CN106328641B - 具有螺旋电感的可见光通信led及其制备方法 - Google Patents

具有螺旋电感的可见光通信led及其制备方法 Download PDF

Info

Publication number
CN106328641B
CN106328641B CN201610886147.4A CN201610886147A CN106328641B CN 106328641 B CN106328641 B CN 106328641B CN 201610886147 A CN201610886147 A CN 201610886147A CN 106328641 B CN106328641 B CN 106328641B
Authority
CN
China
Prior art keywords
core particles
layer
meander line
line inductor
visible light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610886147.4A
Other languages
English (en)
Other versions
CN106328641A (zh
Inventor
孙慧卿
杨晛
郭志友
黄涌
黄鸿勇
孙杰
黄晶
张柱定
刘洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
South China Normal University
Original Assignee
South China Normal University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by South China Normal University filed Critical South China Normal University
Priority to CN201610886147.4A priority Critical patent/CN106328641B/zh
Publication of CN106328641A publication Critical patent/CN106328641A/zh
Priority to US15/490,065 priority patent/US10237933B2/en
Application granted granted Critical
Publication of CN106328641B publication Critical patent/CN106328641B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10Inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/12Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • H01L33/42Transparent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/11Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
    • H04B10/114Indoor or close-range type systems
    • H04B10/116Visible light communication
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/502LED transmitters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0016Processes relating to electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)

Abstract

本发明公开一种具有螺旋电感线圈与圆形芯粒的可见光通信LED,包括蓝宝石衬底,所述蓝宝石衬底上焊有正极焊点和负极焊点,所述蓝宝石衬底上沉积了若干个发光LED芯粒,前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点,其特征在于,每个发光LED芯粒的外围都围绕着一个螺旋电感线圈,该螺旋电感线圈的一端引脚通过连接线与所相邻的发光LED芯粒的n极连接,另一端直接与其所围绕的发光LED芯粒的p极连接。

Description

具有螺旋电感的可见光通信LED及其制备方法
技术领域
本发明涉及可见光光通信技术领域,具体涉及一种具有螺旋电感的可见光通信LED及其制备方法。
背景技术
可见光是电磁波谱中人眼可以感知的部分,可见光谱没有精确的范围,一般情况下人眼睛可以感知电磁波波长400nm ~700nm,正常视力的人眼对波长约为555nm电磁波最为敏感,这种电磁波处于光学频谱的绿光区域。
可见光通信(visible light communication)技术是随着白光发光二极管(lightemitting diode,LED) 照明技术的发展而兴起的无线光通信技术。与传统的有线传输相比,可见光通信具有发射功率高、无电磁干扰、节约能源等优点,因此在世界范围内得到了广泛关注和研究。可见光通信发射系统需要满足室内照明和通信双重要求,而通信信号强度的大小与光照度成正比,因此,良好的通信和室内照明舒适度均要求室内光照度均匀分布。
LED芯粒的调制带宽(modulation bandwidth)是可见光通信系统信道容量和传输速率的决定性因素,受器件的调制深度、伏安特性等因素的多方面影响,目前的可见光通信器件还不完善,单个LED芯粒的功率较小;芯粒自身发光不均匀;高频电路产生的寄生电容加速信号衰减,导致器件的响应频率较低,调制带宽不能满足可见光通信的需求。
发明内容
本发明的目的是解决现有技术的缺陷,提供一种具有螺旋电感线圈与圆形芯粒的可见光通信LED,采用的技术方案如下:
一种具有螺旋电感线圈与圆形芯粒的可见光通信LED,包括蓝宝石衬底,所述蓝宝石衬底上焊有正极焊点和负极焊点,所述蓝宝石衬底上沉积了若干个发光LED芯粒,前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点,其特征在于,每个发光LED芯粒的外围都围绕着一个螺旋电感线圈,所述螺旋电感线圈的一端与其所围绕的发光LED芯粒的负电极连接,另一端与相邻的发光LED芯粒的正电极连接。
作为优选,本发明包括16个发光LED芯粒,所述16个发光LED芯粒排列成4×4的矩阵。
16个芯粒通过串联形式连构,单颗芯粒电压约为3V,通过电流约为5~30mA,电压16×3V=48V,16个芯粒串联在一起,虽然增加了整个器件的电阻R,但是同样比例缩小了整个器件的电容C,降低了电路中的时间常数,相比单个环形结构的芯粒,其整体响应频率得到提升,同时也便于螺旋电感的排布和制作。
作为优选,所述发光LED芯粒包括GaN/InGaN外延片,所述GaN/InGaN外延片的p型层上设置了透明导电层,所述透明导电层上设置了环形正电极,所述环形正电极将芯粒分隔成内环发光区,中环发光区和外环发光区。
作为优选,所述发光LED芯粒的内环发光区,中环发光区和外环发光区,共三个发光区面积相等。
作为优选,所述GaN/InGaN外延片包括由下至上依次设置的缓冲层、n型层、多量子阱层和p型层。
作为优选,所述螺旋电感线圈的电感数值的范围为20 nH ~200nH。
本发明的实验结果表明在频率为10MHz ~ 100MHz的电路中,添加一个范围是20~200nH的电感,可以有效降低电路中的阻抗,减缓输出信号的衰减,提高可见光发射器件响应频率,增加调制带宽,且随着频率的提高,电路产生的电容增大,谐振所需的电感逐渐减小。
作为优选,所述螺旋电感线圈的规格为外径300μm×300μm,内径170μm×170μm,线宽5μm,线距10μm。
上述具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,包括以下步骤:
在蓝宝石衬底上生长若干个独立的GaN/InGaN外延片,并在衬底上焊正极焊点和负极焊点;
通过磁控溅射法在外延片的p型层上沉积一层透明导电层,并在透明导电层上设置N个环形正电极和负电极,制作成若干个发光LED芯粒;
将若干个芯粒排列成矩阵,并将若干个芯粒串联起来,具体为:将前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点;
在每个芯粒外围蒸镀螺旋电感线圈;
将螺旋电感线圈的一端直接与其所围绕的发光LED芯粒的负电极连接,另一端的引脚与相邻的发光LED芯粒的正电极连接。
作为优选,所述在蓝宝石衬底上生长GaN/InGaN外延片具体包括以下步骤:
在蓝宝石衬底上,使用三甲基镓、三甲基铟、NH3分别作为Ga源、In源和N源,SiH4和CP2Mg分别作为n型和p型掺杂源,先在1100℃、H2环境下热处理,在550℃下生长缓冲层,然后升到1070℃生长所述GaN/InGaN外延片的n型层,再降温至760℃生长量子阱层,最后升至970℃生长p型层,生长完成后在750℃和N2环境中退火。
作为优选,在芯粒外围蒸镀螺旋电感线圈具体包括以下步骤:
按预设要安装螺旋电感线圈的位置,在衬底反面溅射一层金属,作为套刻标记;
在衬底正面溅射上一层种子层,甩上光刻胶,曝光显影后进行螺旋电感线圈和环形电极的蒸镀;
去除光刻胶,用干法刻蚀去除种子层;
在衬底正面再溅射上一层种子层,甩上光刻胶,曝光显影后电镀螺旋电感线圈的引脚,然后再次除去光刻胶,用干法刻蚀去除种子层;
覆上一层绝缘保护层,但保证电感线圈的引脚露出;
在绝缘保护层上蒸镀金属连接线,分别连接前一个LED芯粒的n极和后一个螺旋电感线圈的外端引脚;
作为优选,所述绝缘保护层为二氧化硅绝缘保护层。
与现有技术相比,本发明的有益效果:
1、螺旋电感线圈的加入可以减少发光LED芯粒容性电路中产生的阻抗,起到补偿电容、滤波和保护电路的作用。
2、螺旋电感线圈结构微小,和环形电极一起刻蚀制成并和芯粒连接,不需要外接补偿电路。
3、环形正电极采用双环设计,将发光区分成面积相等的3个部分,有利于提高载流子复合和均匀的发光。
4、采用16个芯粒环形串联连接,弥补了单颗型光电器件照明能力不足,同时也能实现均匀的发光和较好的散热。
附图说明
图1是本发明实施例1的可见光通信LED器件的结构示意图;
图2是发光LED芯粒的结构俯视图;
图3是发光LED芯粒的结构侧视图。
图中,1、外延片的蓝宝石衬底,2、发光LED芯粒,3、螺旋电感线圈,4、器件的正极焊点,5、器件的负极焊点,6、二氧化硅绝缘保护层,7,螺旋电感线圈与芯粒负极的连接线,8、环形正电极,9、透明导电层,10、环形负电极,11、内环发光区,12、中环发光区,13、外环发光区,14、外延片缓冲层,15、外延片n层,16、外延片的多量子阱层,17、外延片p层,18、螺旋电感线圈外圈引脚,19、连接线入口,20、连接线出口。
具体实施方式
下面结合附图和实施例对本发明做进一步详细描述。
实施例1:
如图1所示,一种具有螺旋电感线圈与圆形芯粒的可见光通信LED,包括蓝宝石衬底1,所述蓝宝石衬底上焊有正极焊点4和负极焊点5,所述蓝宝石衬底上沉积了若干个发光LED芯粒2,前一个芯粒的负电极10和后一个芯粒的正电极8连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点,每个发光LED芯粒的外围都围绕着一个螺旋电感线圈3,所述螺旋电感线圈的一端与其所围绕的发光LED芯粒的负电极连接,另一端与相邻的发光LED芯粒的正电极连接。
本实施例包括16个发光LED芯粒,所述16个发光LED芯粒排列成4×4的矩阵。
16个芯粒通过串联形式连构,单颗芯粒电压约为3V,通过电流约为5~30mA,电压16×3V=48V,16个芯粒串联在一起,虽然增加了整个器件的电阻R,但是同样比例缩小了整个器件的电容C,降低了电路中的时间常数,相比单个环形结构的芯粒,其整体响应频率得到提升,同时也便于螺旋电感的排布和制作。
所述发光LED芯粒包括GaN/InGaN外延片,所述GaN/InGaN外延片的p型层上设置了透明导电层9,所述透明导电层上设置了环形正电极8,所述环形正电极将芯粒分隔成内环发光区11,中环发光区12和外环发光区13。
所述GaN/InGaN外延片包括由下至上依次设置的缓冲层14、n型层15、多量子阱层16和p型层17。
所述螺旋电感线圈的电感数值的范围为20 nH ~200nH。
本实施例的实验结果表明在频率为10MHz ~ 100MHz的电路中,添加一个范围是20~200nH的电感,可以有效降低电路中的阻抗,提高可见光发射器件响应频率,且随着频率的提高,谐振所需的电感逐渐减小。
所述螺旋电感线圈的规格为外径300μm×300μm,内径170μm×170μm,线宽5μm,线距10μm。
实施例2:
具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,包括以下步骤:
在蓝宝石衬底上生长若干个独立的GaN/InGaN外延片,并在衬底上焊正电极焊点和负电极焊点;
通过磁控溅射法在外延片的p型层上沉积一层透明导电层,并在透明导电层上设置N个环形正电极,制作成发光LED芯粒;
将若干个芯粒排列成矩阵,并将若干个芯粒串联起来,具体为:将前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点;
在每个芯粒外围蒸镀螺旋电感线圈;
该螺旋电感线圈的一端直接与其所围绕的发光LED芯粒的负电极连接,另一端的引脚通过连接线从连接线出口到连接线入口与相邻的发光LED芯粒的正电极连接。
所述在蓝宝石衬底上生长GaN/InGaN外延片具体包括以下步骤:
在蓝宝石衬底上,使用三甲基镓、三甲基铟、NH3分别作为Ga源、In源和N源,SiH4和CP2Mg作为n型和p型掺杂源,先在1100℃、H2环境下热处理,在550℃下生长缓冲层,然后升到1070℃生长所述GaN/InGaN外延片的n型层,再降温至760℃生长量子阱层,最后升至970℃生长p型层,生长完成后在750℃和N2环境中退火。
在芯粒外围蒸镀螺旋电感线圈具体包括以下步骤:
按预设要安装螺旋电感线圈的位置,在衬底反面溅射一层金属,作为套刻标记;
在衬底正面溅射上一层种子层,甩上光刻胶,曝光显影后进行螺旋电感线圈和环形电极的蒸镀;
去除光刻胶,用干法刻蚀去除种子层;
在衬底正面再溅射上一层种子层,甩上光刻胶,曝光显影后电镀螺旋电感线圈的引脚,然后再次除去光刻胶,用干法刻蚀去除种子层;
覆上一层绝缘保护层,但保证电感线圈的引脚露出;
在绝缘保护层上蒸镀金属连接线,分别连接前一个LED芯粒的n极和后一个螺旋电感线圈的外端引脚。
所述绝缘保护层为二氧化硅绝缘保护层。

Claims (10)

1.具有螺旋电感线圈与圆形芯粒的可见光通信LED,包括蓝宝石衬底,所述蓝宝石衬底上焊有正极焊点和负极焊点,所述蓝宝石衬底上沉积了若干个发光LED芯粒,前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点,其特征在于,每个发光LED芯粒的外围都围绕着一个螺旋电感线圈,所述螺旋电感线圈的一端与其所围绕的发光LED芯粒的负电极连接,另一端与相邻的发光LED芯粒的正电极连接。
2.根据权利要求1所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED,其特征在于,包括16个发光LED芯粒,所述16个发光LED芯粒排列成4×4的矩阵。
3.根据权利要求1所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED,其特征在于,所述发光LED芯粒包括GaN/InGaN外延片,所述GaN/InGaN外延片的p型层上设置了透明导电层,所述透明导电层上设置了环形正电极,所述环形正电极将芯粒分隔成内环发光区,中环发光区和外环发光区。
4.根据权利要求3所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED,其特征在于,所述GaN/InGaN外延片包括由下至上依次设置的缓冲层、n型层、多量子阱层和p型层。
5.根据权利要求1所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED,其特征在于,所述螺旋电感线圈的电感数值的范围为20 nH ~200nH。
6.根据权利要求1所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED,其特征在于,所述螺旋电感线圈的规格为外径为300μm×300μm,内径为170μm×170μm,线宽为5μm,线距为10μm。
7.具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,其特征在于,包括以下步骤:
在蓝宝石衬底上生长若干个独立的GaN/InGaN外延片,并在衬底上焊正极焊点和负极焊点;
通过磁控溅射法在外延片的p型层上沉积一层透明导电层,并在透明导电层上设置N个环形正电极,制作成若干个发光LED芯粒;
将若干个芯粒排列成矩阵,并将若干个芯粒串联起来,具体为:将前一个芯粒的负电极和后一个芯粒的正电极连接,第一个芯粒的正电极和最后一个芯粒的负电极分别连接到衬底上的正极焊点和负极焊点;
在每个芯粒外围蒸镀螺旋电感线圈;
将螺旋电感线圈的一端直接与其所围绕的发光LED芯粒的负电极连接,另一端的引脚与相邻的发光LED芯粒的正电极连接。
8.根据权利要求7所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,其特征在于,所述在蓝宝石衬底上生长GaN/InGaN外延片具体包括以下步骤:
在蓝宝石衬底上,使用三甲基镓、三甲基铟、NH3分别作为Ga源、In源和N源,SiH4和CP2Mg分别作为n型和p型掺杂源,先在1100℃、H2环境下热处理,再在550℃下生长缓冲层,然后升到1070℃生长所述GaN/InGaN外延片的n型层,再降温至760℃生长量子阱层,最后升至970℃生长p型层,生长完成后在750℃和N2环境中退火。
9.根据权利要求7所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,其特征在于,在芯粒外围蒸镀螺旋电感线圈具体包括以下步骤:
按预设要安装螺旋电感线圈的位置,在衬底反面溅射一层金属,作为套刻标记;
在衬底正面溅射上一层种子层,甩上光刻胶,曝光显影后进行螺旋电感线圈和环形电极的蒸镀;
去除光刻胶,用干法刻蚀去除种子层;
在衬底正面再溅射上一层种子层,甩上光刻胶,曝光显影后电镀螺旋电感线圈的引脚,然后再次除去光刻胶,用干法刻蚀去除种子层;
覆上一层绝缘保护层,但保证电感线圈的引脚露出;
在绝缘保护层上蒸镀金属连接线,分别连接前一个LED芯粒的n极和后一个螺旋电感线圈的外端引脚。
10.根据权利要求9所述的具有螺旋电感线圈与圆形芯粒的可见光通信LED的制备方法,其特征在于,所述绝缘保护层为二氧化硅绝缘保护层。
CN201610886147.4A 2016-10-11 2016-10-11 具有螺旋电感的可见光通信led及其制备方法 Active CN106328641B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610886147.4A CN106328641B (zh) 2016-10-11 2016-10-11 具有螺旋电感的可见光通信led及其制备方法
US15/490,065 US10237933B2 (en) 2016-10-11 2017-04-18 Visible light communication LED having a spiral inductance coil and a circle core and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610886147.4A CN106328641B (zh) 2016-10-11 2016-10-11 具有螺旋电感的可见光通信led及其制备方法

Publications (2)

Publication Number Publication Date
CN106328641A CN106328641A (zh) 2017-01-11
CN106328641B true CN106328641B (zh) 2018-12-28

Family

ID=57821103

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610886147.4A Active CN106328641B (zh) 2016-10-11 2016-10-11 具有螺旋电感的可见光通信led及其制备方法

Country Status (2)

Country Link
US (1) US10237933B2 (zh)
CN (1) CN106328641B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081831A (zh) * 2019-11-20 2020-04-28 华南师范大学 基于多电极的照明通信器件及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018229022A1 (en) * 2017-06-13 2018-12-20 Philips Lighting Holding B.V. Led module for emitting signals
DE102017115798A1 (de) * 2017-07-13 2019-01-17 Alanod Gmbh & Co. Kg Reflektierendes Verbundmaterial, insbesondere für oberflächenmontierte Bauelemente (SMD), und lichtemittierende Vorrichtung mit einem derartigen Verbundmaterial
DE102018129003A1 (de) * 2018-11-19 2020-05-20 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauelement und anordnung
CN111952330A (zh) * 2020-08-20 2020-11-17 中国科学院半导体研究所 一种可见光通信led阵列及其制备方法
CN113066801B (zh) * 2021-03-19 2024-02-09 合肥京东方光电科技有限公司 背板结构、微型发光二极管显示面板及其制备方法
CN113690265B (zh) * 2021-06-29 2023-01-17 河源市众拓光电科技有限公司 一种用于通信的led的器件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101271917A (zh) * 2008-05-09 2008-09-24 晶能光电(江西)有限公司 半导体发光器件的抗静电结构及其制造方法
US20090096413A1 (en) * 2006-01-31 2009-04-16 Mojo Mobility, Inc. System and method for inductive charging of portable devices
CN100531493C (zh) * 2005-04-19 2009-08-19 电灯专利信托有限公司 Led模块和具有多个led模块的led照明设备
US20110012155A1 (en) * 2009-07-15 2011-01-20 Advanced Optoelectronic Technology Inc. Semiconductor Optoelectronics Structure with Increased Light Extraction Efficiency and Fabrication Method Thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090184468A1 (en) * 2008-01-17 2009-07-23 Hsien-Jung Huang Electrical chess module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100531493C (zh) * 2005-04-19 2009-08-19 电灯专利信托有限公司 Led模块和具有多个led模块的led照明设备
US20090096413A1 (en) * 2006-01-31 2009-04-16 Mojo Mobility, Inc. System and method for inductive charging of portable devices
CN101271917A (zh) * 2008-05-09 2008-09-24 晶能光电(江西)有限公司 半导体发光器件的抗静电结构及其制造方法
US20110012155A1 (en) * 2009-07-15 2011-01-20 Advanced Optoelectronic Technology Inc. Semiconductor Optoelectronics Structure with Increased Light Extraction Efficiency and Fabrication Method Thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081831A (zh) * 2019-11-20 2020-04-28 华南师范大学 基于多电极的照明通信器件及其制备方法

Also Published As

Publication number Publication date
US20180103516A1 (en) 2018-04-12
CN106328641A (zh) 2017-01-11
US10237933B2 (en) 2019-03-19

Similar Documents

Publication Publication Date Title
CN106328641B (zh) 具有螺旋电感的可见光通信led及其制备方法
KR100845856B1 (ko) 발광 소자 패키지 및 그 제조방법
CN103219352B (zh) 阵列式结构的led组合芯片及其制作方法
US10418412B2 (en) Light-emitting diode
KR20090038193A (ko) 발광 장치 및 그 제조방법
JP2011510493A (ja) Led、ledを有するパッケージ構造体、およびledを製作する方法
CN109997234B (zh) 半导体元件和包括该半导体元件的半导体元件封装
CN102916028A (zh) 发光二极管阵列及其制造方法
CN105161587B (zh) 可见光通信led器件
CN105609602A (zh) 可见光通信用倒装rcled及其制备方法
CN108133999A (zh) 一种led芯片结构及其制备方法
CN107482031A (zh) GaN基微米级LED阵列及其制备方法
CN109983588A (zh) 半导体元件
WO2021134748A1 (zh) 发光装置及发光设备
CN104064640A (zh) 垂直型led结构及其制作方法
CN102637783A (zh) 一种垂直结构白光发光二极管及其制造方法
CN101794850A (zh) 平行四边形GaN基发光二极管芯片的对称电极
CN106876547B (zh) 薄膜型发光二极管及其制作方法
CN103647010A (zh) 一种大功率led芯片的制作方法
KR101459554B1 (ko) 발광 셀 및 그 제조방법
CN109461753B (zh) 一种大注入倒装微米led芯片及其制备方法
CN106784223A (zh) 发光二极管及其制作方法
KR102606859B1 (ko) 반도체 소자 및 이를 포함하는 반도체 소자 패키지
CN218548473U (zh) 一种照明通信双用发光器件
CN108119782A (zh) Led压力感应灯

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant