TW201935551A - Processing device does not store the deviation amount of the street and the reference line as a correction value of the processing groove - Google Patents
Processing device does not store the deviation amount of the street and the reference line as a correction value of the processing groove Download PDFInfo
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- TW201935551A TW201935551A TW108105372A TW108105372A TW201935551A TW 201935551 A TW201935551 A TW 201935551A TW 108105372 A TW108105372 A TW 108105372A TW 108105372 A TW108105372 A TW 108105372A TW 201935551 A TW201935551 A TW 201935551A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract
Description
本發明有關形成加工溝之加工裝置，該加工溝是將複數個元件(device)藉由切割道(street)被區隔而形成於表面之晶圓予以分割成一個個元件。The invention relates to a processing device for forming a processing groove. The processing groove divides a plurality of devices on a surface of a wafer formed by partitioning them into streets and divides them into components.
IC、LSI等的元件藉由切割道(分割預定線)被區隔而形成於表面之晶圓，會藉由切削裝置而切割道被切削而被分割成一個個元件，分割出的各元件被利用於行動電話、個人電腦等電子機器。ICs, LSIs, and other components are separated by scribe lines (scheduled lines) and formed on the surface of the wafer. The scribe lines are cut by the cutting device and divided into individual components. The divided components are divided into individual components. Used in electronic devices such as mobile phones and personal computers.
切削裝置，至少具備：保持手段，保持晶圓；及切削手段，具備將被保持於保持手段的晶圓的切割道予以切削之切削刀而可將其旋轉；及X軸饋送手段，將保持手段與切削手段於X軸方向相對地切削饋送；及Y軸饋送手段，將保持手段與切削手段於和X軸方向正交之Y軸方向相對地分度饋送；及拍攝手段，具有顯微鏡，該顯微鏡拍攝被保持於保持手段的晶圓而具備檢測切割道及切削溝之基準線；及顯示手段；而能夠高精度地切削晶圓的切割道(例如參照專利文獻1)。The cutting device includes at least: a holding means to hold the wafer; and a cutting means including a cutting blade capable of cutting the dicing path of the wafer held by the holding means so as to rotate the cutting means; and an X-axis feeding means to hold the means The feed is cut relative to the cutting means in the X-axis direction; and the Y-axis feed means is indexed to feed the holding means and the cutting means in the Y-axis direction orthogonal to the X-axis direction; and a photographing means includes a microscope, the microscope The imaging device is provided with a reference line for detecting a scribe line and a cutting groove by imaging a wafer held by the holding means, and a display means; and the scribe line of the wafer can be cut with high accuracy (for example, refer to Patent Document 1).
也就是說，在顯示手段，係顯示：圖像顯示部，將拍攝手段拍攝到的圖像予以顯示；及切割道修正按鈕，用來將切割道與基準線之偏差量記憶作為修正值；及切削溝修正按鈕，用來將切削溝與基準線之偏差量記憶作為修正值；及X軸作動部，將X軸饋送手段作動；及Y軸作動部，將Y軸饋送手段作動；及一對可動線，包夾基準線而保持線對稱而接近及遠離基準線；及可動線作動部，將一對可動線作動；當將Y軸作動部作動而切割道的中央被置放於基準線並且一對可動線的間隔被置放於切割道的寬幅之情形下，若觸碰切割道修正按鈕則切割道的移動距離會被記憶成Y軸方向的修正值，於下次的切割道的分度饋送中會被修正成基準線和切割道的中央一致。In other words, the display means displays: an image display section that displays an image captured by the photographing means; and a cutting path correction button for memorizing a deviation amount of the cutting path from a reference line as a correction value; and The cutting groove correction button is used to memorize the deviation between the cutting groove and the reference line as a correction value; and the X-axis actuating section operates the X-axis feed means; and the Y-axis actuating section operates the Y-axis feed means; and a pair The movable line is sandwiched with the reference line while keeping the line symmetrical and close to and away from the reference line; and the movable line actuating part actuates a pair of movable lines; when the Y axis actuating part is actuated and the center of the cutting path is placed on the reference line and When the interval of a pair of movable lines is placed in the width of the cutting path, if the cutting path correction button is touched, the moving distance of the cutting path will be memorized as the correction value in the Y-axis direction. In the index feed, the reference line and the center of the cutting line are aligned.
此外，當將Y軸作動部作動而切削溝的中央被置放於基準線並且一對可動線的間隔被置放於切削溝的寬幅之情形下，若觸碰切削溝修正按鈕則切削溝的Y軸方向的移動距離會被記憶成Y軸方向的修正值，於下次的切割道的分度饋送中會被修正成基準線和切削溝的中央一致並且切削溝會被形成於切割道的中央。
[先前技術文獻]
[專利文獻]In addition, if the center of the cutting groove is placed on the reference line when the Y-axis actuator is actuated and the interval between a pair of movable lines is placed on the width of the cutting groove, the cutting groove is touched when the cutting groove correction button is touched. The moving distance in the Y-axis direction will be stored as the correction value in the Y-axis direction. In the next indexing feed of the cutting path, it will be corrected so that the reference line and the center of the cutting groove are consistent and the cutting groove will be formed on the cutting path. The center.
[Prior technical literature]
[Patent Literature]
[專利文獻1] 日本特開2014-113669號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-113669
[發明所欲解決之問題][Problems to be solved by the invention]
但，當將Y軸作動部作動而切割道的中央被置放於基準線並且一對可動線的間隔被置放於切割道的寬幅之情形下，若觸碰切削溝修正按鈕則切割道的修正值會被記憶成切削溝的修正值，而有無法做高精度的分度饋送而無法將切割道高精度地切削之問題。However, if the center of the cutting line is placed on the reference line when the Y-axis actuator is actuated and the distance between a pair of movable lines is placed on the width of the cutting line, the cutting line will be touched if the cutting groove correction button is touched. The correction value of is stored as the correction value of the cutting groove, and there is a problem that it is impossible to do high-precision indexing feed and cannot cut the cutting track with high precision.
此外，當將Y軸作動部作動而切削溝的中央被置放於基準線並且一對可動線的間隔被置放於切削溝的寬幅之情形下，若觸碰切割道修正按鈕則切削溝的修正值會被記憶成切割道的修正值，而有無法將切割道的中央高精度地切削之問題。In addition, if the center of the cutting groove is placed on the reference line when the Y-axis actuator is actuated and the interval between a pair of movable lines is placed on the width of the cutting groove, the cutting groove will be cut if the cutting path correction button is touched The correction value of is stored as the correction value of the cutting path, and there is a problem that the center of the cutting path cannot be accurately cut.
上述問題，在對切割道照射雷射光線而形成分割溝之雷射加工裝置亦可能發生。The above-mentioned problems may also occur in a laser processing apparatus that irradiates a laser beam to a cutting track to form a split groove.
有鑑於上述事實而研發之本發明的待解問題，在於提供一種不會搞混切割道的偏差之修正、與包含切削溝、分割溝的加工溝的偏差之修正的加工裝置。
[解決問題之技術手段]The problem to be solved by the present invention, which was developed in view of the above-mentioned facts, is to provide a processing device that does not confuse the correction of the deviation of the cutting path and the correction of the deviation from the machining groove including the cutting groove and the dividing groove.
[Technical means to solve the problem]
為解決上述待解決問題，本發明提供者為以下的加工裝置。也就是說，一種加工裝置，係形成加工溝之加工裝置，該加工溝是將複數個元件藉由切割道(street)被區隔而形成於表面之晶圓予以分割成一個個元件，該加工裝置，至少具備：保持手段，保持晶圓；及加工手段，在被保持於該保持手段之晶圓的切割道形成加工溝；及X軸饋送手段，將該保持手段與該加工手段於X軸方向相對地加工饋送；及Y軸饋送手段，將該保持手段與該加工手段於和X軸方向正交之Y軸方向相對地分度饋送；及拍攝手段，具有顯微鏡，該顯微鏡拍攝被保持於該保持手段的晶圓而具備檢測切割道及加工溝之基準線；及顯示手段；在該顯示手段，係顯示：圖像顯示部，顯示該拍攝手段拍攝到的圖像；及切割道修正按鈕，用來將切割道與該基準線之偏差量予以記憶作為修正值；及加工溝修正按鈕，用來將加工溝與該基準線之偏差量予以記憶作為修正值；及Y軸作動部，將該Y軸饋送手段作動；及一對可動線，包夾該基準線而保持線對稱而接近及遠離該基準線；及可動線作動部，將該一對可動線作動；當該一對可動線的間隔不是被設定成會被辨識為切割道的寬幅之間隔的情形下，若觸碰該切割道修正按鈕則會報知錯誤，當該一對可動線的間隔不是被設定成會被辨識為加工溝的寬幅之間隔的情形下，若觸碰該加工溝修正按鈕則會報知錯誤。In order to solve the above-mentioned problems to be solved, the present invention provides the following processing devices. That is, a processing device is a processing device for forming a processing groove. The processing groove is a wafer formed by dividing a plurality of elements on a surface by being separated by a street, and the processing is performed. The device includes at least: a holding means to hold the wafer; and a processing means to form a processing groove in a dicing path of a wafer held by the holding means; and an X-axis feeding means to place the holding means and the processing means on the X-axis. Feeding is processed relative to the direction; and Y-axis feeding means is adapted to feed the holding means and the processing means in the Y-axis direction orthogonal to the X-axis direction; and photographing means is provided with a microscope, and the microscope photographing is held at The wafer of the holding means is provided with a reference line for detecting a scribe line and a processing groove; and a display means; and the display means is an image display unit that displays an image captured by the photographing means; and a scribe line correction button , Used to memorize the deviation between the cutting track and the reference line as a correction value; and the machining groove correction button, used to memorize the deviation between the machining groove and the reference line as Are the correction values; and the Y-axis actuating part, actuating the Y-axis feed means; and a pair of movable lines, enclosing the reference line while maintaining line symmetry and approaching and away from the reference line; and the movable line actuating part, Act on the movable line; when the interval of the pair of movable lines is not set to be the wide interval that will be recognized as the cutting track, if you touch the correction button of the cutting track, an error will be reported. In the case where the interval of the lines is not set to be recognized as the wide interval of the machining groove, an error will be reported if the machining groove correction button is touched.
較佳是，當將該Y軸作動部作動而將被顯示於該圖像顯示部的切割道的位置移動至該基準線並且將該可動線作動部作動而使該一對可動線一致於切割道的寬幅之情形下，若觸碰該切割道修正按鈕則切割道的移動距離會被記憶作為切割道的修正值，當將該Y軸作動部作動而將被顯示於該圖像顯示部的加工溝的位置移動至該基準線並且將該可動線作動部作動而使該一對可動線一致於加工溝的寬幅之情形下，若觸碰該加工溝修正按鈕則加工溝的移動距離會被記憶作為加工溝的修正值。該加工手段，為具備切削刀而可將其旋轉之切削手段，該加工溝為切削溝為合適。
[發明之功效]Preferably, when the Y-axis actuating portion is actuated, the position of the cutting track displayed on the image display portion is moved to the reference line, and the movable line actuating portion is actuated to make the pair of movable lines coincide with the cutting. In the case of a wide track, if the cutting track correction button is touched, the moving distance of the cutting track is memorized as the correction value of the cutting track. When the Y-axis actuator is actuated, it is displayed on the image display section. In the case where the position of the machining groove is moved to the reference line and the movable line actuator is operated to make the pair of movable lines coincide with the width of the machining groove, if the machining groove correction button is touched, the machining groove moves a distance It will be memorized as the correction value of processing groove. This processing means is a cutting means provided with a cutting blade and can be rotated, and the processing groove is preferably a cutting groove.
[Effect of the invention]
本發明提供之加工裝置，至少具備：保持手段，保持晶圓；及加工手段，在被保持於該保持手段之晶圓的切割道形成加工溝；及X軸饋送手段，將該保持手段與該加工手段於X軸方向相對地加工饋送；及Y軸饋送手段，將該保持手段與該加工手段於和X軸方向正交之Y軸方向相對地分度饋送；及拍攝手段，具有顯微鏡，該顯微鏡拍攝被保持於保持手段的晶圓而具備檢測切割道及切削溝之基準線；及顯示手段；在該顯示手段，係顯示：圖像顯示部，顯示該拍攝手段拍攝到的圖像；及切割道修正按鈕，用來將切割道與該基準線之偏差量予以記憶作為修正值；及加工溝修正按鈕，用來將加工溝與該基準線之偏差量予以記憶作為修正值；及Y軸作動部，將該Y軸饋送手段作動；及一對可動線，包夾該基準線而保持線對稱而接近及遠離該基準線；及可動線作動部，將該一對可動線作動；當該一對可動線的間隔不是被設定成會被辨識為切割道的寬幅之間隔的情形下，若觸碰該切割道修正按鈕則會報知錯誤，當該一對可動線的間隔不是被設定成會被辨識為加工溝的寬幅之間隔的情形下，若觸碰該加工溝修正按鈕則會報知錯誤，故不會將切割道與基準線之偏差量記憶作為加工溝的修正值，並且不會將加工溝與基準線之偏差量記憶作為切割道的修正值，能夠高精度地做分度饋送而對切割道形成高精度的加工溝。The processing device provided by the present invention includes at least: a holding means for holding a wafer; and a processing means for forming a processing groove on a dicing path of a wafer held by the holding means; and an X-axis feeding means for combining the holding means with the The processing means feeds the processing relative to the X-axis direction; and the Y-axis feeding means relatively feeds the holding means relative to the processing means in the Y-axis direction orthogonal to the X-axis direction; and a photographing means having a microscope, the A microscope is used to photograph the wafer held by the holding means, and a reference line for detecting scribe lines and cutting grooves is provided; and a display means; and the display means is an image display unit that displays an image captured by the imaging means; and The cutting track correction button is used to memorize the deviation between the cutting track and the reference line as a correction value; and the processing groove correction button is used to memorize the deviation between the processing groove and the reference line as a correction value; and the Y axis And a pair of movable lines that enclose the reference line while keeping the line symmetrical and approaching and away from the reference line; and the movable line acting portion, A pair of movable lines act; when the interval of the pair of movable lines is not set to be a wide interval that will be recognized as a cutting track, if the cutting track correction button is touched, an error will be reported. When the interval of the movable line is not set to be recognized as the wide interval of the processing groove, if the processing groove correction button is touched, an error will be reported, so the deviation between the cutting track and the reference line will not be memorized as The correction value of the processing groove, and the deviation between the processing groove and the reference line will not be memorized as the correction value of the cutting track, and the indexing feed can be accurately performed to form a high-precision processing groove on the cutting track.
以下參照圖面，說明遵照本發明而構成之加工裝置的實施形態。Hereinafter, an embodiment of a processing apparatus constructed in accordance with the present invention will be described with reference to the drawings.
圖1中，揭示可藉由遵照本發明而構成之加工裝置而被施以加工之圓盤狀的晶圓2。此晶圓2的表面2a，藉由形成為格子狀的複數個切割道4而被區隔成複數個矩形區域，在複數個矩形區域的各者形成有IC、LSI等的複數個元件6。圖示的實施形態中的晶圓2，被貼附於周緣被固定於環狀框8之黏著膠帶10。FIG. 1 shows a disc-shaped wafer 2 that can be processed by a processing apparatus constructed in accordance with the present invention. The surface 2a of the wafer 2 is divided into a plurality of rectangular regions by a plurality of scribe lines 4 formed in a grid pattern, and a plurality of elements 6 such as ICs and LSIs are formed in each of the plurality of rectangular regions. The wafer 2 in the illustrated embodiment is attached to an adhesive tape 10 whose periphery is fixed to the ring frame 8.
圖2所示之切削裝置12，為遵照本發明而構成之加工裝置的一例，至少具備：保持手段14，保持晶圓2；及切削手段16，作為在被保持於保持手段14的晶圓2的切割道4形成加工溝之加工手段；及X軸饋送手段(未圖示)，將保持手段14與切削手段16於X軸方向(圖1中箭頭X所示方向)相對地加工饋送；及Y軸饋送手段(未圖示)，將保持手段14與切削手段16於和X軸方向正交之Y軸方向(圖1中箭頭Y所示方向)相對地分度饋送；及拍攝手段18；及顯示手段20。另，X軸方向及Y軸方向所規範之平面係實質上水平。此外，圖1中箭頭Z所示之Z軸方向為和X軸方向及Y軸方向正交之上下方向。The cutting device 12 shown in FIG. 2 is an example of a processing device constructed in accordance with the present invention, and includes at least: a holding means 14 to hold the wafer 2; and a cutting means 16 as the wafer 2 held by the holding means 14. Processing means for forming a processing groove by the cutting path 4; and an X-axis feeding means (not shown), which feeds the holding means 14 and the cutting means 16 in the X-axis direction (direction indicated by arrow X in FIG. 1); and Y-axis feeding means (not shown), which feeds the holding means 14 and the cutting means 16 relatively in the Y-axis direction (direction indicated by arrow Y in FIG. 1) orthogonal to the X-axis direction; and the photographing means 18; And display means 20. The planes regulated by the X-axis direction and the Y-axis direction are substantially horizontal. In addition, the Z-axis direction shown by the arrow Z in FIG. 1 is an up-down direction orthogonal to the X-axis direction and the Y-axis direction.
保持手段14，包含旋轉自如且於X軸方向移動自如地被安裝於裝置罩殼22之圓形狀的夾盤平台(chuck table)24。此夾盤平台24，藉由裝置罩殼22中內藏的夾盤平台用馬達(未圖示)，以朝Z軸方向延伸之軸線為中心而被旋轉。圖示的實施形態中的上述X軸饋送手段，由連結至夾盤平台24而朝X軸方向延伸之滾珠螺桿(未圖示)、及令此滾珠螺桿旋轉之馬達(未圖示)所構成，相對於切削手段16將夾盤平台24於X軸方向相對地加工饋送。在夾盤平台24的上端部分，配置連接至吸引手段(未圖示)之多孔質的圓形狀吸附夾盤26，夾盤平台24中，藉由吸引手段在吸附夾盤26生成吸引力，藉此吸引保持承載於上面之晶圓2。此外，在夾盤平台24的周緣，於周方向相距間隔配置有用來固定環狀框8之複數個夾具(clamp)28。The holding means 14 includes a circular chuck table 24 that is rotatably mounted on the device cover 22 and can be moved in the X-axis direction. The chuck platform 24 is rotated around an axis extending in the Z-axis direction by a chuck platform motor (not shown) built in the device cover 22. The X-axis feeding means in the illustrated embodiment is composed of a ball screw (not shown) connected to the chuck table 24 and extending in the X-axis direction, and a motor (not shown) that rotates the ball screw. The chuck table 24 is processed and fed in the X-axis direction relative to the cutting means 16. At the upper end portion of the chuck platform 24, a porous circular suction chuck 26 connected to a suction means (not shown) is arranged. The chuck platform 24 generates a suction force on the suction chuck 26 by the suction means. This attraction keeps the wafer 2 carried on it. In addition, a plurality of clamps 28 for fixing the ring frame 8 are arranged on the periphery of the chuck table 24 at intervals in the circumferential direction.
切削手段16，包含：心軸罩殼30，於Y軸方向移動自如且於Z軸方向移動自如(升降自如)地受到裝置罩殼22支撐；及心軸32，以Y軸方向為軸心而可旋轉地受到心軸罩殼30支撐；及馬達(未圖示)，令心軸32旋轉；及切削刀34，被固定於心軸32的先端。像這樣，作為在晶圓2的切割道4形成加工溝之加工手段的切削手段16，係具備切削刀34而可將其旋轉，圖示的實施形態中形成於晶圓2之加工溝，為藉由切削刀34而形成之切削溝。上述Y軸饋送手段，由連結至心軸罩殼30而朝Y軸方向延伸之滾珠螺桿(未圖示)、及令此滾珠螺桿旋轉之馬達(未圖示)所構成，相對於保持手段14將心軸罩殼30於Y軸方向相對地分度饋送。此外，心軸罩殼30，藉由由朝Z軸方向延伸之滾珠螺桿(未圖示)、及令此滾珠螺桿旋轉之馬達(未圖示)所構成的Z軸饋送手段，而於Z軸方向被切入饋送(升降)。The cutting means 16 includes: a mandrel cover 30, which is supported by the device cover 22 in the Y-axis direction and is freely moved (elevated and lowered) in the Z-axis direction; and a mandrel 32 with the Y-axis direction as an axis It is rotatably supported by the mandrel cover 30; and a motor (not shown) to rotate the mandrel 32; and a cutter 34 is fixed to the front end of the mandrel 32. As described above, the cutting means 16 as a processing means for forming a processing groove in the dicing track 4 of the wafer 2 is provided with a cutting blade 34 and can be rotated. In the illustrated embodiment, the processing groove formed in the wafer 2 is A cutting groove formed by the cutting blade 34. The Y-axis feeding means is composed of a ball screw (not shown) connected to the spindle housing 30 and extending in the Y-axis direction, and a motor (not shown) that rotates the ball screw. The mandrel cover 30 is relatively indexed and fed in the Y-axis direction. In addition, the mandrel cover 30 is provided with a Z-axis feeding means by a ball screw (not shown) extending in the Z-axis direction and a motor (not shown) that rotates the ball screw. The direction is cut into the feed (lifting).
如圖2所示，拍攝手段18，設於夾盤平台24的移動路徑的上方。參照圖3及圖4說明之，拍攝手段18，具有顯微鏡36，該顯微鏡36拍攝被保持於保持手段14的晶圓2而具備檢測切割道4及加工溝(圖示的實施形態中為切削溝)之基準線L(參照圖4)。朝X軸方向延伸之基準線L，形成於顯微鏡36的透鏡或CCD等的拍攝元件(未圖示)。此外，顯微鏡36，受到心軸罩殼30支撐，和心軸罩殼30一起藉由Y軸饋送手段而於Y軸方向被移動，且藉由Z軸饋送手段而於Z軸方向被移動。As shown in FIG. 2, the imaging means 18 is provided above the movement path of the chuck platform 24. As described with reference to FIGS. 3 and 4, the imaging means 18 includes a microscope 36 which images the wafer 2 held by the holding means 14 and includes a detection scribe 4 and a processing groove (a cutting groove in the illustrated embodiment). ) 'S reference line L (see FIG. 4). The reference line L extending in the X-axis direction is formed on a lens of the microscope 36 or an imaging element (not shown) such as a CCD. In addition, the microscope 36 is supported by the mandrel cover 30 and is moved in the Y-axis direction by the Y-axis feeding means together with the mandrel cover 30 and is moved in the Z-axis direction by the Z-axis feeding means.
圖示的實施形態中的顯示手段20，由設於裝置罩殼22的前面上部之觸控面板所構成。如圖4所示，在顯示手段20，係顯示：圖像顯示部38，顯示拍攝手段18拍攝到的圖像；及切割道修正按鈕40，用來將切割道4與基準線L之偏差量予以記憶作為修正值；及加工溝修正按鈕42，用來將加工溝與基準線L之偏差量予以記憶作為修正值；及X軸作動部44，將X軸饋送手段作動；及Y軸作動部46，將Y軸饋送手段作動；及一對可動線48，包夾基準線L而保持線對稱而接近及遠離基準線L；及可動線作動部50，將一對可動線48作動；及修正值顯示部52。The display means 20 in the illustrated embodiment is constituted by a touch panel provided on the upper front portion of the device cover 22. As shown in FIG. 4, the display means 20 displays: an image display section 38 that displays an image captured by the photographing means 18; and a cutting path correction button 40 for shifting the deviation between the cutting path 4 and the reference line L Memorize it as a correction value; and a machining groove correction button 42 for memorizing the deviation amount of the machining groove from the reference line L as a correction value; and an X-axis actuating portion 44 to actuate the X-axis feed means; and a Y-axis actuating portion 46, actuating the Y-axis feed means; and a pair of movable lines 48, enclosing the reference line L while maintaining line symmetry while approaching and away from the reference line L; and the movable line actuating portion 50, actuating the pair of movable lines 48; and correction Value display section 52.
將橫軸訂為X軸方向、將縱軸訂為Y軸方向而顯示拍攝手段18拍攝到的圖像之圖像顯示部38，係和拍攝手段18的基準線L一起將以基準線L為對稱軸之線對稱的一對可動線48平行於X軸方向予以顯示。切割道修正按鈕40，為用來將切割道4與基準線L之偏差量作為修正值而記憶於切削裝置12的記憶手段(未圖示)之按鈕，當將Y軸作動部46作動而將顯示於圖像顯示部38之切割道4的位置移動至基準線L，並且將可動線作動部50作動而使一對可動線48一致於切割道4的寬幅之情形下，若觸碰切割道修正按鈕40則切割道4的移動距離會作為切割道4的修正值而被記憶於上述記憶手段。此外，加工溝修正按鈕42，為用來將加工溝與基準線L之偏差量作為修正值而記憶於上述記憶手段之按鈕，當將Y軸作動部46作動而將顯示於圖像顯示部38之加工溝的位置移動至基準線L，並且將可動線作動部50作動而使一對可動線48一致於加工溝的寬幅之情形下，若觸碰加工溝修正按鈕42則加工溝的移動距離會作為加工溝的修正值而被記憶於上述記憶手段。又，圖示的實施形態中，設計成當一對可動線48的間隔不是被設定成會被辨識為切割道4的寬幅(例如50～60μm)之間隔(例如45μm以上)的情形下，若觸碰切割道修正按鈕40則會報知錯誤，當一對可動線48的間隔不是被設定成會被辨識為加工溝的寬幅(例如25～35μm)之間隔(例如未滿45μm)的情形下，若觸碰加工溝修正按鈕42則會報知錯誤。是故，當將切割道4與基準線L之偏差量記憶作為修正值時，即使作業員誤觸碰加工溝修正按鈕42，切割道4的修正值也不會作為加工溝的修正值而被記憶於上述記憶手段。此外，當將加工溝與基準線L之偏差量記憶作為修正值時，即使作業員誤觸碰切割道修正按鈕40，加工溝的修正值也不會作為切割道4的修正值而被記憶於上述記憶手段。另，作為錯誤的報知，能夠舉出對於顯示手段20之錯誤顯示、警告燈(未圖示)的閃爍或點燈、警告音所致之報知等。The image display unit 38 that sets the horizontal axis to the X-axis direction and the vertical axis to the Y-axis direction to display the image captured by the imaging means 18 will use the reference line L as the reference line L of the imaging means 18 as A pair of movable lines 48 symmetrical to the line of the symmetry axis are displayed parallel to the X-axis direction. The cutting path correction button 40 is a button for storing the deviation between the cutting path 4 and the reference line L in a storage means (not shown) of the cutting device 12 as a correction value. When the Y-axis actuator 46 is operated, the In the case where the position of the cutting path 4 displayed on the image display section 38 is moved to the reference line L, and the movable line actuating section 50 is actuated so that the pair of movable lines 48 conform to the width of the cutting path 4, if the cutting is touched The track correction button 40 stores the moving distance of the cutting track 4 as a correction value of the cutting track 4 in the above-mentioned storage means. In addition, the machining groove correction button 42 is a button for memorizing the deviation between the machining groove and the reference line L as a correction value and storing it in the above-mentioned memory means. When the Y-axis actuator 46 is actuated, it is displayed on the image display unit 38. When the position of the processing groove is moved to the reference line L, and the movable line actuator 50 is operated so that the pair of movable lines 48 conform to the width of the processing groove, if the processing groove correction button 42 is touched, the processing groove is moved. The distance is memorized in the memory means as a correction value of the machining groove. In the illustrated embodiment, when the interval between the pair of movable wires 48 is not set to be recognized as a wide interval (for example, 50 to 60 μm) of the cutting track 4 (for example, 45 μm or more), If you touch the cutting track correction button 40, an error will be reported. When the distance between a pair of movable lines 48 is not set to be recognized as the wide (for example, 25 to 35 μm) interval (for example, less than 45 μm) of the processing groove. If the machining groove correction button 42 is touched, an error will be reported. Therefore, when the deviation between the cutting line 4 and the reference line L is memorized as the correction value, even if the operator accidentally touches the processing groove correction button 42, the correction value of the cutting line 4 will not be used as the correction value of the processing groove. Memorize in the above memory means. In addition, when the deviation between the machining groove and the reference line L is memorized as the correction value, even if the operator accidentally touches the cutting track correction button 40, the correction value of the machining groove is not memorized as the correction value of the cutting track 4. The above means of memory. Examples of the error notification include error display of the display means 20, blinking or lighting of a warning lamp (not shown), and notification by a warning sound.
X軸作動部44，具有將X軸饋送手段作動而使拍攝手段18所致之拍攝區域朝圖4中的右方向移動之右方向作動部44a、及將X軸饋送手段作動而使拍攝手段18所致之拍攝區域朝圖4中的左方向移動之左方向作動部44b。此外，Y軸作動部46，具有將Y軸饋送手段作動而使拍攝手段18朝圖4中的上方向移動之上方向作動部46a、及將Y軸饋送手段作動而使拍攝手段18朝圖4中的下方向移動之下方向作動部46b。此外，可動線作動部50，具有一面保持以基準線L為對稱軸之線對稱的關係一面使一對可動線48朝向基準線L接近之可動線接近部50a、及一面保持以基準線L為對稱軸之線對稱的關係一面使一對可動線48從基準線L遠離之可動線遠離部50b。The X-axis actuator 44 includes a right-direction actuator 44 a that operates the X-axis feed means to move the imaging area caused by the imaging means 18 to the right direction in FIG. 4, and an X-axis feed means to activate the imaging means 18. The resulting photographing area moves to the left direction actuating portion 44b in the left direction in FIG. 4. In addition, the Y-axis actuating unit 46 includes an actuating unit 46a that operates the Y-axis feed means to move the photographing means 18 in the upper direction in FIG. 4 and an Y-axis feed means to move the photographing means 18 in FIG. 4. The middle direction moves the lower direction actuator 46b. In addition, the movable line operating portion 50 has a movable line access portion 50a that keeps a pair of movable lines 48 approaching the reference line L while maintaining a line-symmetric relationship with the reference line L as a symmetry axis, and maintains the reference line L as The symmetrical relationship of the lines of the symmetry axis makes the movable line separation portion 50 b away from the reference line L from the pair of movable lines 48.
當使用如上述般的切削裝置12在晶圓2的切割道4形成切削溝時，首先，將晶圓2的表面2a朝上，使晶圓2吸引保持於夾盤平台24的上面。此外，藉由複數個夾具28將環狀框8固定。接下來，藉由拍攝手段18從上方拍攝晶圓2，基於藉由拍攝手段18拍攝到的晶圓2的圖像，將X軸饋送手段、Y軸饋送手段及夾盤平台用馬達作動，使切割道4對齊X軸方向，並且將切削刀34置放於被對齊於X軸方向之切割道4的上方。接下來，藉由馬達使切削刀34和心軸32一起旋轉。接下來，藉由Z軸饋送手段使心軸罩殼30下降，使切削刀34的刀尖切入被對齊於X軸方向之切割道4，並且將X軸饋送手段作動而對於切削手段16將夾盤平台24相對地朝X軸方向加工饋送，藉此施以沿著切割道4形成用來將晶圓2分割成一個個元件6的切削溝之切削加工。接下來，以恰好事先設定好的分度饋送量的份量(被施以切削加工之前的狀態下的切割道4的Y軸方向間隔)，對於夾盤平台24將切削手段16藉由Y軸饋送手段朝Y軸方向做分度饋送。然後，交互反覆做切削加工與分度饋送，藉此對被對齊於X軸方向之切割道4的全部施以切削加工時，若依上述般藉由切削裝置12形成切削溝的當中，會發生切削加工伴隨之切割道4的Y軸方向的偏差、或心軸32的熱膨脹所致之切削刀34的Y軸方向的偏差。在發生了這樣的偏差的狀態下，若藉由事先設定好的分度饋送量一面做分度饋送一面反覆做切削加工，則恐會切削到從切割道4脫離之位置而使元件6損傷。鑑此，當藉由切削裝置12形成切削溝時，於進行了數次切削加工後會進行加工位置的修正(也就是說，切割道4與切削溝之偏差的修正)。加工位置的修正中，首先，實施求出切割道4與基準線L之Y軸方向的偏差量而記憶作為切割道的修正值之切割道修正，接下來實施求出切削溝與基準線L之Y軸方向的偏差量而記憶作為切削溝的修正值之加工溝修正。另，將沿著切割道4形成的切削溝在圖3中以符號54表示。When a cutting groove is formed in the dicing track 4 of the wafer 2 using the cutting device 12 as described above, first, the surface 2 a of the wafer 2 is directed upward, and the wafer 2 is sucked and held on the chuck table 24. The ring frame 8 is fixed by a plurality of clamps 28. Next, the wafer 2 is photographed from above by the photographing means 18, and based on the image of the wafer 2 photographed by the photographing means 18, the X-axis feed means, the Y-axis feed means, and the chuck platform motor are operated to The cutting track 4 is aligned in the X-axis direction, and the cutter 34 is placed above the cutting track 4 aligned in the X-axis direction. Next, the cutter 34 and the spindle 32 are rotated together by a motor. Next, the mandrel cover 30 is lowered by the Z-axis feeding means, the tip of the cutter 34 is cut into the cutting track 4 aligned in the X-axis direction, and the X-axis feeding means is actuated to clamp the cutting means 16 The disk table 24 relatively feeds in the X-axis direction, thereby performing a cutting process for forming a cutting groove for dividing the wafer 2 into individual elements 6 along the dicing path 4. Next, the cutting means 16 is fed to the chuck table 24 by the Y-axis at the portion of the index feed amount (the interval in the Y-axis direction of the cutting path 4 in the state before the cutting process is applied) just set in advance. Means do index feed towards the Y axis. Then, the cutting process and the index feeding are repeatedly performed alternately, thereby cutting the entirety of the cutting track 4 aligned in the X-axis direction, and if cutting grooves are formed by the cutting device 12 as described above, it will occur. A deviation in the Y-axis direction of the cutting track 4 accompanying the cutting process or a deviation in the Y-axis direction of the cutting blade 34 due to thermal expansion of the mandrel 32. In the state where such a deviation occurs, if the indexing feed amount set in advance is used for indexing and cutting is repeated, cutting may occur to a position detached from the cutting path 4 and the element 6 may be damaged. In view of this, when the cutting groove is formed by the cutting device 12, the machining position is corrected (that is, the deviation between the cutting track 4 and the cutting groove is corrected) after several cutting operations are performed. In the correction of the machining position, first, a cutting track correction is performed to obtain the Y-axis direction deviation between the cutting track 4 and the reference line L and memorize the correction value of the cutting track, and then the calculation of the The amount of deviation in the Y-axis direction is stored as a machining groove correction as a correction value of the cutting groove. A cutting groove formed along the cutting path 4 is indicated by a reference numeral 54 in FIG. 3.
切割道修正中，首先如圖3所示般，將X軸饋送手段及Y軸饋送手段作動來進行晶圓2與拍攝手段18之對位，藉由拍攝手段18拍攝最近形成了切削溝54之切割道4。藉由拍攝手段18拍攝到的圖像，例如如圖5所示，被顯示於顯示手段20的圖像顯示部38。另，當在切割道4周期性地設有稱為TEG(Test Element Group；測試元件群)之金屬圖樣的情形下，在將TEG切斷之處的切削溝而產生金屬毛邊等，若拍攝到此處的切削溝則恐將金屬毛邊等誤認作為切削溝，因此在這樣的情形下會藉由將X軸作動部44作動來調整藉由拍攝手段18拍攝之切割道4的位置，而拍攝未設有TEG之處的切削溝。接下來，基於拍攝出的圖像，如圖6所示般，將Y軸作動部46作動，將被顯示於圖像顯示部38之切割道4的Y軸方向中央位置朝向基準線L移動。此時，作業者是看著拍攝出的圖像，以肉眼抓份量來調整切割道4的位置使得切割道4的Y軸方向中央位置和基準線L一致，故難以藉由Y軸作動部46的1次的作動來將切割道4的Y軸方向中央位置正確地置放於基準線L。因此，會將可動線作動部50作動而將一對可動線48的間隔貼合切割道4的寬幅，來確認切割道4的Y軸方向中央位置是否和基準線L一致。如上述般，一對可動線48，是一面保持以基準線L為對稱軸之線對稱的關係一面接近及遠離，故若一對可動線48的間隔和切割道4的寬幅一致，則切割道4的Y軸方向的中央位置和基準線L便會一致。然後，適當地反覆做Y軸作動部46之作動與可動線作動部50之作動，當如圖7所示般一對可動線48的間隔一致於切割道4的寬幅時，便觸碰切割道修正按鈕40。這樣一來，從修正前的位置起算之切割道4的Y軸方向的移動距離(切割道4與基準線L之偏差量)便會作為切割道4的Y軸方向的修正值而被記憶於切削裝置12的上述記憶手段。此切割道4的修正值會被顯示於顯示手段20的修正值顯示部52(圖示的實施形態中為-5.5μm)。
圖示的實施形態中，於這樣的切割道修正時，即使作業員誤觸碰了加工溝修正按鈕42，當一對可動線48的間隔不是被設定成會被辨識為切削溝54的寬幅之間隔的情形下會報知錯誤，故切割道4的修正值不會被記憶作為切削溝54的修正值。另，圖7中，為求簡便，以比切割道4的寬幅還稍寬的間隔來記載一對可動線48。In the dicing path correction, as shown in FIG. 3, the X-axis feeding means and the Y-axis feeding means are actuated to perform alignment between the wafer 2 and the photographing means 18, and the photographing means 18 is used to photograph the recently formed cutting groove 54. Cutting Road 4. The image captured by the imaging means 18 is displayed on the image display section 38 of the display means 20 as shown in FIG. 5, for example. In addition, when a metal pattern called a TEG (Test Element Group) is periodically provided on the cutting track 4, a metal burr is generated in a cutting groove where the TEG is cut. The cutting groove here is likely to be mistakenly recognized as a cutting groove. Therefore, in this case, the position of the cutting track 4 captured by the imaging means 18 will be adjusted by actuating the X-axis actuator 44. Cutting groove where TEG is installed. Next, based on the captured image, as shown in FIG. 6, the Y-axis operating unit 46 is operated to move the center position in the Y-axis direction of the cutting track 4 displayed on the image display unit 38 toward the reference line L. At this time, the operator looks at the captured image and adjusts the position of the cutting path 4 with the naked eye so that the center position in the Y-axis direction of the cutting path 4 coincides with the reference line L. Therefore, it is difficult to use the Y-axis actuator 46 The center position in the Y-axis direction of the cutting path 4 is accurately placed on the reference line L by a single operation. Therefore, the movable line actuating unit 50 is operated, and the interval of the pair of movable lines 48 is fitted to the width of the cutting track 4 to check whether the center position in the Y-axis direction of the cutting track 4 coincides with the reference line L. As mentioned above, a pair of movable lines 48 approach and move away while maintaining a line-symmetric relationship with the reference line L as the axis of symmetry. Therefore, if the interval between the pair of movable lines 48 and the width of the cutting path 4 are consistent, the cutting is performed. The center position in the Y-axis direction of the track 4 and the reference line L will be aligned. Then, the action of the Y-axis actuator 46 and the action of the movable wire actuator 50 are appropriately repeated. When the interval of the pair of movable wires 48 is consistent with the width of the cutting path 4 as shown in FIG. 7, the cutting is touched. Road correction button 40. In this way, the moving distance in the Y-axis direction of the cutting track 4 (the deviation between the cutting track 4 and the reference line L) calculated from the position before the correction is stored in the Y-axis direction of the cutting track 4 as a correction value. The above-mentioned memory means of the cutting device 12. The correction value of the cutting path 4 is displayed on the correction value display section 52 of the display means 20 (-5.5 μm in the illustrated embodiment).
In the embodiment shown in the figure, even if the operator touches the machining groove correction button 42 by mistake in such a cutting path correction, when the interval between the pair of movable lines 48 is not set to be recognized as the wide width of the cutting groove 54 In the case of an interval, an error will be reported, so the correction value of the cutting track 4 will not be stored as the correction value of the cutting groove 54. In addition, in FIG. 7, for the sake of simplicity, a pair of movable wires 48 are described at intervals slightly wider than the width of the cutting track 4.
接著說明加工溝修正。加工溝修正，是從使切割道4的Y軸方向中央位置一致於基準線L之狀態開始，首先，如圖8所示般，將Y軸作動部46作動，將被顯示於圖像顯示部38之切削溝54的Y軸方向中央位置朝向基準線L移動。接下來，會將可動線作動部50作動而將一對可動線48的間隔貼合切削溝54的寬幅，來確認切削溝54的Y軸方向中央位置是否和基準線L一致。然後，適當地反覆做Y軸作動部46之作動與可動線作動部50之作動，當如圖9所示般一對可動線48的間隔一致於切削溝54的寬幅時，便觸碰加工溝修正按鈕42。這樣一來，從使切割道4的Y軸方向中央位置一致於基準線L之狀態起算之切削溝54的Y軸方向的移動距離，便會作為切削溝54的Y軸方向的修正值而被記憶於切削裝置12的上述記憶手段。此切削溝54的修正值會被顯示於顯示手段20的修正值顯示部52(圖示的實施形態中為+1.2μm)。圖示的實施形態中，於這樣的加工溝修正時，即使作業員誤觸碰了切割道修正按鈕40，當一對可動線48的間隔不是被設定成會被辨識為切割道4的寬幅之間隔的情形下會報知錯誤，故切削溝54的修正值不會被記憶作為切割道4的修正值。另，圖9中，為求簡便，以比切削溝54的寬幅還稍寬的間隔來記載一對可動線48。Next, processing groove correction will be described. The machining groove correction starts from a state where the center position in the Y-axis direction of the cutting track 4 coincides with the reference line L. First, as shown in FIG. 8, the Y-axis actuator 46 is actuated and displayed on the image display unit. The center position in the Y-axis direction of the cutting groove 54 of 38 moves toward the reference line L. Next, the movable line actuating part 50 is operated, and the interval of the pair of movable lines 48 is fitted to the width of the cutting groove 54 to check whether the center position of the cutting groove 54 in the Y-axis direction coincides with the reference line L. Then, the operation of the Y-axis actuating portion 46 and the movable line actuating portion 50 are repeatedly performed as appropriate. When the interval between the pair of movable lines 48 is consistent with the width of the cutting groove 54 as shown in FIG. 9, the processing is touched. Ditch correction button 42. In this way, the moving distance in the Y-axis direction of the cutting groove 54 calculated from a state where the center position of the Y-axis direction of the cutting track 4 coincides with the reference line L is corrected as the Y-axis direction correction value of the cutting groove 54. It is stored in the above-mentioned memory means of the cutting device 12. The correction value of the cutting groove 54 is displayed on the correction value display section 52 of the display means 20 (+1.2 μm in the illustrated embodiment). In the embodiment shown in the figure, even if the operator touches the cutting path correction button 40 by mistake in such a machining groove correction, when the interval between the pair of movable lines 48 is not set to be recognized as the wide width of the cutting path 4 In the case of an interval, an error will be reported, so the correction value of the cutting groove 54 will not be stored as the correction value of the cutting track 4. In addition, in FIG. 9, for the sake of simplicity, a pair of movable wires 48 are described at intervals slightly wider than the width of the cutting groove 54.
如上述般加工位置之修正中，首先於切割道修正中，求出從修正前的位置起算之切割道4的Y軸方向的移動距離(切割道4與基準線L之偏差量)，接下來於加工溝修正中，求出從使切割道4的Y軸方向中央位置一致於基準線L之狀態起算之切削溝54的Y軸方向的移動距離(切削溝54與基準線L之偏差量)，藉此便能使用基準線L正確地求出切割道4與切削溝54之偏差量。然後，藉由對事先設定好的分度饋送量加入切削溝54的修正值而成之修正後的分度饋送量來做分度饋送，藉此便能在切割道4的Y軸方向中央位置形成切削溝54。In the correction of the machining position as described above, first, in the cutting path correction, firstly find the moving distance of the cutting path 4 in the Y-axis direction (the deviation between the cutting path 4 and the reference line L) from the position before the correction. In the machining groove correction, the moving distance in the Y-axis direction of the cutting groove 54 (the amount of deviation between the cutting groove 54 and the reference line L) is calculated from a state where the center position of the Y-axis direction of the cutting track 4 coincides with the reference line L. Therefore, by using the reference line L, the amount of deviation between the cutting track 4 and the cutting groove 54 can be accurately obtained. Then, the indexing feed is adjusted by adding the correction value of the cutting groove 54 to the indexing feed amount set in advance, so that it can be positioned at the center of the Y-axis direction of the cutting track 4 Formed cutting groove 54.
如以上般圖示的實施形態中，當一對可動線48的間隔不是被設定成會被辨識為切割道4的寬幅之間隔的情形下，若觸碰切割道修正按鈕40則會報知錯誤，當一對可動線48的間隔不是被設定成會被辨識為切削溝54的寬幅之間隔的情形下，若觸碰加工溝修正按鈕42則會報知錯誤，故不會將切割道4與基準線L之偏差量記憶作為切削溝54的修正值，並且不會將切削溝54與基準線L之偏差量記憶作為切割道4的修正值，能夠高精度地做分度饋送而對切割道4形成高精度的切削溝54。In the embodiment shown above, when the interval between a pair of movable lines 48 is not set to be recognized as the wide interval of the cutting path 4, if the cutting path correction button 40 is touched, an error will be reported. When the interval between a pair of movable lines 48 is not set to be recognized as the wide interval of the cutting groove 54, if the processing groove correction button 42 is touched, an error will be reported, so the cutting track 4 and the The deviation amount of the reference line L is memorized as the correction value of the cutting groove 54, and the deviation amount of the cutting groove 54 and the reference line L is not memorized as the correction value of the cutting track 4. It is possible to perform index feeding with high accuracy to the cutting track 4 to form a cutting groove 54 with high accuracy.
另，圖示的實施形態中，雖說明了具備將被保持於保持手段14的晶圓2的切割道4予以切削之切削刀34而可將其旋轉的切削手段16之切削裝置12，但亦可為具備對被保持於保持手段的晶圓2的切割道4照射雷射光線而形成分割溝的雷射光線照射手段之雷射加工裝置。In the illustrated embodiment, the cutting device 12 is provided with a cutting means 16 that can cut the cutting path 4 of the wafer 2 held by the holding means 14 and can rotate the cutting means. The laser processing device may be a laser processing device including a laser beam irradiation means for irradiating laser beams on the dicing track 4 of the wafer 2 held by the holding means to form divided grooves.
2‧‧‧晶圓2‧‧‧ wafer
4‧‧‧切割道 4‧‧‧ cutting road
12‧‧‧切削裝置(加工裝置) 12‧‧‧ cutting device (processing device)
14‧‧‧保持手段 14‧‧‧ means of retention
16‧‧‧切削手段(加工手段) 16‧‧‧ cutting means (machining means)
18‧‧‧拍攝手段 18‧‧‧ Shooting methods
20‧‧‧顯示手段 20‧‧‧ Display means
34‧‧‧切削刀 34‧‧‧Cutter
36‧‧‧顯微鏡 36‧‧‧ Microscope
38‧‧‧圖像顯示部 38‧‧‧Image display section
40‧‧‧切割道修正按鈕 40‧‧‧Cutting track correction button
42‧‧‧加工溝修正按鈕 42‧‧‧Processing groove correction button
46‧‧‧Y軸作動部 46‧‧‧Y-axis actuator
48‧‧‧可動線 48‧‧‧ movable line
50‧‧‧可動線作動部 50‧‧‧ Movable line actuator
54‧‧‧切削溝(加工溝) 54‧‧‧ cutting groove (processing groove)
L‧‧‧基準線 L‧‧‧ baseline
[圖1] 晶圓的立體圖。[Fig. 1] A perspective view of a wafer.
[圖2] 遵照本發明而構成之加工裝置的立體圖。 [Fig. 2] A perspective view of a processing device constructed in accordance with the present invention.
[圖3] 進行修正時之拍攝手段及晶圓的立體圖。 [Fig. 3] A perspective view of a photographing means and a wafer during correction.
[圖4] 顯示於圖2所示顯示手段之圖像的模型圖。 [Fig. 4] A model diagram of an image displayed on the display means shown in Fig. 2.
[圖5] 進行修正前之圖像的模型圖。 [Fig. 5] A model view of an image before correction.
[圖6] 從圖5所示狀態將切割道的位置移動至基準線為止之狀態下的圖像的模型圖。 [Fig. 6] A model diagram of an image in a state where the position of the cutting path is moved from the state shown in Fig. 5 to a reference line.
[圖7] 從圖6所示狀態使一對可動線一致於切割道的寬幅之狀態下的圖像的模型圖。 [FIG. 7] A model diagram of an image in a state where a pair of movable lines are aligned with a wide width of a cutting path from the state shown in FIG.
[圖8] 從圖7所示狀態將加工溝的位置移動至基準線為止之狀態下的圖像的模型圖。 [Fig. 8] A model diagram of an image in a state where the position of the processing groove is moved from the state shown in Fig. 7 to the reference line.
[圖9] 從圖8所示狀態使一對可動線一致於加工溝的寬幅之狀態下的圖像的模型圖。 [Fig. 9] A model diagram of an image in a state where a pair of movable lines are aligned with a wide width of a processing groove from the state shown in Fig. 8. [Fig.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-027609 | 2018-02-20 | ||
| JP2018027609A JP6998232B2 (en) | 2018-02-20 | 2018-02-20 | Processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201935551A true TW201935551A (en) | 2019-09-01 |
| TWI776021B TWI776021B (en) | 2022-09-01 |
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| JP2501970B2 (en) * | 1991-05-14 | 1996-05-29 | 株式会社東京精密 | Grooving control device for dicing machine |
| JP2955937B2 (en) * | 1998-03-16 | 1999-10-04 | 株式会社東京精密 | Method and apparatus for controlling groove cutting of dicing machine |
| JPH11283938A (en) * | 1998-03-31 | 1999-10-15 | Disco Abrasive Syst Ltd | Dicing method |
| JP2001297999A (en) * | 2000-04-12 | 2001-10-26 | Disco Abrasive Syst Ltd | Cutting device |
| JP4462717B2 (en) | 2000-05-22 | 2010-05-12 | 株式会社ディスコ | Rotating blade position detection device |
| JP2002141310A (en) * | 2000-11-06 | 2002-05-17 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
| JP5060762B2 (en) * | 2006-10-19 | 2012-10-31 | 株式会社ディスコ | Laser processing equipment |
| JP5198203B2 (en) * | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | Processing equipment |
| JP5389580B2 (en) * | 2009-09-17 | 2014-01-15 | 株式会社ディスコ | Cutting equipment |
| JP5762005B2 (en) * | 2011-01-13 | 2015-08-12 | 株式会社ディスコ | Processing position adjustment method and processing apparatus |
| JP2012256794A (en) * | 2011-06-10 | 2012-12-27 | Disco Abrasive Syst Ltd | Processing device |
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| JP6604715B2 (en) * | 2014-09-12 | 2019-11-13 | 株式会社ディスコ | Laser processing equipment |
| JP6498073B2 (en) | 2015-08-14 | 2019-04-10 | 株式会社ディスコ | Method for detecting misalignment of cutting blade |
| JP6559074B2 (en) | 2016-01-28 | 2019-08-14 | 株式会社ディスコ | Package wafer processing method |
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| JP6600267B2 (en) * | 2016-03-15 | 2019-10-30 | 株式会社ディスコ | Workpiece cutting method |
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