JP7136333B2 - チップ型セラミック電子部品およびその製造方法 - Google Patents

チップ型セラミック電子部品およびその製造方法 Download PDF

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Publication number
JP7136333B2
JP7136333B2 JP2021508855A JP2021508855A JP7136333B2 JP 7136333 B2 JP7136333 B2 JP 7136333B2 JP 2021508855 A JP2021508855 A JP 2021508855A JP 2021508855 A JP2021508855 A JP 2021508855A JP 7136333 B2 JP7136333 B2 JP 7136333B2
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Japan
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glass
conductive paste
free
sintered layer
chip
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JP2021508855A
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Japanese (ja)
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JPWO2020195522A1 (https=
Inventor
孝太 善哉
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2021508855A 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法 Active JP7136333B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062900 2019-03-28
JP2019062900 2019-03-28
PCT/JP2020/008131 WO2020195522A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020195522A1 JPWO2020195522A1 (https=) 2020-10-01
JP7136333B2 true JP7136333B2 (ja) 2022-09-13

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JP2021508855A Active JP7136333B2 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Country Status (5)

Country Link
US (2) US12308170B2 (https=)
JP (1) JP7136333B2 (https=)
KR (2) KR102546723B1 (https=)
CN (1) CN113632187B (https=)
WO (1) WO2020195522A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
WO2005083727A1 (ja) 2004-02-27 2005-09-09 Murata Manufacturing Co., Ltd. 積層型セラミック電子部品及びその製造方法
JP2010199168A (ja) 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

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Publication number Priority date Publication date Assignee Title
CA2058410C (en) * 1991-06-25 1996-08-27 Iwao Ueno Laminated semiconductor ceramic capacitor with a grain boundary-insulated structure and a method for producing the same
US6132486A (en) * 1998-11-09 2000-10-17 Symmco, Inc. Powdered metal admixture and process
US6829136B2 (en) * 2002-11-29 2004-12-07 Murata Manufacturing Co., Ltd. Dielectric ceramic, method for making the same, and monolithic ceramic capacitor
CN100583328C (zh) * 2004-04-23 2010-01-20 株式会社村田制作所 电子元件及其制造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Ｔｄｋ株式会社 電子部品及びその実装構造
US8291585B2 (en) * 2007-08-22 2012-10-23 Tdk Corporation Method for manufacturing electronic component
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101079382B1 (ko) * 2009-12-22 2011-11-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP6015221B2 (ja) * 2012-08-07 2016-10-26 株式会社村田製作所 セラミック電子部品の製造方法
CN105531774B (zh) * 2013-09-24 2018-10-26 株式会社村田制作所 层叠陶瓷电子部件
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
US11371122B2 (en) * 2019-02-28 2022-06-28 Taiyo Yuden Co., Ltd. Magnetic alloy powder and method for manufacturing same, as well as coil component made of magnetic alloy powder and circuit board carrying same
WO2020195523A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
WO2005083727A1 (ja) 2004-02-27 2005-09-09 Murata Manufacturing Co., Ltd. 積層型セラミック電子部品及びその製造方法
JP2010199168A (ja) 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Also Published As

Publication number Publication date
KR20210122840A (ko) 2021-10-12
CN113632187A (zh) 2021-11-09
KR102678753B1 (ko) 2024-06-27
KR102546723B1 (ko) 2023-06-21
CN113632187B (zh) 2023-06-27
JPWO2020195522A1 (https=) 2020-10-01
KR20230092016A (ko) 2023-06-23
US20210375544A1 (en) 2021-12-02
US20240186066A1 (en) 2024-06-06
WO2020195522A1 (ja) 2020-10-01
US12308170B2 (en) 2025-05-20

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