JP7137868B2 - 特に表面実装型デバイス(smd)のための反射性の複合材料及びこの種の複合材料を有する発光デバイス - Google Patents
特に表面実装型デバイス(smd)のための反射性の複合材料及びこの種の複合材料を有する発光デバイス Download PDFInfo
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- JP7137868B2 JP7137868B2 JP2020501555A JP2020501555A JP7137868B2 JP 7137868 B2 JP7137868 B2 JP 7137868B2 JP 2020501555 A JP2020501555 A JP 2020501555A JP 2020501555 A JP2020501555 A JP 2020501555A JP 7137868 B2 JP7137868 B2 JP 7137868B2
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- 239000002131 composite material Substances 0.000 title claims description 47
- 229910052709 silver Inorganic materials 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 230000008646 thermal stress Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- G02B5/0858—Multilayer mirrors, i.e. having two or more reflecting layers at least one of the reflecting layers comprising metal the reflecting layers comprising a single metallic layer with one or more dielectric layers
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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Description
2 1上のVの中間層(面A)
3 2上のVの光学活性多層系(面A)
4、5 3の上側層(面A)
6 3の下側層、反射層(面A)
7 3を覆うVの被覆層(面A)
8 1上のVのAl2O3層(面B)
9 金属層又は金属合金層(面B)
A 1の上側面
B 1の下側面
D ワイヤ
D1 1の厚さ
D2 2の厚さ
D3 3の厚さ
D4 4の厚さ
D5 5の厚さ
D6 6の厚さ
D7 7の厚さ
D8 8の厚さ
D9 9の厚さ
DG Vの総厚さ
DIE 発光ダイオード、SMDの裸チップ実施形態(図2、4)
F LFのHフィンガー(図2、3)
L VとPCBとの間の接合層
LF フレーム支持構造(リードフレーム)
LV Vを有する発光デバイス
M LVの透明な物質(図4)
PCB プリント基板
Q LFのHクロスバー(図3)
SMD 電子デバイス(表面実装デバイス)
SP 溶接点(図2)
V 複合材料
Z ツェナーダイオード、SMDの実施形態(図2)
Claims (19)
- アルミニウムからなるキャリア(1)と、前記キャリア(1)の一方の面(A)上に配された酸化アルミニウムからなる中間層(2)と、前記中間層(2)上に被着された反射増幅光学活性多層系(3)とを有する反射性の複合材料(V)であって、
酸化アルミニウムからなる前記中間層(2)は5nm~200nmの範囲内の厚さ(D2)を有し、前記キャリア(1)の、前記反射増幅光学活性多層系(3)とは反対側の面(B)の表面には、25℃にて、最大1.2*10-1Ωmm2/mの比電気抵抗を有する金属又は金属合金の層(9)が被着され、その際、表面に被着された前記層(9)の当該厚さ(D9)は10nm~5.0μmの範囲内にあり、前記キャリア(1)と前記層(9)との間には、酸化アルミニウムからなる絶縁層(8)を有することを特徴とする複合材料(V)。 - 前記キャリア(1)の、前記反射増幅光学活性多層系(3)とは反対側の当該面(B)の表面に被着された金属又は金属合金の前記層(9)は、25℃にて、最大2.7*10-2Ωmm2/mの比電気抵抗を有することを特徴とする、請求項1に記載の複合材料(V)。
- 酸化アルミニウムからなる前記中間層(2)は10~100nmの範囲内の厚さ(D2)を有することを特徴とする、請求項1又は2に記載の複合材料(V)。
- アルミニウムからなる前記キャリア(1)と表面被着された金属又は金属合金の前記層(9)との間に、遷移金属、特にチタン、クロム又はニッケルからなる接着促進層(10)が配置されていることを特徴とする、請求項1から3のいずれか一項に記載の複合材料(V)。
- 表面被着された金属又は金属合金の前記層(9)は、0.1μm~5.0μmの範囲内の厚さ(D9)を有する銅層であることを特徴とする、請求項1から4のいずれか一項に記載の複合材料(V)。
- 表面被着された金属又は金属合金の前記層(9)は、10nm~500nmの範囲内の厚さ(D9)を有する銀層であることを特徴とする、請求項1から4のいずれか一項に記載の複合材料(V)。
- 表面被着された金属又は金属合金の前記層(9)上に、10nm~500nmの範囲内の厚さを有する不動態層が堆積されていることを特徴とする、請求項1から6のいずれか一項に記載の複合材料(V)。
- 銀層は、表面被着された金属又は金属合金の前記層(9)として及び/又はその上に位置する不動態層として及び/又は前記反射増幅光学活性多層系(3)の一つの反射層(6)として合金化され、合金元素として一つ又は複数の希土類元素及び/又はパラジウム、白金、金、銅、インジウム、チタン、スズ及び/又はモリブデンを含むことを特徴とする、請求項1から7のいずれか一項に記載の複合材料(V)。
- 前記中間層(2)の上方に配置された、特に前記光学的多層系(3)の、一つ又は複数の層(4、5、6、7)並びに表面被着された金属又は金属合金の前記層(9)及び/又は前記不動態層は、スパッタリング層、特に反応性スパッタリングによって生成された層、CVD層若しくはPECVD層、又は、特に電子衝撃によるか又は熱源からの蒸発によって生成された層であることを特徴とする、請求項7又は8のいずれか一項に記載の複合材料(V)。
- 前記キャリア(1)の当該アルミニウムは99.0%を上回る純度を有することを特徴とする、請求項1から9のいずれか一項に記載の複合材料(V)。
- 前記キャリア(1)は、0.1~1.5mmの厚さ(D1)を有することを特徴とする、請求項1から10のいずれか一項に記載の複合材料(V)。
- 前記光学多層系(3)の前記面(A)上の、DIN5036、Teil3(11/79版)に準拠した光全反射率は97%を超えることを特徴とする、請求項1から11のいずれか一項に記載の複合材料(V)。
- 表面実装されたデバイス(SMD)のためのフレーム支持構造(LF)として形成され、その際、前記フレーム支持構造(LF)は、特に平面図で見て、H状の形を有し、そのH状の形の横棒に当たるクロスバー(Q)は、H状の形の縦棒に当たるフィンガー(F)として形成されたシート間を、斜めに延び、その際、前記フレーム支持構造(LF)は、打ち抜き部品・部材及び/又は曲げ部品・部材として又はレーザカッティングによって製造されていることを特徴とする、請求項1から12のいずれか一項に記載の複合材料(V)。
- 多数のフレーム支持構造(LF)がウェブを介して行要素及び列要素として区画状に一体化されている、ストリップ状のシートバーの形のフレームデバイスとして形成されていることを特徴とする、請求項13に記載の複合材料(V)。
- 1600mmまでの幅を有するコイルとして形成されていることを特徴とする、請求項1から12のいずれか一項に記載の複合材料(V)。
- 前記中間層(2)及び前記絶縁層(8)は、前記キャリア(1)の陽極酸化によって形成されたものであることを特徴とする請求項1から15のいずれか一項に記載の複合材料(V)。
- 請求項1から16のいずれか一項に記載の複合材料(V)を含み、電子デバイス(SMD)のためのフレーム支持構造(LF)を形成する、発光デバイス(LV)であって、
その際、前記電子デバイス(SMD)は前記フレーム支持構造(LF)の上側面(A)に載設されて固定されていると共に、別個のワイヤ(D)によって前記フレーム支持構造(LF)と電気的に接触させられ、その際、前記電子デバイス(SMD)と前記フレーム支持構造(LF)とからなる複合体は、下側面(B)において、プリント基板(PCB)と導電物質一体化接合されているように構成した発光デバイス(LV)。 - 前記フレーム支持構造(LF)は、スズ含有はんだ層(L)を介して、前記基板(PCB)と接合されていることを特徴とする、請求項17に記載の発光デバイス(LV)。
- 前記電子デバイス(SMD)はチップ(DIE)として形成された発光ダイオード(LED)であることを特徴とする、請求項17に記載の発光デバイス(LV)。
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DE102017115798.0A DE102017115798A1 (de) | 2017-07-13 | 2017-07-13 | Reflektierendes Verbundmaterial, insbesondere für oberflächenmontierte Bauelemente (SMD), und lichtemittierende Vorrichtung mit einem derartigen Verbundmaterial |
DE102017115798.0 | 2017-07-13 | ||
EP17196142.8A EP3428696B9 (de) | 2017-07-13 | 2017-10-12 | Reflektierendes verbundmaterial, insbesondere für oberflächenmontierte bauelemente (smd), und lichtemittierende vorrichtung mit einem derartigen verbundmaterial |
EP17196142.8 | 2017-10-12 | ||
PCT/EP2018/065516 WO2019011554A1 (de) | 2017-07-13 | 2018-06-12 | Reflektierendes verbundmaterial, insbesondere für oberflächenmontierte bauelemente (smd), und lichtemmittierende vorrichtung mit einem derartigen verbundmaterial |
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- 2017-10-12 ES ES17196142T patent/ES2928618T3/es active Active
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WO2019011554A1 (de) | 2019-01-17 |
US20210367111A1 (en) | 2021-11-25 |
CN110870085A (zh) | 2020-03-06 |
EP3428696A1 (de) | 2019-01-16 |
EP3428696B1 (de) | 2022-07-20 |
US20200194641A1 (en) | 2020-06-18 |
JP2020526935A (ja) | 2020-08-31 |
EP3652569A1 (de) | 2020-05-20 |
PH12020500088A1 (en) | 2020-09-14 |
US20210167262A9 (en) | 2021-06-03 |
DE112017007738A5 (de) | 2020-04-09 |
TWI661153B (zh) | 2019-06-01 |
DE102017115798A1 (de) | 2019-01-17 |
CN115524773A (zh) | 2022-12-27 |
WO2019011456A1 (de) | 2019-01-17 |
TW201909457A (zh) | 2019-03-01 |
KR20200026195A (ko) | 2020-03-10 |
CN110870085B (zh) | 2023-05-12 |
ES2928618T3 (es) | 2022-11-21 |
TW201908645A (zh) | 2019-03-01 |
CN110678784A (zh) | 2020-01-10 |
EP3428696B9 (de) | 2022-09-28 |
KR102592772B1 (ko) | 2023-10-20 |
US11469357B2 (en) | 2022-10-11 |
PL3428696T3 (pl) | 2022-11-14 |
US11444226B2 (en) | 2022-09-13 |
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