more imaging cameras capture the same portion of the holding unit. Preferably, the imaging mechanism has at least one IR imaging camera.

  Preferably, the processing apparatus further includes a second imaging unit that images the workpiece held by the holding unit from the side opposite to the holding unit.

  According to the present invention, there is provided a processing apparatus capable of performing alignment without being affected by the structure or material of a workpiece even when processing a workpiece having a layer that does not transmit light between the processing means and the imaging object. can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a schematic configuration diagram of a laser processing apparatus provided with an imaging means (first imaging means) of the present invention for imaging a wafer from under a chuck table.

  The laser processing apparatus 2 includes a first slide block 6 mounted on a stationary base 4 so as to be movable in the X-axis direction. The first slide block 6 is moved in the X-axis direction along a pair of guide rails 14 by an X-axis feed means 12 constituted by a ball screw 8 and a pulse motor 10.

  A housing 16 is mounted on the first slide block 6 so as to be movable in the Y-axis direction. The housing 16 is moved in the Y-axis direction along a pair of guide rails 24 by a Y-axis feed means (index feed means) 22 composed of a ball screw 18 and a pulse motor 20.

  A chuck table 28 is rotatably mounted on the housing 16. As best shown in FIG. 2, a motor 26 is fixed to the side surface of the housing 16, and a belt 30 is formed around the outer periphery of a pulley 27 connected to the output shaft of the motor 26 and a frame 62 of the chuck table 28. Is wound. When the motor 26 is rotated, the chuck table 28 is rotated via the pulley 27 and the belt 30.

  The chuck table 28 includes a cylindrical frame 62 formed of a metal such as SUS and a transparent holding portion (holding pad) 64 formed of glass or the like. The transparent holding portion 64 is formed with a number of suction grooves connected to a vacuum suction source, which will be described in detail later. Reference numeral 29 denotes a frame mounting table on which an annular frame described later is mounted.

  Referring to FIG. 1 again, the machining feed means 23 is constituted by the X-axis feed means 12 and the Y-axis feed means 22. Therefore, the chuck table 28 can be moved in the X-axis direction and the Y-axis direction by the processing feed means 23.

  A column 32 is erected on the stationary base 4, and a casing 35 containing a laser beam oscillation means 34 is attached to the column 32. The laser beam oscillated from the laser beam oscillating means 34 is condensed by an objective lens of a condenser 36 attached to the tip of the casing 35 and is processed by a workpiece (such as a semiconductor wafer) held on the chuck table 28 ( Is irradiated to the workpiece.

  At the tip of the casing 35, a second imaging unit 38 is disposed that is aligned with the condenser 36 in the X-axis direction and detects a processing region to be laser processed by a laser beam. The second imaging means 38 includes an infrared imaging means for irradiating the workpiece with infrared rays, an optical system for capturing the infrared rays emitted by the infrared irradiation means, in addition to an ordinary imaging device such as a CCD for imaging with visible light, and this optical system. Infrared imaging means including an imaging device such as an infrared CCD that outputs an electrical signal corresponding to infrared rays captured by the system is included, and the captured image is transmitted to the controller 40.

  The controller 40 is configured by a computer, and a central processing unit (CPU) 42 that performs arithmetic processing by a control program, a read-only memory (ROM) 44 that stores a control program and the like, and a readable and writable memory that stores arithmetic results and the like. A random access memory (RAM) 46, a counter 48, an input interface 50, and an output interface 52 are provided.

  Reference numeral 56 denotes a processing feed amount detection means comprising a linear scale 54 disposed along the guide rail 14 and a read head (not shown) disposed on the first slide block 6. The detection signal is input to the input interface 50 of the controller 40.

  Reference numeral 60 denotes index feed amount detection means comprising a linear scale 58 disposed along the guide rail 24 and a read head (not shown) disposed on the second slide block 16. The detection signal is input to the input interface 50 of the controller 40.

  The image signal picked up by the second image pickup means 38 is input to the input interface 50 of the controller 40. On the other hand, a control signal is output from the output interface 52 of the controller 50 to the pulse motor 10, the pulse motor 20, the laser beam oscillation means 34, and the like.

  As shown in FIG. 3, a first image pickup means 75 for picking up an image of a work through a transparent holding portion 64 of the chuck table 28 is disposed in the housing 16. The first imaging means 75 includes a third slide block 66 mounted on the bottom surface 16a of the housing 16 so as to be movable in the X-axis direction. The third slide block 66 is moved in the X-axis direction along the pair of guide rails 74 by the X-axis moving means 72 composed of the ball screw 68 and the pulse motor 70.

  A fourth slide block 76 is mounted on the third slide block 66 so as to be movable in the Y-axis direction. That is, the fourth slide block 76 is moved in the Y-axis direction along the pair of guide rails 84 by the Y-axis feed means 82 including the ball screw 78 and the pulse motor 80.

  A column 86 is erected on the fourth slide block 76. A camera unit 88 is mounted on the column 86 so as to be movable in the Z-axis direction. That is, the camera unit 88 is moved in the Z-axis direction along the pair of guide rails 96 by the Z-axis moving means 94 including the ball screw 90 and the pulse motor 92.

  The X-axis moving means 72, the Y-axis moving means 82, and the Z-axis moving means 94 constitute an imaging mechanism feeding means 95. As a modification of the present embodiment, when the camera unit 88 is directly mounted on the fourth slide block 76, the imaging mechanism feeding unit 95 is configured by the X-axis moving unit 72 and the Y-axis moving unit 82.

  Referring to FIG. 4, a schematic configuration diagram of the camera unit 88 of the first embodiment is shown. The camera unit 88 includes a light source 100, a low magnification camera 102, and a high magnification camera 104.

  Light emitted from the light source 100 is reflected by the mirror 106 and the half mirror 108, and passes through the opening 110 of the camera unit 88, the opening 17 (see FIG. 3) of the housing 16, and the transparent holding portion 64 of the chuck table 28 to the chuck table 28. A workpiece such as a held semiconductor wafer is irradiated from below.

  The low magnification camera 102 captures an image of a predetermined part of the workpiece via the mirror 114, the half mirror 112, the half mirror 108, and the transparent holding portion 64 of the chuck table 28. The high magnification camera 104 includes the half mirror 112, the half mirror 108, The predetermined portion of the workpiece is imaged through the transparent holding portion 64 of the chuck table 28.

  In the camera unit 88 of the present embodiment, since the plurality of cameras 102 and 104 capture the same part of the workpiece, for example, when switching from the low magnification camera 102 to the high magnification camera 104, no axis feed is required, and control is easy. In addition, the stroke of the axis for feeding the camera unit 88 can be reduced.

  Referring to FIG. 5, a schematic configuration diagram of a camera unit 88A of the second embodiment is shown. The camera unit 88 </ b> A includes a light source 100, a low magnification IR camera 116, a high magnification IR camera 118, a low magnification camera 102, and a high magnification camera 104.

  Similar to the embodiment shown in FIG. 4, the light emitted from the light source 100 is transmitted to the chuck table 28 via the mirror 106, the half mirror 108, the opening 110, the opening 17 of the housing 16, and the transparent holding portion 64 of the chuck table 28. Irradiate the held workpiece.

  The mirror 120 is arranged to be movable in the direction of arrow A by the air cylinder 122, the mirror 124 is arranged to be movable in the direction of arrow A by the air cylinder 126, and the mirror 128 is arranged in the direction of arrow A by the air cylinder 130. It is arranged to be movable. The mirrors 132, 134 and 136 are fixedly arranged.

  When the low magnification IR camera captures an image at 116, the image is captured by the camera arrangement shown in FIG. That is, a predetermined portion of the workpiece held on the chuck table 28 is imaged via the mirror 132, the mirror 120, the half mirror 108, and the transparent holding portion 64 of the chuck table 28.

  When imaging with the high-magnification IR camera 118, the air cylinder 122 is driven to retract the mirror 120 in the right hand direction. Thereby, the high-magnification IR camera 118 can image the predetermined portion of the work held on the chuck table 28 via the mirror 134, the mirror 124, the half mirror 108, and the transparent holding portion 64 of the chuck table 28. .

  When imaging with the low-magnification camera 102, the air cylinders 122 and 126 are driven to retract the mirrors 120 and 124 in the right-hand direction. As a result, the low-magnification camera 102 can image the predetermined portion of the work held on the chuck table 28 via the mirror 136, the mirror 128, the half mirror 108, and the transparent holding portion 64 of the chuck table 28.

  When imaging with the high-magnification camera 104, the air cylinders 122, 126, and 130 are driven to retract the mirrors 120, 124, and 128 in the right-hand direction. Accordingly, the high-magnification camera 104 can image the predetermined portion of the work held on the chuck table 28 via the half mirror 108 and the transparent holding portion 64 of the chuck table 28. According to the camera unit 88A of the present embodiment, the cut state can be confirmed even by a half cut of a workpiece that does not transmit visible light.

  Referring to FIG. 6, a front side perspective view of a semiconductor wafer 1 to be processed by the laser processing apparatus 2 is shown. On the surface 1a of the wafer 1, devices 5 are formed in each region partitioned by streets (division lines) formed in a lattice pattern. Each device 5 is formed with a target pattern 7 to be detected during alignment.

  In the processing by the laser processing apparatus 2 shown in FIG. 1, the wafer 1 is attached to a dicing tape (adhesive tape) T with the surface 1a side down, and the outer peripheral portion of the dicing tape T is annular as shown in FIG. Affixed to frame F. Therefore, the semiconductor wafer 1 is mounted on the chuck table 28 in the state of FIG.

  Referring to FIG. 8, a rear perspective view of another type of semiconductor wafer 1A mounted on the annular frame F via the dicing tape T is shown. A metal layer 9 is formed on the back surface of the semiconductor wafer 1A. Therefore, it is impossible to image the target pattern 7 of the semiconductor wafer 1A even if the second imaging means 38 includes an IR camera.

  However, since the first image pickup means 75 shown in FIG. 3 is disposed below the semiconductor wafer 1A and images the semiconductor wafer 1A via the transparent holding portion 64 of the chuck table 28, the target pattern 7 can be easily formed. An image can be taken.

  Referring to FIG. 9, a state is shown in which a plurality of small-diameter workpieces 11 such as LED wafers are attached to the dicing tape T on the surface side, and the peripheral portion of the dicing tape T is attached to the annular frame F. .

  Thus, when the several workpiece | work 11 is stuck on the dicing tape T with the surface down, when the process of one workpiece | work 11 is performed with the laser processing apparatus 2, of the following workpiece | work 11 is carried out. Alignment can be performed by the first imaging means 75.

  The workpiece to be processed by the processing apparatus of the present invention is not limited to the semiconductor wafer shown in FIGS. 6 to 9, but a DAF (die attach film) provided on the back surface of the wafer for chip mounting. ), Etc., semiconductor product packages, ceramic, glass or silicon substrates, various electronic components, various drivers, and various processed materials that require micron-order accuracy.

  Referring to FIG. 10, a plan view of the vacuum pipe 138 attached to the chuck table 28 is shown. When the chuck table 28 is rotated in the arrow B direction in FIG. 10A, the vacuum pipe 138 rotates together with the chuck table 28 as shown in FIG.

  Referring to FIG. 11, there is shown a longitudinal sectional view of the casing 16 and chuck table 28 portion of the first embodiment shown in FIG. In this figure, the processing feed means 23 and the imaging mechanism feed means 95 are schematically shown.

  FIG. 12 is an enlarged cross-sectional view of a portion C in FIG. 11. The semiconductor wafer 1 is attached to the dicing tape T with the surface 1 a facing down, and the annular frame F is mounted on the frame mounting table 29.

  The holding part (holding surface) 64 of the chuck table 28 is made of a transparent material such as glass and has a plurality of suction grooves 140. The suction groove 140 is connected to the vacuum pipe 138.

  As shown in FIG. 11, since the camera unit 88 is disposed on the lower side of the semiconductor wafer 1 held by the transparent holding portion 64 of the chuck table 28, the condenser 36 and the semiconductor wafer 1 that is an object to be imaged are arranged. Even when processing a workpiece having a layer that does not transmit light, such as a metal layer, between the target pattern 7 and the target pattern 7, the target pattern can be easily imaged by the camera unit (imaging mechanism) 88 constituting the first imaging means 75. And the necessary alignment can be performed.

  As shown in FIG. 13, the holding portion 64 includes a suction path forming region 64a in which a plurality of suction paths such as pores or suction grooves are formed, and a cross-shaped suction path non-forming region 64b in which no suction path is formed. And an outer peripheral region 64c in which no suction path is formed.

  Imaging of the target pattern by the camera unit 88 is preferably performed through the suction path non-formation region 64b in order to capture the target pattern clearly. The holding part 64 is formed of any one of, for example, quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride.

  In addition, since the camera unit 88 is disposed under the chuck table 28, the chuck table 28 can perform alignment at the moment when the semiconductor wafer 1 is held. Further, since the camera unit 88 can move independently of the laser processing means under the chuck table 28, it is possible to check the processing state such as meandering of the cutting groove, back surface chipping, and kerf position at any time. However, in order to pick up an image of which the alignment and the focal position are different, it is necessary to operate the Z-axis feeding means 94 to adjust the focal position.

  The term “transparent” as used in this specification refers to a property of transmitting at least part of light in the visible light region or other wavelength regions. An object facing the transparent medium is visible through a transparent medium.

  Further, since the laser processing apparatus 2 of the embodiment shown in FIG. 1 includes the second imaging means 38 disposed on the upper side of the chuck table 28, even with a wafer in which the target pattern 7 cannot be imaged by the camera unit 88, The target pattern 7 can be imaged.

  Referring to FIG. 14, there is shown a longitudinal sectional view of the casing 16 and chuck table 28 portion of the second embodiment of the present invention. The casing 16 of this embodiment is mounted on a DDM (direct drive motor) 142. Therefore, the camera unit 88 constituting the second imaging means 75 is rotatable.

  The DDM 142 has a center hole 144, and a vacuum pipe 148 is disposed in the center hole 144, and the suction groove 140 and the vacuum pipe 148 formed in the holding portion (holding surface) 64 in the housing 16. A suction path 146 connected to is formed.

  In the present embodiment, the semiconductor wafer 1 is directly sucked and held by the holding portion 64 of the chuck table 28 with the surface 1 facing down. Since the semiconductor wafer 1 is not supported by the annular frame, the semiconductor wafer 1 can rotate together with the chuck table 28. Also in the present embodiment, since the camera unit 88 constituting the first imaging means 75 can move in the X, Y, and Z directions, the same effects as those of the first embodiment described above can be achieved.

  Referring to FIG. 15, there is shown a longitudinal sectional view of a holding portion 64A of another embodiment. The holding portion 64 </ b> A is made of a transparent material such as glass, and has a plurality of horizontal suction grooves 141 and a plurality of vertical suction grooves 143 orthogonal to the horizontal suction grooves 141. Reference numeral 145 denotes a suction groove connected to the vacuum pipe 138.

  Hereinafter, an alignment operation using the first imaging unit 75 will be described. As shown in FIG. 11, the annular frame F is placed on the housing 16, the vacuum suction source is operated, and the semiconductor wafer 1 is sucked and held by the holding portion 64 of the chuck table 28.

  Since the first image pickup means 75 is located immediately below the holding portion 64 of the chuck table 28, when the semiconductor wafer 1 is mounted on the holding portion 64 of the chuck table 28, the camera unit 88 of the first image pickup means 75 immediately makes the semiconductor. The wafer 1 can be imaged through the transparent holding unit 64 to perform alignment.

  The image used for pattern matching at the time of alignment in which the first imaging means 75 detects the street to be cut needs to be acquired in advance before cutting. Therefore, when the semiconductor wafer 1 is held on the transparent holding portion 64 of the chuck table 28, the light source 100 is turned on to illuminate the semiconductor wafer 1 from below, and the low-power camera 102 first passes the transparent wafer 64 through the transparent holding portion 64. The surface is imaged, and the captured image is displayed on a display such as an LCD (not shown).

  An operator of the laser processing apparatus 2 operates an operation panel (not shown) to drive the X-axis feed unit 72 and the Y-axis feed unit 82 to search for a target pattern 7 that is a pattern matching target.

  When the operator determines the target pattern 7, the high-magnification camera 104 is switched to image the vicinity of the target pattern, and an image including the target pattern 7 is stored in the RAM 46 provided in the controller 40 of the laser processing apparatus 2.

  Further, the distance between the target pattern 7 and the center line of the street 3 is obtained by a coordinate value or the like, and the value is also stored in the RAM 46. Further, an interval between the adjacent streets (street pitch) is obtained by a coordinate value or the like, and the street pitch value is also stored in the RAM 46 of the controller 40.

  At the time of cutting along the street 3 of the semiconductor wafer 1, pattern matching between the stored target pattern image and the image actually acquired by the first imaging means 75 is performed. This pattern matching is performed at two points A and B that are separated from each other along the same street 3 extending in the X-axis direction.

  When pattern matching at point A is completed, the camera unit 88 is moved in the X-axis direction, and pattern matching is performed at point B that is considerably separated from point A in the X-axis direction. At this time, pattern matching is not performed by moving from point A to point B at once, but pattern matching is performed as necessary at a plurality of locations in the middle of movement to point B to correct the deviation in the Y-axis direction. Accordingly, the motor 26 is driven to slightly rotate the chuck table 28 to perform θ correction, and finally pattern matching at point B is performed.

  When the pattern matching at the points A and B is completed, the straight line connecting the two target patterns 7 becomes parallel to the street 3, and the chuck table 28 is equal to the distance between the target pattern 7 and the center line of the street 3. Is moved in the Y-axis direction to align the street 3 to be cut with the condenser (laser irradiation head) 36 and complete the alignment.

  According to the above-described embodiment, even when processing a workpiece in which a layer that does not transmit light exists between the condenser (laser irradiation head) 36 and the workpiece of the imaging target, it is affected by the structure and material of the workpiece. Alignment can be performed without any problems.

  For example, even when a workpiece having a layer that does not transmit infrared rays (IR) such as a metal layer on the back surface is processed from the back surface, alignment can be performed by imaging the planned division line on the front surface side.

  Further, since the camera unit 88 that images the workpiece is always under the chuck table 28, the workpiece can be imaged by the camera unit 88 through the holder 64 at the moment when the workpiece is held by the chuck table 28, and alignment can be performed.

  Further, since the camera unit 88 can move independently of the laser irradiation head 36 under the chuck table 28, the processing state (meandering, back surface chip, kerf position, etc.) can be confirmed at any time.

  Since a plurality of imaging cameras having different magnifications image the same portion of the holding unit 64, for example, when the cameras are switched from a small magnification to a large magnification, it is not necessary to feed an axis, and switching control is facilitated. When the camera unit 88A includes an IR imaging camera, the cut state can be confirmed even by half-cutting a workpiece that does not transmit visible light.

  The processing apparatus of the present invention is not limited to the laser processing apparatus 2 shown in FIG. 1, and the first imaging means 75 of the present invention is similarly applied to a cutting apparatus (dicing apparatus) 152 as shown in FIG. Applicable.

  A vertical column 154 is erected on the base 4 of the cutting device 152, and a cutting unit (cutting means) 156 is mounted on the vertical column 154 so as to be movable in the Z-axis direction. That is, the housing 158 of the cutting unit 156 is moved in the Z-axis direction along the pair of guide rails 168 by the Z-axis feeding means 166 composed of the ball screw 162 and the pulse motor 164.

  The housing 158 houses a spindle (not shown) and a motor that rotationally drives the spindle, and a cutting blade 160 is detachably attached to the tip of the spindle. Since the other structure of this embodiment is the same as that of the laser processing apparatus 2 shown in FIG. 1, the description is abbreviate | omitted.

It is a general-view perspective view of the laser processing apparatus of 1st Embodiment of this invention. It is a perspective view of a housing | casing and a chuck table part. It is a perspective view of the 1st imaging means accommodated in the housing | casing. It is a schematic block diagram of the camera unit of 1st Embodiment. It is a schematic block diagram of the camera unit of 2nd Embodiment. It is a surface side perspective view of a semiconductor wafer. It is a back surface side perspective view of the semiconductor wafer mounted in the cyclic | annular flame | frame via the dicing tape. It is a back surface side perspective view of the semiconductor wafer which has a metal layer in the back surface mounted in the cyclic | annular frame via the dicing tape. It is a perspective view in the state where a plurality of works were mounted in the annular frame via dicing tape. It is a top view which shows the connection state of a chuck table and vacuum piping. It is a longitudinal cross-sectional view of the housing | casing and chuck | zipper table part of 1st Embodiment. It is an expanded sectional view of the C section of FIG. It is a top view of a holding part. It is a longitudinal cross-sectional view of the housing | casing and chuck table part of 2nd Embodiment. It is a longitudinal cross-sectional view of other embodiment of a holding | maintenance part. It is a schematic perspective view of the cutting device provided with the 1st image pickup means of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Laser processing apparatus 5 Device 7 Target pattern 9 Metal layer 12 X-axis feed means 16 Housing | casing 22 Y-axis feed means 23 Processing feed means 26 Motor 28 Chuck table 34 Laser beam oscillation means 36 Condenser 38 2nd imaging Means 64 Holding part (holding surface)
72 X-axis feed means
75 First imaging means 82 Y-axis feeding means 88 Camera unit 94 Z-axis feeding means 100 Light source 102 Low magnification camera 104 High magnification camera 108, 112 Half mirror 116 Low magnification IR camera 118 High magnification IR camera 122, 126, 130 Air cylinder 142 Direct Drive Motor 152 Cutting Device 160 Cutting Blade

Claims (7)

A processing device,
Holding means having a holding part formed from a transparent body for holding the workpiece;
Processing means for processing the workpiece held by the holding means;
Processing feed means for relatively sending the holding means and the processing means in the X-axis direction parallel to the surface of the holding portion and the Y-axis direction perpendicular to the X-axis direction;
Imaging means for imaging the work held by the holding means through the holding unit;
The imaging means includes an imaging mechanism that images the workpiece, and an imaging mechanism feeding means that sends the imaging mechanism relative to the holding unit in the X-axis direction and the Y-axis direction. A processing apparatus characterized by being fed integrally with the holding means.   The processing apparatus according to claim 1, wherein the imaging mechanism includes at least two imaging cameras.   The processing apparatus according to claim 1, wherein the two or more imaging cameras have different magnifications, and image the same portion of the holding unit.   The processing apparatus according to claim 1, wherein the imaging mechanism includes at least one IR imaging camera.   The processing apparatus according to any one of claims 1 to 4, further comprising a second imaging unit that images the workpiece held by the holding unit from the side opposite to the holding unit side.   The processing device according to any one of claims 1 to 5, wherein the holding portion is made of a material selected from the group consisting of quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride. .   The holding portion includes a suction path forming area having a plurality of suction paths and a suction path non-formation area in which no suction path is formed, and imaging of the workpiece by the imaging mechanism is performed in the suction path non-formation area. The processing apparatus according to any one of claims 1 to 6, wherein the processing apparatus is performed through a through-hole.

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