KR102546723B1 - 칩형 세라믹 전자부품의 제조 방법 - Google Patents

칩형 세라믹 전자부품의 제조 방법 Download PDF

Info

Publication number
KR102546723B1
KR102546723B1 KR1020217028640A KR20217028640A KR102546723B1 KR 102546723 B1 KR102546723 B1 KR 102546723B1 KR 1020217028640 A KR1020217028640 A KR 1020217028640A KR 20217028640 A KR20217028640 A KR 20217028640A KR 102546723 B1 KR102546723 B1 KR 102546723B1
Authority
KR
South Korea
Prior art keywords
glass
conductive paste
free
ceramic body
sintered layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217028640A
Other languages
English (en)
Korean (ko)
Other versions
KR20210122840A (ko
Inventor
코타 젠자이
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Priority to KR1020237019178A priority Critical patent/KR102678753B1/ko
Publication of KR20210122840A publication Critical patent/KR20210122840A/ko
Application granted granted Critical
Publication of KR102546723B1 publication Critical patent/KR102546723B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020217028640A 2019-03-28 2020-02-27 칩형 세라믹 전자부품의 제조 방법 Active KR102546723B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237019178A KR102678753B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-062900 2019-03-28
JP2019062900 2019-03-28
PCT/JP2020/008131 WO2020195522A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237019178A Division KR102678753B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Publications (2)

Publication Number Publication Date
KR20210122840A KR20210122840A (ko) 2021-10-12
KR102546723B1 true KR102546723B1 (ko) 2023-06-21

Family

ID=72609287

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217028640A Active KR102546723B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품의 제조 방법
KR1020237019178A Active KR102678753B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237019178A Active KR102678753B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Country Status (5)

Country Link
US (2) US12308170B2 (https=)
JP (1) JP7136333B2 (https=)
KR (2) KR102546723B1 (https=)
CN (1) CN113632187B (https=)
WO (1) WO2020195522A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180233289A1 (en) * 2017-01-25 2018-08-16 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2058410C (en) * 1991-06-25 1996-08-27 Iwao Ueno Laminated semiconductor ceramic capacitor with a grain boundary-insulated structure and a method for producing the same
US6132486A (en) * 1998-11-09 2000-10-17 Symmco, Inc. Powdered metal admixture and process
JP2000216046A (ja) 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
US6829136B2 (en) * 2002-11-29 2004-12-07 Murata Manufacturing Co., Ltd. Dielectric ceramic, method for making the same, and monolithic ceramic capacitor
TWI246095B (en) * 2004-02-27 2005-12-21 Murata Manufacturing Co Multilayer ceramic electronic component and method of manufacturing thereof
CN100583328C (zh) * 2004-04-23 2010-01-20 株式会社村田制作所 电子元件及其制造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Ｔｄｋ株式会社 電子部品及びその実装構造
US8291585B2 (en) * 2007-08-22 2012-10-23 Tdk Corporation Method for manufacturing electronic component
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP5251589B2 (ja) 2009-02-24 2013-07-31 株式会社村田製作所 セラミックコンデンサの製造方法
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101079382B1 (ko) * 2009-12-22 2011-11-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
WO2012111479A1 (ja) 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP6015221B2 (ja) * 2012-08-07 2016-10-26 株式会社村田製作所 セラミック電子部品の製造方法
CN105531774B (zh) * 2013-09-24 2018-10-26 株式会社村田制作所 层叠陶瓷电子部件
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
US11371122B2 (en) * 2019-02-28 2022-06-28 Taiyo Yuden Co., Ltd. Magnetic alloy powder and method for manufacturing same, as well as coil component made of magnetic alloy powder and circuit board carrying same
WO2020195523A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180233289A1 (en) * 2017-01-25 2018-08-16 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor

Also Published As

Publication number Publication date
KR20210122840A (ko) 2021-10-12
CN113632187A (zh) 2021-11-09
KR102678753B1 (ko) 2024-06-27
CN113632187B (zh) 2023-06-27
JPWO2020195522A1 (https=) 2020-10-01
KR20230092016A (ko) 2023-06-23
US20210375544A1 (en) 2021-12-02
US20240186066A1 (en) 2024-06-06
WO2020195522A1 (ja) 2020-10-01
JP7136333B2 (ja) 2022-09-13
US12308170B2 (en) 2025-05-20

Similar Documents

Publication Publication Date Title
KR102558658B1 (ko) 칩형 세라믹 전자부품의 제조 방법
US8553390B2 (en) Ceramic electronic component
KR102112107B1 (ko) 전자부품 및 전자부품의 제조 방법
US10541078B2 (en) Electronic component
CN110164689A (zh) 多层陶瓷电子组件
TWI665691B (zh) 積層陶瓷電容器及其製造方法
TW201526051A (zh) 多層陶瓷電子組件及具有該電子組件的印刷電路板
US12249464B2 (en) Electronic component
US20250062074A1 (en) Ceramic electronic chip component and method for manufacturing the same
US12100557B2 (en) Electronic component
WO2017002495A1 (ja) チップ型セラミック電子部品
KR102546723B1 (ko) 칩형 세라믹 전자부품의 제조 방법
KR20200064860A (ko) 적층 세라믹 커패시터
JP4544838B2 (ja) ビア導体用銅ペーストとそれを用いたセラミック配線基板
JPH0544838B2 (https=)
JPH10172859A (ja) セラミック電子部品およびその製造方法

Legal Events

Date Code Title Description
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601