201013765 六、發明說明： 【發明所屬之技術領域】 發明領域 本發明係有關於一種對半導體晶圓進行加工之加工裝 置，特別是有關於一種加工裝置之調準拍攝部的機構。 I：先前技術1 發明背景 半導體元件製程中，係在為大略圓盤狀之半導體晶圓 的表面上’藉由排列成格子狀之溝道(切斷預定線）而分隔出 複數領域，且沿著溝道切斷在分隔出之各領域中形成有 IC、LSI等元件之半導體晶圓，藉此分割成每一元件，製造 出各個半導體晶片。 半導體晶圓沿著溝道的切斷係藉由一般稱為切割器的 切削裝置進行。除了藉由切削裝置進行切割之方法外也 開發有使用對半導體晶圓具有透過性之波長之脈衝雷射的 雷射切割法。 該雷射切割方法中，係使對半導體晶圓等之被加工物 (工作件）具有透過性之波長的脈衝雷射的聚光點對焦於被 加工物的内部，沿著溝道照射，藉此在被加工物内部形成 變質層，並沿著因為形成變質層而強度降低之溝道施加外 力，以分割成各個晶片（參照如日本專利公報專利第 3408805號、日本專利公開公報特開平第1〇 3〇542〇號）。 使用該等加工裝置對被加工物進行加工時，令被加工 物的表面（形成有電路圖案之面）朝上，將被加工物載置於夹 3 201013765 頭台上，並且使用具有設置於夹頭台上方之可視光相機等 的拍攝機構之調準機構，檢測出溝道且實施調準，並且轎 令切削刀片或雷射照射頭定位於溝道，實施加工。 然而，也有令被加工物的表面朝下、裏面朝上，將被 加工物載置於夾頭台上進行加工的情況。例如，在使用雷 射對在藍寶石基板上形成發光元件之LED晶片等進行加工 時’有使發光元件層的特性劣化之虞，因此宜由未形成有 元件之裏面側使雷射光束射入。 又’在表面形成有微細構造物之部份的mems(微機電 處理· microelectro mechanical systems)中，恐有使用刀 片切割進行之加工中的切削水使表面構造物破損之虞， 因此也有將構造物侧貼附於保持膠帶而由襄面側進行加 工的情況。 進而’因切削屑附著於如CCD或CMOS等的拍攝元件 等元件上而變成元件不良之被加工物在進行刀片切割時， 也同樣將表面貼附於保持膠帶，由裏面側進行加工。 因此’如此將電路圖案或溝道的形成面保持向下且由 裏面側加工之情況’也提出使用IR相機之方法作為可實施 調準之方法（曰本專利公開公報特開平第6_232255號及曰本 專利公開公報特開平第1〇_312979號）。 【專利文獻1】日本專利公報專利第3408805號 【專利文獻2】曰本專利公開公報特開平第1〇_30542〇 號 【專利文獻3】曰本專利公開公報特開平第6_232255號 4 201013765 ί專利文獻4】日本專利公開公報特開平第1〇 3i2979 號201013765 VI. Description of the Invention: Field of the Invention The present invention relates to a processing apparatus for processing a semiconductor wafer, and more particularly to a mechanism for aligning a photographing unit of a processing apparatus. I. Prior Art 1 BACKGROUND OF THE INVENTION In a semiconductor device process, a plurality of fields are separated by a channel arranged in a lattice shape (a predetermined line to be cut) on the surface of a substantially disk-shaped semiconductor wafer, and along the The semiconductor wafer in which an element such as an IC or an LSI is formed in each of the divided regions is cut, and the semiconductor wafer is divided into each element to manufacture each semiconductor wafer. The cutting of the semiconductor wafer along the channel is performed by a cutting device generally referred to as a cutter. In addition to the method of cutting by a cutting device, a laser cutting method using a pulsed laser having a wavelength that is transparent to a semiconductor wafer has been developed. In the laser cutting method, a focused spot of a pulsed laser having a wavelength of transparency of a workpiece (workpiece) such as a semiconductor wafer is focused on the inside of the workpiece, and is irradiated along the channel. In this case, an altered layer is formed in the inside of the workpiece, and an external force is applied to the channel which is reduced in strength due to the formation of the altered layer, so as to be divided into individual wafers (see, for example, Japanese Patent Laid-Open No. 3408805, Japanese Patent Laid-Open No. Hei. 〇3〇542〇). When the workpiece is processed by using the processing device, the surface of the workpiece (the surface on which the circuit pattern is formed) faces upward, and the workpiece is placed on the headstock of the folder 3 201013765, and the use has a setting in the clip. The alignment mechanism of the imaging mechanism such as the visible light camera above the headstock detects the channel and performs alignment, and the car blade or the laser irradiation head is positioned in the channel to perform machining. However, there is a case where the surface of the workpiece is faced downward and the inside faces upward, and the workpiece is placed on the chuck table for processing. For example, when laser processing is performed on an LED chip or the like which forms a light-emitting element on a sapphire substrate by laser irradiation, the characteristics of the light-emitting element layer are deteriorated. Therefore, it is preferable that the laser beam is incident from the back side where the element is not formed. Further, in the MEMS (microelectro mechanical system) in which a fine structure is formed on the surface, there is a fear that the surface water is damaged by the cutting water in the processing by the blade cutting, and therefore the structure is also damaged. The side is attached to the holding tape and processed from the kneading side. Further, when a chip is cut by a chip which is attached to an element such as an image pickup device such as a CCD or a CMOS, the surface is attached to the holding tape and processed from the back side. Therefore, the method of using the IR camera as the method of performing the alignment is also proposed as the method of keeping the surface of the circuit pattern or the channel formed downward and being processed from the back side (Japanese Patent Laid-Open Publication No. Hei No. 6-232255) Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei No. Hei No. Hei. [Patent Document 1] Japanese Patent Publication No. 3408805 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Document 4] Japanese Patent Publication No. 1〇3i2979
【發明内容;J 發明揭示 發明欲解決之課題[Summary of the Invention; J invention reveals the problem to be solved by the invention
二而對於在有調準圖案之層上具有如金屬層之不透 光層的被加工物進行加工時、或者是由裏面對裏面具有金 屬層之被加工物進行加卫時，即使係使用IR相機由金屬層 側拍攝，也無法檢測出調準圖案或溝道，無法實施調準。 本發明係有蓉於此觀點而作成者，其目的在於提供一 種加工裝置，該加工裝置係即使對在加卫機構與拍攝對象 物之間存在有不透光層之被加工物進行加工，也不受被加 工物的構造或材質所影響，可實施調準者。 解決課題之手段 本發啊提供—種加4置，其特徵在於包含有：保 部:構加係=由用以保持工作件之透明體所形成之保持 作件者：加riC =工保胁該麟機構之前述工2. When processing a workpiece having a opaque layer such as a metal layer on a layer having a alignment pattern, or when processing a workpiece having a metal layer inside, even if it is used The IR camera was shot from the metal layer side, and the alignment pattern or channel could not be detected, and alignment could not be performed. The present invention has been made in view of the above, and it is an object of the invention to provide a processing apparatus which is capable of processing a workpiece having an opaque layer between a garrison mechanism and an object to be imaged. The alignment can be implemented without being affected by the structure or material of the workpiece. Means for Solving the Problem The present invention provides a four-piece type, which is characterized by: a guarantee department: a structure plus a retaining body formed by a transparent body for holding a work piece: plus riC = work insurance The aforementioned work of the lining agency
轴方向及與㈣保持敎表面平行之X 保持機構Μ心軸方向上相對地傳送前述 部拍攝保持於___ 機構，錢過前述保持 構包含有：拍=====，該拍攝機 前述X軸方向及Υ軸方 構冑别述保持部在 機構傳送設備，且藉由奴:對:傳送該拍攝機構之拍攝 藉由前*加工傳送機構而與該保持機構 5 201013765 一體傳送。 較佳的是’前述拍攝機構具有倍率不同之至少2個以上 之拍攝相機，且2個以上之拍攝相機拍攝保持部之同-處。 較佳的是，拍攝機構具有至少以上之IR拍攝相機。 較佳的疋’加工裝置更具有由與保持部相反之相反侧 拍攝保持於㈣機構之JL作件㈣2拍攝機構。 發明效果 根據本發明，可提供一種加工裝置，該加工裝置係即 使對在t工機構與拍攝對象物之間存在有不透光層之被加 工物進打加工，也不受被加工物的構造或材質所影響可 實施調準者。 C貧方式]| 較佳實施例之詳細說明 以下參照圖式詳細說明本發明之實施型態。第】圖係顯 示由夾頭台之下方拍攝晶圓之本發明之具有拍攝機構(第1 拍攝機構)之雷射加工裝置之概略構成圖。 雷射加工裝置2包含裝載於靜止基台4且可在χ轴方向 上移動之第1滑動塊6。第1滑動塊6藉由滾珠螺絲8及脈衝馬 達10所構成之X軸傳送機構12，沿著一對導軌14在又軸方向 上移動。 第1滑動塊6裝載有可朝Y轴方向移動之筐體16。筐體16 藉由滾珠螺絲18及脈衝馬達20所構成之γ軸傳送機構(變位 傳送機構)22，沿著一對導軌24在Y轴方向上移動。 筐體16上裝載有可旋轉之夾頭台28»第2圖清楚顯示 201013765 出，筐體狀條絲有馬達26，並且親帶職繞於連 結於馬達26之輸出軸之皮帶27與夾頭台28之框體62之外 周。當馬達26旋轉時’夾頭台28透過皮帶27及帶3G而旋轉。 夾頭台28係由例如sus等金屬所形成之圓筒狀框體 6 2、及由例如玻璃等形成之透明保持部(保持塾)6 *所構成。 透明保持部64形成有連接於於後和說明之真空吸引源之 户數吸引溝。29為用以載置於後說明之環狀框架之框架載 置台。 再次參照第1圖，由x軸傳送機構12及¥轴傳送機構22 構成加工傳送機構23。藉此，夾頭台28藉由加卫傳送機構 23可朝X軸方向及γ軸方向移動。 靜止基台4上登立設置有柱體32,該柱體32安裝有收容 了雷射光束發賴構34讀體35。自㈣光束發射機構Μ 所發射之雷射光束係藉由安裝於殼體35之前端之聚光器36 之物鏡而聚光’然後照射在保持於㈣台28之半導體晶圓 等之被加工物（工作件）。 殼體35之前端部配設有與聚光器％整齊排列於χ抽方 向且藉由雷射光束檢測出應雷射加工之加工領域之第2拍 攝機構38。第2拍攝機構38除了藉由可視光進行拍攝之一般 CCD等拍攝元件之外’還包含祕紅祕歸^作件之 紅外線照射機構；探測由紅外線照射機構所照射之紅外線 之光學系統m輪出對應於由該光學系騎探測到之 紅外線之電信號之紅外紅CD等之㈣構件所構成之紅外 線拍攝機構’拍攝之影像則發送到控制器4〇。 7 201013765 控制器40係由電腦所構成，且具有：藉由控制程式進 行運算處理之中央處理裝置(CPU)42;用以儲存控制程式之 唯讀記憶體(R〇M)44、用以儲存運算結果之可讀寫隨機存 取記憶體(RAM)46、計算器48、輸入介面50、及輸出介面 52 ° 56係加工傳送量檢測機構，由沿著導軌14配設之線性 刻度54、及配設於第1滑動塊6且未圖示之讀取頭所構成， 且加工傳送量檢測機構56之檢測信號輸入至控制器4〇之輸 入介面50。 60係變位傳送量檢測機構，由沿著導軌24配設之線性 刻度58、及配設於第2滑動塊16且未圖示之讀取頭所構成， 且變位傳送量檢測機構6〇之檢測信號輸入至控制器40之輸 入介面50。 第2拍攝機構38所拍攝之影像信號輸入至控制器40之 輸入介面50。另一方面，由控制器50之輸出介面52將控制 信號輸出至脈衝馬達10、脈衝馬達2〇、及雷射光束發射機 構34等。 如第3圖所示，筐體16内配設有透過夾頭台28之透明保 持部64而拍攝工作件之第丨拍攝機構75。第丨拍攝機構乃包 含裝載於筐體16之底面16a上且可在X轴方向上移動之第3 滑動塊66。第3滑動塊66藉由滾珠螺絲68及脈衝馬達7〇所構 成之X軸移動機構72而沿著一對導軌74在又軸方向上移動。 第3滑動塊66上裝載有可朝γ轴方向移動之第4滑動塊 76。即，第4滑動塊76藉由滾珠螺絲78及脈衝馬達8〇所構成 201013765 之Y軸傳送機構82而沿著一對導軌84在γ軸方向上移動。 第4滑動塊76上豎立設置有柱體86。柱體86裝载有可朝 ζ轴方向移動之相機單元88。即，相機單元88藉由滾珠螺絲 90及脈衝馬達92所構成之ζ軸移動機構94而沿著一對導軌 96在Ζ轴方向上移動。 由X轴移動機構72、Υ轴移動機構82、及2轴移動機構 94構成拍攝機構傳送設備95。本實施型態之變形例係，相 機單tg88直接裝載於第4滑動塊76上時，藉由χ軸移動機構 72及Υ轴移動機構82構成拍攝機構傳送設備95。 參照第4圖，係顯示第丨實施型態之相機單元88之概略 構成圖。相機單元88含有光源100、低倍率相機1〇2、及高 倍率相機104。 來自光源100之出射光在反射鏡1〇6及半反射鏡1〇8反 射，且透過相機單元88之開口 110、筐體16之開口 17(參照 第3圖）及夾頭台28之透明保持部64而纟下侧照射到保持在 夾頭台28之半導體晶圓等之工作件。 低倍率相機102透過反射鏡114、半反射鏡112、半反射 鏡108'夾頭台28之透明保持部64拍攝卫作件之預定處，並 且高倍率相機104通過半反射鏡U2、半反射鏡1〇8、夾頭台 28之透明保持部64而拍攝工作件之前述預定處。 本實施型態之相機單元88中，由於複數相機1〇2，1〇4拍 攝工作件之同一處’因此例如由低倍率相機1〇2切換到高倍 率相機104時，不需要軸的傳送，控制變得容易，並且可縮 小傳送相機單元88之轴的衝程。 9 201013765 參照第5圖’係顯示第2實施型態之相機單元88A之概略 ，· 構成圖。相機單元88A包含有：光源1〇〇、低倍率IR相機116、 高倍率IR相機118、低倍率相機1〇2、及高倍率相機104。 與第4圖所示之實施型態相同’光源1〇〇之出射光通過 反射鏡106、半反射鏡1〇8、開口 110、筐體16之開口 π及夾 頭台28之透明保持部64，而照射到保持於夾頭台28之工作 件。 反射鏡120配設成可藉由汽缸122而朝箭頭A方向移 動’反射鏡124配設成可藉由汽缸126而朝箭頭A方向移動， 書 反射鏡128配設成可藉由汽缸13〇而朝箭頭a方向移動。反射 鏡132、134、及136係配設成固定的。 以低倍率IR相機116拍攝時，係藉由如第5圖所示之相 機配置而進行拍攝。即’透過反射鏡132、反射鏡120、半 反射鏡108、夹頭台28之透明保持部64,而拍攝保持在夾頭 台28之工作件的預定處。 使用高倍率IR相機115拍攝時，驅動汽缸122，使反射 鏡120朝右手方向退避。藉此，高倍率汉相機118透過反射 Μ 鏡134、反射鏡124、半反射鏡1〇8及夾頭台28之透明保持部 64 ’可拍攝保持於夾頭台28之工作件之前述預定處。 使用低倍率相機102拍攝時，驅動汽缸122及126，使反 射鏡120及124朝右手方向退避。藉此，低倍率相機1〇2透過 反射鏡136、反射鏡128、半反射鏡1〇8及夾頭台28之透明保 持部64 ’可拍攝保持於夾頭台28之工作件之前述預定處。 使用高倍率相機104拍攝時，驅動汽缸122、126、130， 10 201013765 使反射鏡120、124、128朝右手方向退避。藉此，高倍率相 機1〇4透過半反射鏡108及夾頭台28之透明保持部64，可拍 攝保持於夾頭台28之工作件之前述預定處。使用本實施型 態之相機單元88A’即使係不透過可視光之工作件的半截止 亦可確認截止狀態。 參照第6圖，係顯示為雷射加工裝置2之加工對象之半 導體晶圓1之表面側立體圖。晶圓丨之表面la在由形成格子 狀溝道(分割預定線)所分隔出之各領域形成元件5。各元件5 形成有在調準時做為檢測對象之目標圖案7。 第1圖所示之雷射加工裝置2在進行加工時，晶圓1之表 面側la側朝下，貼附於切割膠帶(黏著膠帶)τ，切割膠帶τ 之外周部係如第7圖所示貼附於環狀框架f。藉此，半導體 曰b圓1在其襄面lb朝上之第7圖狀態下裝載於爽頭台μ上。 參照第8圖’其係顯不藉由分割膝帶τ裝載於環狀框竿p> 之其他種類之半導體晶圓1A之裏面側立體圖。半導體晶圓 1A之襄面形成有金屬廣9。因此’此種半導體晶圓1 a之目 標圖案7之拍攝係即使第2拍攝機構38含有IR相機也不可能 的0 可是’由於第3圖所示之第1拍攝機構75係配設於半導 體晶圓1A之下側’且透過夾頭台28之透明保持塾64而拍攝 半導體晶圓1A，因此可輕易拍攝目標圖案7。 參照第9圖’係顯不LED晶圓等之小握複數工作件11的 表面侧貼附於切割膠帶T ’且切割膠帶T之周邊部貼附於環 狀框架F之狀態。 201013765 如此，令複數工作件 時，在使用雷射，，贴附於切割膠帶τ 綱物個工作件11之加工時，可 使用第1拍攝機構75進行下一工作件u之調準。 於如^^=^工I置之加工縣仏作件並不限定 裝用之〜w π之半導體晶圓等者’可舉例如作為晶片安 裝用之玟置於晶圓襄 件，ttaeh fihn)#之黏著構 之輕、随、朗系或衫之基板、The axis direction and the X holding mechanism parallel to the (4) maintaining the 敎 surface are relatively transmitted in the direction of the mandrel. The above-mentioned part is captured and held in the ___ mechanism, and the above-mentioned holding structure includes: beat =====, the aforementioned X of the camera The axis direction and the cymbal axis structure are described in the mechanism transfer device, and the slave device: the transfer of the photographing mechanism is transmitted integrally with the holding mechanism 5 201013765 by the front* processing transport mechanism. Preferably, the photographing means has at least two or more photographing cameras having different magnifications, and two or more photographing cameras capture the same portion of the holding portion. Preferably, the photographing mechanism has at least the above IR photographing camera. The preferred 疋' processing apparatus further has a JL-making (4) 2 photographic mechanism that is held by the (4) mechanism from the opposite side of the holding portion. Advantageous Effects of Invention According to the present invention, it is possible to provide a processing apparatus which is not subject to the structure of a workpiece even if a workpiece having an opaque layer between the t-work mechanism and the object is processed. Or the material can be affected by the adjustment. C-poor mode] | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic block diagram showing a laser processing apparatus having a photographing mechanism (first photographing means) of the present invention in which a wafer is photographed from below the chuck table. The laser processing apparatus 2 includes a first slider 6 that is mounted on the stationary base 4 and that is movable in the x-axis direction. The first slider 6 is moved in the axial direction along the pair of guide rails 14 by the X-axis transfer mechanism 12 constituted by the ball screw 8 and the pulse motor 10. The first slider 6 is loaded with a housing 16 that is movable in the Y-axis direction. The casing 16 is moved in the Y-axis direction along the pair of guide rails 24 by a γ-axis transfer mechanism (displacement transfer mechanism) 22 composed of a ball screw 18 and a pulse motor 20. The housing 16 is loaded with a rotatable chuck table 28» Figure 2 clearly shows 201013765, the basket-shaped wire has a motor 26, and the belt 27 and the chuck are attached to the output shaft of the motor 26. The frame 62 of the table 28 is outside the circumference. When the motor 26 rotates, the chuck table 28 is rotated by the belt 27 and the belt 3G. The chuck table 28 is composed of a cylindrical casing 6 formed of a metal such as sus, and a transparent holding portion (holding) 6* formed of, for example, glass. The transparent holding portion 64 is formed with a number of suction grooves connected to the vacuum suction source described later. 29 is a frame mounting table for carrying the ring frame described later. Referring again to Fig. 1, the x-axis transfer mechanism 12 and the spindle transfer mechanism 22 constitute a process transfer mechanism 23. Thereby, the chuck table 28 can be moved in the X-axis direction and the γ-axis direction by the urging transport mechanism 23. A column 32 is mounted on the stationary base 4, and the column 32 is mounted with a reading body 35 for housing the laser beam. The laser beam emitted from the (four) beam emitting mechanism 聚 is condensed by the objective lens of the concentrator 36 attached to the front end of the casing 35, and then irradiated onto the workpiece such as the semiconductor wafer held at the (four) stage 28. (work piece). The front end portion of the casing 35 is provided with a second photographing mechanism 38 which is aligned with the concentrator % in the pumping direction and detects a laser processing field by laser light beam. The second imaging unit 38 includes an infrared ray irradiation mechanism of a secret red ray, in addition to an imaging element such as a general CCD that is imaged by visible light; and an optical system m that detects infrared rays irradiated by the infrared ray irradiation mechanism An image captured by the infrared imaging mechanism 'constituting the (four) member of the infrared red CD or the like which is an electric signal of the infrared light detected by the optical system is transmitted to the controller 4A. 7 201013765 The controller 40 is composed of a computer and has a central processing unit (CPU) 42 for performing arithmetic processing by a control program, and a read-only memory (R〇M) 44 for storing a control program for storing. The result of the operation is a readable and writable random access memory (RAM) 46, a calculator 48, an input interface 50, and an output interface 52° 56. The processing conveyance amount detecting mechanism is provided by a linear scale 54 disposed along the guide rail 14, and The read head (not shown) is disposed in the first slider 6, and the detection signal of the processed conveyance amount detecting means 56 is input to the input interface 50 of the controller 4. The 60-series displacement conveyance detecting means is constituted by a linear scale 58 disposed along the guide rail 24 and a reading head (not shown) disposed on the second slide block 16, and the displacement conveyance amount detecting mechanism 6〇 The detection signal is input to the input interface 50 of the controller 40. The image signal captured by the second imaging unit 38 is input to the input interface 50 of the controller 40. On the other hand, the control signal is output from the output interface 52 of the controller 50 to the pulse motor 10, the pulse motor 2A, the laser beam transmitter 34, and the like. As shown in Fig. 3, a first imaging mechanism 75 that photographs the workpiece through the transparent holding portion 64 of the chuck table 28 is disposed in the casing 16. The third photographing mechanism includes a third slide block 66 that is mounted on the bottom surface 16a of the casing 16 and movable in the X-axis direction. The third slider 66 is moved in the axial direction along the pair of guide rails 74 by the X-axis moving mechanism 72 constituted by the ball screw 68 and the pulse motor 7A. The third slider 66 is loaded with a fourth slider 76 that is movable in the γ-axis direction. In other words, the fourth slider 76 is moved in the γ-axis direction along the pair of guide rails 84 by the Y-axis transmission mechanism 82 of the 201013765 formed by the ball screw 78 and the pulse motor 8A. A column 86 is erected on the fourth slider 76. The cylinder 86 is loaded with a camera unit 88 that is movable in the direction of the x-axis. That is, the camera unit 88 is moved in the z-axis direction along the pair of guide rails 96 by the spindle movement mechanism 94 constituted by the ball screw 90 and the pulse motor 92. The imaging unit transporting device 95 is constituted by the X-axis moving mechanism 72, the x-axis moving mechanism 82, and the two-axis moving mechanism 94. In the modification of this embodiment, when the camera unit tg88 is directly mounted on the fourth slider 76, the camera mechanism 9 and the spindle moving mechanism 82 constitute the camera mechanism 95. Referring to Fig. 4, there is shown a schematic configuration diagram of a camera unit 88 of the third embodiment. The camera unit 88 includes a light source 100, a low magnification camera 1〇2, and a high magnification camera 104. The emitted light from the light source 100 is reflected by the mirror 1〇6 and the half mirror 1〇8, and is transmitted through the opening 110 of the camera unit 88, the opening 17 of the housing 16 (refer to FIG. 3), and the transparent retention of the chuck table 28. The portion 64 is irradiated to the workpiece held by the semiconductor wafer or the like held by the chuck table 28 at the lower side. The low-magnification camera 102 captures the predetermined position of the wei wei passing through the mirror 114, the half mirror 112, and the transparent holding portion 64 of the half mirror 108' collet 28, and the high-magnification camera 104 passes through the half mirror U2 and the half mirror. 1〇8, the transparent holding portion 64 of the chuck table 28 photographs the aforementioned predetermined portion of the workpiece. In the camera unit 88 of the present embodiment, since the plurality of cameras 1〇2, 1〇4 capture the same portion of the work piece', therefore, for example, when the low-magnification camera 1〇2 is switched to the high-magnification camera 104, the transmission of the axis is not required. Control becomes easy, and the stroke of the shaft that transmits the camera unit 88 can be reduced. 9 201013765 Referring to Fig. 5, a schematic diagram of a camera unit 88A of the second embodiment will be described. The camera unit 88A includes a light source 1A, a low-magnification IR camera 116, a high-magnification IR camera 118, a low-magnification camera 1〇2, and a high-magnification camera 104. The same as the embodiment shown in Fig. 4, the light emitted from the light source 1 passes through the mirror 106, the half mirror 1〇8, the opening 110, the opening π of the casing 16, and the transparent holding portion 64 of the chuck table 28. And the workpiece that is held by the chuck table 28 is irradiated. The mirror 120 is disposed to be movable in the direction of the arrow A by the cylinder 122. The mirror 124 is disposed to be movable in the direction of the arrow A by the cylinder 126, and the book mirror 128 is disposed to be slidable by the cylinder 13 Move in the direction of arrow a. The mirrors 132, 134, and 136 are arranged to be fixed. When shooting with the low magnification IR camera 116, shooting is performed by the camera configuration as shown in Fig. 5. That is, the transparent holding portion 64 of the chuck 132, the mirror 120, the half mirror 108, and the chuck table 28 is imaged and held at a predetermined position of the workpiece held by the chuck table 28. When photographing with the high-magnification IR camera 115, the cylinder 122 is driven to retract the mirror 120 in the right-hand direction. Thereby, the high-powered Han camera 118 can be imaged and held by the reflective mirror 134, the mirror 124, the half mirror 1〇8, and the transparent holding portion 64' of the chuck table 28 at the aforementioned predetermined position of the workpiece of the chuck table 28. . When shooting with the low magnification camera 102, the cylinders 122 and 126 are driven to retract the mirrors 120 and 124 in the right hand direction. Thereby, the low-magnification camera 1〇2 can be imaged and held at the aforementioned predetermined position of the workpiece of the chuck table 28 through the mirror 136, the mirror 128, the half mirror 1〇8, and the transparent holding portion 64' of the chuck table 28. . When photographing with the high magnification camera 104, the cylinders 122, 126, 130, 10 201013765 are driven to retract the mirrors 120, 124, 128 in the right hand direction. Thereby, the high-magnification camera 1〇4 passes through the half mirror 108 and the transparent holding portion 64 of the chuck table 28, and can be photographed and held at the predetermined position of the workpiece of the chuck table 28. The use of the camera unit 88A' of this embodiment mode can confirm the cut-off state even if the half-cut of the workpiece that does not pass through the visible light is passed. Referring to Fig. 6, a perspective view of the surface side of the semiconductor wafer 1 to be processed by the laser processing apparatus 2 is shown. The surface la of the wafer crucible forms the element 5 in each of the fields separated by the lattice-shaped channel (the predetermined dividing line). Each element 5 is formed with a target pattern 7 which is a detection target at the time of alignment. When the laser processing apparatus 2 shown in Fig. 1 performs processing, the surface side la side of the wafer 1 faces downward, and is attached to a dicing tape (adhesive tape) τ, and the outer periphery of the dicing tape τ is as shown in Fig. 7. The sticker is attached to the annular frame f. Thereby, the semiconductor 曰b circle 1 is mounted on the cooling head stage μ in the state of Fig. 7 whose pupil face lb is upward. Referring to Fig. 8, a side view of the other type of semiconductor wafer 1A which is not mounted on the ring frame τp> by dividing the knee band τ is shown. A thin metal 9 is formed on the surface of the semiconductor wafer 1A. Therefore, the imaging system of the target pattern 7 of the semiconductor wafer 1 a is not possible even if the second imaging mechanism 38 includes an IR camera. However, the first imaging mechanism 75 shown in FIG. 3 is disposed in the semiconductor crystal. The semiconductor wafer 1A is taken by the lower side of the circle 1A and the transparent holding 塾 64 of the chuck table 28 is taken, so that the target pattern 7 can be easily photographed. Referring to Fig. 9, the surface side of the small-wound plural workpiece 11 such as the LED wafer is attached to the dicing tape T', and the peripheral portion of the dicing tape T is attached to the annular frame F. 201013765 In this way, when a plurality of workpieces are used, when the laser is used and attached to the cutting tape τ, the work piece 11 is processed, the first photographing mechanism 75 can be used to adjust the next work piece u. For example, the processing of the prefecture is not limited to the semiconductor wafers of the ~w π, such as the wafer mounting device, ttaeh fihn. #的粘结构的轻,随,朗, or the base of the shirt,
零件、各種7〇件、進而要求微米級精確度之各種 加材料。 參照第10圖’係顯示真空配管138安裝於爽頭台28之安 裝狀態之平面圖。第_圖係夾頭台28朝箭頭B方向旋轉 時，真空配管138如第1〇(B)圖所示，與夹頭台28一起旋轉。 參*、、、第Η圖，其係顯示第1圖所示之第1實施型態之筐 體16及夾頭台28之部分縱截面ι關中，係概略地顯示 加工傳送機構23及拍攝機構傳送設備95。Parts, various 7-pieces, and various materials that require micron-level accuracy. Referring to Fig. 10, there is shown a plan view showing the state in which the vacuum piping 138 is attached to the cooling head 28. When the first chuck 28 is rotated in the direction of the arrow B, the vacuum pipe 138 rotates together with the chuck table 28 as shown in Fig. 1(B). Referring to the drawings, which show a part of the vertical cross section of the casing 16 and the chuck table 28 of the first embodiment shown in Fig. 1, the processing conveyance mechanism 23 and the photographing mechanism are schematically shown. Transfer device 95.
第U圖係第11圖之C部分之放大部分截面圖，令半導體 晶圓1之其表面1a為下側，貼附於切割膠帶Τ，並且環狀框 架F裝載於框架載置台29上。 夾頭〇 28之保持部（保持面）64係由玻璃等之透明物質 形成，且具有複數吸引溝14〇。吸引溝14〇連接於真空配管 138。 如第Π圖所示，保持於夾頭台28之透明保持部64之半 導體晶圓1之下側配設有相機單元88，因此即使係對在聚光 器36與拍攝對象物之半導體晶圓1之目標圖案7之間存在有 12 201013765 如金屬層等不透光之層之工作件進行加工時，亦可藉由構 成第1拍攝機構75之相機單元(拍攝機構)88輕易地拍攝目標 圖案，可實施必要之調準。 如第13圖所示，保持部64具有：形成有細孔或吸引溝 等複數吸引路之形成吸引路領域64a ;未形成有吸引路之十 字形的未形成吸引路領域64b、及未形成有吸引路之外周領 域 64c。 相機單元88進行目標圖案之拍攝宜通過未形成吸”路 ^ 領域64b，以確切地捕捉到目標圖案。保持部64係由例如石 英玻璃、硼矽酸玻璃、藍寶石、氟化鈣、氟化鋰或者氟化 鎂任一者所形成。 又，由於夾頭台28之下方配設有相機單元88，因此夹 '· 頭台28可在保持半導體晶圓1之瞬間實施調準。進而，相機 ; 單元88在夾頭台28之下方，可與雷射加工機構獨立移動， 因此’何時皆可確認切削溝之蛇行、襄面磨削、截口位置 • 等的加工狀態。可是，要拍攝調準與焦點位置不同者，則 必須作動Ζ軸傳送機構94，使焦點位置一致。 本說明書中所使用之「透明」等用語係指至少—部分 透過可視光區域、或者此外之波長區域之光的特性。夾著 透明的媒介對向之物體可通過透明的媒介而視認。 又’由於第1圖所示之實施型態之雷射加工裳置2具有 配設在夾頭台28之上側之第2拍攝機構38,因此即使係使用 相機單元88無法拍攝目標圖案之晶圓亦可拍攝目標圖案7。 參照第14圖，顯示本發明之第2實施型態之筐體16及夾 13 201013765 頭台28部份之縱截面圖。本實施型態之筐體16襄栽於 DDM(direCtdrivem〇t〇r)142±。藉此，構成第2拍攝機構75 之相機單元88可旋轉。 DDM142具有中心孔144’該中心孔144中配設有真空配 管148’筐體16形成有形成於保持部（保持面）64之吸引溝14〇 與連接到真空配管148之吸引路146。 本實施型態中，半導体晶圓1係其表面1朝下，藉由失 頭台28之保持部64而直接吸引保持。半導體晶圓丨未支持於 環狀框架，因此半導體晶圓1可與夾頭台28 —起旋轉。本實 錄 施型態中，構成第1拍攝機構75之相機單元88可朝X、γ、z 方向移動，因此也可達成與上述之第1實施型態相同的作用 效果。 參照第15圖’係顯示其他實施型態之保持部64A之縱截 面圖。保持部64A係由玻璃等的透明物質所形成，且具有複 ’ 數橫向吸引溝141以及與橫向吸引溝141垂直之複數縱向吸 * 引溝143。標號145為連接於真空配管138之吸引溝。 以下，說明使用第1拍攝機構75之調準作業。如第丨丨圖 © 所示，於筐體16上載置環狀框架F，並使真空吸引源作動， 藉由夹頭台28之保持部64而吸引保持半導體晶圓i。 由於第1拍攝機構75係位於夾頭台28之保持部64的正 下方’因此當半導體晶圓1裝載於夾頭台28之保持部64上 時’可直接藉由第丨拍攝機構75之相機單元88，通過透明保 持部64拍攝半導體晶圓1，實施調準。 第1拍攝機構75使用於用以檢測應切削加工之溝道之 14 201013765 調準時之圖案比對的影像必須在切削加工前先取得。因 此，當半導體晶圓1保持在夾頭台28之保持部64時光源1〇〇 會亮燈’由下Μ半導體晶^，並且首先使用低倍率相機 102透過透明保持部64來拍攝半導體晶圓丨之表面，並使拍 攝到之影像顯示於未圖示LCD等的顯示器。 雷射加工裝置2之操作者操作未圖示之操作面板，藉此 驅動X軸傳送機構72或Y轴傳送機構82,探索成為圖案比對 之目標之目標圖案7。 當操作者決定目標圖案7時，切換成高倍率相機1〇4， 拍攝目標圖案近處，包含目標圖案7之影像則記憶於設置在 雷射加工裝置2之控制器40之RAM46。 又，藉由座標值等求得該目標圖案7與溝道3之中心線 的距離，並將該值也先記憶於RAM46。又，藉由座標值等 求得相鄰之溝道與溝道之間的間隔(溝道間距），關於溝道間 距之值亦先記憶於控制器40之RAM46。 在沿著半導體晶圓1之溝道3切斷時，實施已記憶之目 標圖案之影像與實際藉由第1拍攝機構75所拍攝而取得之 影像的圖案比對。該圖案比對在朝X軸方向延伸之相同溝道 3且互相間隔之A點與B點二點實施。 當在A點之圖案比對結束時，使相機單元88朝X軸方向 移動’且進行A點與遠離X軸方向之B點的圖案比對。此時， 並非是由A點一 口氣移動到B點來進行圖案比對，而是在往 B點移動之途中之複數處視需要實施圖案比對，然後驅動應 修正Y轴方向之偏離之馬達26’使夾頭台28稍微旋轉而進行 15 201013765 6»補正’最後實施在B點之圖案比對。 备在A點及B點的圖案比對結束時，連結二個目標圖案 7的直線變成與溝道3平行，並且使夾頭台烈朝丫轴方向移動 僅目標圖案7與溝道3之中心線的距離份，藉此進行預切削 之溝道3與聚光器（雷射照射頭）36之對位，結束調準。 根據上述實施型態，即使對在加工機構與拍攝對象物 之間存在有不透光層之被加工物進行加工，也不受被加工 物的構造或材質所影響，可實施調準者。 例如，裏面存在有如金屬層之紅外線(IR)不透過之層之 工作件由裏面進行加工時，亦可拍攝表面側之分割預定 線，實施調準。 又，拍攝工作件之相機單元88一直位於夾頭台28之下 方，因此可在夾頭台28保持工作件之瞬間通過保持部64， 使用相機單元88拍攝工作件，以進行調準。 進而’相機單元88位於夾頭台28之下方，與雷射照射 頭36係獨立動作，因此何時皆可確認加工狀態（蛇行 '裏面 磨削、截口位置等）。 倍率不同之複數拍攝相機係拍攝保持部64之同一處， 因此相機要由小倍率切換成大倍率時，不需要轴的傳送， 可容易切換控制。當相機單元88A包含IR拍攝相機時，亦可 藉可視光不透過之工作件之半截止等確認截止狀態。 本發明之加工裝置並不限定於第1圖所示之雷射加工 裝置2，本發明之第1拍攝機構75亦可同樣適用於如第16圖 所示之切削裝置（切割裝置）152。 16 201013765 - 垂直柱體154豎立設置於切削裝置152之基座4,切削單 元（切削機構）156裝載於該垂直柱體154且可朝Z軸方向移 動。即’切削單元156之殼體158藉由滾珠螺絲162及脈衝馬 達164所構成之Z轴傳送機構166而沿著一對導軌168朝2軸 方向移動。 殼體158中收容有未圖示之旋轉軸及驅動旋轉軸旋轉 之馬達’且於旋轉轴之前端安裝有可褒卸之切削刀片160。 本實施型態之其他構成與第1圖所示之雷射加工裝置2相 ❹ 同，因此省略其說明。 【圖式簡單說明】 第1圖係本發明第1實施型態之雷射加工裝置之概略立 體圖。 第2圖係產體及夹頭台部份之分解立艘圖。 第3圖係收容於筐體之第1拍攝機構之立體圖。 帛4圖係第1實施型態之相機單元之概略構成圖… 第5圖係第2實施型態之相機單元之概略 第6圖係半導體晶圓之表面側立體圖。 帛7®係透㈣裝載於環該之半導體晶圓 之裏面侧立體圖。 第8圖係透過切割膠帶而裝載於環狀框且襄面具有金 屬層之半導體晶圓之襄面側立體圖。 第9圖係複數工作件經由切割膠帶而裝載於《框架 之狀態之立體圖。 第1〇(Α)、(Β)圖係顯示失頭台與真空配管之連接狀態之 17 201013765 平面圖。 第11圖係第1實施型態之筐體及夾頭台部分之縱截面 圖。 第12圖係第11圖之C部分之放大截面圖。 第13圖係保持部之平面圖。 第14圖係第2實施型態之筐體及夾頭台部分之縱截面 圖。 第15圖係保持部之其他實施型態之縱截面圖。 第16圖係具有本發明之第1拍攝機構之切削裝置之概 略立體圖。 【主要元件符號說明】 1...半導體晶圓 12...X轴傳送機構 1A...半導體晶圓 14... Y轴傳送機構 la··.表面 16…筐體 2...雷射加工裝置 17".開口 3...第1溝道 18...滚珠螺絲 4...靜止基台 20...脈衝馬達 5...元件 22...Y轴傳送機構 6...第1滑動塊 23...加工傳送機構 7...目標圖案 24...導軌 8...滾珠螺絲 26...馬達 9...金屬層 27…皮帶 10...脈衝馬達 28...夾頭台 11...工作件 29...框架載置台 18 201013765Fig. U is a cross-sectional view showing an enlarged portion of a portion C of Fig. 11, so that the surface 1a of the semiconductor wafer 1 is on the lower side, attached to the dicing tape Τ, and the annular frame F is mounted on the frame stage 29. The holding portion (holding surface) 64 of the chuck 〇 28 is formed of a transparent material such as glass, and has a plurality of suction grooves 14 〇. The suction groove 14 is connected to the vacuum pipe 138. As shown in the figure, the camera unit 88 is disposed on the lower side of the semiconductor wafer 1 held by the transparent holding portion 64 of the chuck table 28, so that even the semiconductor wafers in the concentrator 36 and the object are aligned. When there is a workpiece between the target pattern 7 of 1 2010, such as a metal layer or the like, the target unit can be easily photographed by the camera unit (photographing mechanism) 88 constituting the first photographing mechanism 75. , the necessary adjustments can be implemented. As shown in Fig. 13, the holding portion 64 has a suction path region 64a in which a plurality of suction paths such as pores or suction grooves are formed, a cross-shaped suction channel region 64b in which a suction path is not formed, and an unformed suction path region 64b. Attracting the road outside the field 64c. The camera unit 88 performs the shooting of the target pattern through the unformed suction field 64b to accurately capture the target pattern. The holding portion 64 is made of, for example, quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride. Or a magnesium fluoride is formed by any one of them. Further, since the camera unit 88 is disposed under the chuck table 28, the clip head unit 28 can perform alignment at the moment of holding the semiconductor wafer 1. Further, the camera; The unit 88 is movable under the chuck table 28 independently of the laser processing mechanism, so that the processing state of the cutting groove, the grinding of the face, the position of the kerf, etc. can be confirmed at all times. However, the shooting is to be adjusted. In the case of a position different from the focus position, the x-axis transfer mechanism 94 must be actuated to make the focus position coincide. The terms "transparent" and the like as used in this specification mean the characteristics of light that passes at least partially through the visible light region or in the other wavelength region. . Objects that are opposed to each other with a transparent medium can be viewed through a transparent medium. Further, since the laser processing skirt 2 of the embodiment shown in Fig. 1 has the second imaging mechanism 38 disposed on the upper side of the chuck table 28, even if the camera unit 88 is used, the wafer of the target pattern cannot be captured. The target pattern 7 can also be taken. Referring to Fig. 14, there is shown a longitudinal sectional view of a casing 16 of the second embodiment of the present invention and a portion of the headstock 28 of the 201013765. The casing 16 of this embodiment is planted in DDM (direCtdrivem〇t〇r) 142±. Thereby, the camera unit 88 constituting the second imaging mechanism 75 is rotatable. The DDM 142 has a center hole 144'. The center hole 144 is provided with a vacuum pipe 148'. The casing 16 is formed with a suction groove 14A formed in the holding portion (holding surface) 64 and a suction path 146 connected to the vacuum pipe 148. In the present embodiment, the semiconductor wafer 1 is directly attracted and held by the holding portion 64 of the lost stage 28 with its surface 1 facing downward. The semiconductor wafer cassette is not supported by the ring frame, so the semiconductor wafer 1 can be rotated together with the chuck table 28. In the present embodiment, the camera unit 88 constituting the first imaging unit 75 can be moved in the X, γ, and z directions. Therefore, the same operational effects as those of the first embodiment described above can be achieved. Referring to Fig. 15, a longitudinal cross-sectional view of the holding portion 64A of another embodiment is shown. The holding portion 64A is formed of a transparent material such as glass, and has a plurality of lateral suction grooves 141 and a plurality of longitudinal suction grooves 143 perpendicular to the lateral suction grooves 141. Reference numeral 145 is a suction groove connected to the vacuum pipe 138. Hereinafter, the alignment operation using the first imaging mechanism 75 will be described. As shown in FIG. ©, the annular frame F is placed on the casing 16, and the vacuum suction source is actuated to hold and hold the semiconductor wafer i by the holding portion 64 of the chuck table 28. Since the first photographing mechanism 75 is located directly below the holding portion 64 of the chuck table 28, 'When the semiconductor wafer 1 is loaded on the holding portion 64 of the chuck table 28, the camera can be directly used by the third photographing mechanism 75. The unit 88 photographs the semiconductor wafer 1 through the transparent holding portion 64 and performs alignment. The first photographing mechanism 75 is used to detect the channel to be cut. 14 201013765 The image of the pattern alignment at the time of alignment must be obtained before the cutting process. Therefore, when the semiconductor wafer 1 is held at the holding portion 64 of the chuck table 28, the light source 1 亮 is lit 'by the lower semiconductor crystal, and the semiconductor wafer is first photographed through the transparent holding portion 64 using the low magnification camera 102. The surface of the cymbal is displayed on the display such as an LCD (not shown). The operator of the laser processing apparatus 2 operates an operation panel (not shown) to drive the X-axis transfer mechanism 72 or the Y-axis transfer mechanism 82 to search for the target pattern 7 to be the target of the pattern alignment. When the operator decides the target pattern 7, it switches to the high-magnification camera 1〇4, and the image of the target pattern 7 is near, and the image including the target pattern 7 is stored in the RAM 46 of the controller 40 provided in the laser processing apparatus 2. Further, the distance between the target pattern 7 and the center line of the channel 3 is obtained by the coordinate value or the like, and the value is also first stored in the RAM 46. Further, the interval between the adjacent channels and the channel (channel pitch) is obtained by the coordinate value or the like, and the value of the channel pitch is also first stored in the RAM 46 of the controller 40. When cutting along the channel 3 of the semiconductor wafer 1, the image of the recorded target pattern is compared with the pattern of the image actually captured by the first imaging unit 75. This pattern is aligned at two points A and B spaced apart from each other in the same channel 3 extending in the X-axis direction. When the pattern alignment at point A ends, the camera unit 88 is moved toward the X-axis direction and the pattern of point A is aligned with the point B away from the X-axis direction. At this time, instead of moving the pattern from point A to point B for pattern comparison, the pattern comparison is performed at a plurality of points on the way to point B, and then the motor that should correct the deviation in the Y-axis direction is driven. 26' Let the chuck table 28 rotate slightly to perform 15 201013765 6»Correcting' final pattern comparison at point B. When the pattern alignment of points A and B is completed, the line connecting the two target patterns 7 becomes parallel to the channel 3, and the chuck table is moved in the x-axis direction only to the center of the target pattern 7 and the channel 3. The distance of the line is divided by the pre-cutting of the channel 3 and the concentrator (laser irradiation head) 36 to complete the alignment. According to the above embodiment, even if the workpiece having the opaque layer between the processing mechanism and the object is processed, it is not affected by the structure or material of the workpiece, and the alignment can be performed. For example, when a workpiece having a layer in which the infrared ray (IR) of the metal layer is not penetrated is processed from the inside, the division line on the surface side may be photographed to perform alignment. Further, the camera unit 88 for photographing the work member is always located below the chuck table 28, so that the workpiece can be photographed by the camera unit 88 at the moment when the chuck table 28 holds the workpiece, and the alignment can be performed. Further, the camera unit 88 is located below the chuck table 28 and operates independently of the laser irradiation head 36. Therefore, it is possible to confirm the machining state (snake grinding, nip position, etc.) at any time. Since the plurality of photographing cameras having different magnifications are the same at the same position as the photographing holding portion 64, when the camera is switched from a small magnification to a large magnification, the transmission of the shaft is not required, and the control can be easily switched. When the camera unit 88A includes an IR photographing camera, the cut-off state can be confirmed by a half cutoff of the work piece that does not pass through the visible light. The processing apparatus of the present invention is not limited to the laser processing apparatus 2 shown in Fig. 1, and the first imaging unit 75 of the present invention is also applicable to the cutting apparatus (cutting apparatus) 152 shown in Fig. 16. 16 201013765 - The vertical cylinder 154 is erected on the base 4 of the cutting device 152, and the cutting unit (cutting mechanism) 156 is mounted on the vertical cylinder 154 and is movable in the Z-axis direction. That is, the casing 158 of the cutting unit 156 is moved in the two-axis direction along the pair of guide rails 168 by the Z-axis transfer mechanism 166 composed of the ball screw 162 and the pulse motor 164. The housing 158 houses a rotating shaft (not shown) and a motor that drives the rotating shaft to rotate, and a detachable cutting insert 160 is attached to the front end of the rotating shaft. The other configuration of this embodiment is the same as that of the laser processing apparatus 2 shown in Fig. 1, and therefore the description thereof will be omitted. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of a laser processing apparatus according to a first embodiment of the present invention. Figure 2 is a breakdown of the product body and the chuck table. Fig. 3 is a perspective view of the first imaging mechanism housed in the casing. Fig. 5 is a schematic view of a camera unit of a first embodiment. Fig. 5 is a schematic view of a camera unit of a second embodiment. Fig. 6 is a perspective view of a surface side of a semiconductor wafer.帛7® is a four-dimensional view of the inside of the semiconductor wafer mounted on the ring. Fig. 8 is a side perspective view of a semiconductor wafer mounted on a ring frame by a dicing tape and having a metal layer on the side. Fig. 9 is a perspective view showing a state in which a plurality of workpieces are loaded in a "frame" via a dicing tape. The first (〇) and (Β) diagrams show the connection status of the headrest and the vacuum piping. 17 201013765 Plan. Fig. 11 is a longitudinal sectional view showing a casing and a chuck portion of the first embodiment. Fig. 12 is an enlarged cross-sectional view showing a portion C of Fig. 11. Figure 13 is a plan view of the holding portion. Fig. 14 is a longitudinal sectional view showing a casing and a chuck portion of the second embodiment. Fig. 15 is a longitudinal sectional view showing another embodiment of the holding portion. Fig. 16 is a schematic perspective view of a cutting device having a first image pickup mechanism of the present invention. [Description of main component symbols] 1...Semiconductor wafer 12...X-axis transfer mechanism 1A...Semiconductor wafer 14...Y-axis transfer mechanism la··.Surface 16...Cassette 2...Ray Injection processing device 17" opening 3... first channel 18... ball screw 4... stationary base 20... pulse motor 5... element 22... Y-axis transmission mechanism 6.. The first sliding block 23...the processing transfer mechanism 7...the target pattern 24...the guide rail 8...the ball screw 26...the motor 9...the metal layer 27...the belt 10...the pulse motor 28 ...clip table 11...working piece 29...frame mounting table 18 201013765
30·.·帶 32.. .柱體 34.. .雷射光束發射機構 35.. .殼體 36.. .聚光器 38.. .第2拍攝機構 40.. .控制器 42.. .中央處理裝置 44.. .唯讀記憶體 46.. .隨機存取記憶體 48.. .計算器 50.. .輸入介面 52.. .輸出介面 54.. .線性刻度 56.. .加工傳送量檢測機構 58.. .線性刻度 60.. .變位傳送量檢測機構 62.. .圓筒狀框體 64.. .保持部 64A...保持部 64a...形成吸引路領域 64b...未形成吸引路領域 66.. .第3滑動塊 68.. .滾珠螺絲 70.. .脈衝馬達 72.. . X軸移動機構 74.. .導執 75.. .第1拍攝機構 76.. .第4滑動塊 78.. .滚珠螺絲 80.. .脈衝馬達 82.. .Y軸傳送機構 84.. .導軌 86.. .柱體 88.. .相機單元 88A...相機單元 90.. .滚珠螺絲 92.. .脈衝馬達 94.. .Z軸移動機構 95.. .拍攝機構傳送設備 96.. .導軌 100.. .光源 102.. .低倍率相機 104…高倍率相機 106.. .反射鏡 108.. .半反射鏡 110".開口 112.. .半反射鏡 19 201013765 114.. .反射鏡 116.. .低倍率IR相機 118.. .高倍率IR相機 120.. .反射鏡 122.. .汽缸 124.. .反射鏡 126.. .汽缸 128.. .反射鏡 130.. .汽缸 132.. .反射鏡 134.. .反射鏡 136.. .反射鏡 138.. .真空配管 141.. .橫向吸引溝30·.·带32.. .柱34...Laser beam emitting mechanism 35... Housing 36.. concentrator 38... 2nd shooting mechanism 40.. controller 42.. Central Processing Unit 44.. Read Only Memory 46.. Random Access Memory 48.. Calculator 50.. Input Interface 52.. Output Interface 54.. Linear Scale 56.. Processing The conveyance amount detecting mechanism 58.. linear scale 60.. displacement transmission amount detecting mechanism 62.. cylindrical casing 64.. holding portion 64A: holding portion 64a... forming the suction path field 64b ...there is no attraction road area 66...3rd sliding block 68.. Ball screw 70..pulse motor 72.. X-axis moving mechanism 74.. .Guide 75.. .1st shooting mechanism 76.. . 4th slide block 78.. Ball screw 80.. Pulse motor 82.. Y-axis transfer mechanism 84.. Guide rail 86.. Column 88.. Camera unit 88A... Camera Unit 90.. Ball screw 92.. Pulse motor 94.. Z-axis moving mechanism 95.. Shooting mechanism conveying device 96.. Guide rail 100.. Light source 102.. Low magnification camera 104... High magnification Camera 106.. Mirror 108.. Half Mirror 110". Opening 112.. Half Mirror 19 201013765 114.. Reflection 116.. . Low magnification IR camera 118.. High magnification IR camera 120.. Mirror 122.. Cylinder 124.. Mirror 126.. Cylinder 128.. Mirror 130.. Cylinder 132 .. . Mirror 134.. Mirror 136.. Mirror 138.. Vacuum tube 141.. Horizontal suction groove
142.. .DDM 143.. .縱向吸引溝 144.. .中心孔 145.. .吸引溝 152.. .切削裝置 154.. .垂直柱體 156…切削單元 158.. .殼體 160.. .切削刀片 162.. .滚珠螺絲 164.. .脈衝馬達 166.. .Z軸傳送機構 168.. .導軌 F...環狀框架 T...切割膠帶 20142.. .DDM 143.. longitudinal suction groove 144.. center hole 145.. suction groove 152.. cutting device 154.. vertical cylinder 156... cutting unit 158.. housing 160.. Cutting insert 162.. Ball screw 164.. Pulse motor 166.. Z-axis conveying mechanism 168.. Guide rail F... Ring frame T... Cutting tape 20