JPWO2020195522A1 - - Google Patents

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Publication number
JPWO2020195522A1
JPWO2020195522A1 JP2021508855A JP2021508855A JPWO2020195522A1 JP WO2020195522 A1 JPWO2020195522 A1 JP WO2020195522A1 JP 2021508855 A JP2021508855 A JP 2021508855A JP 2021508855 A JP2021508855 A JP 2021508855A JP WO2020195522 A1 JPWO2020195522 A1 JP WO2020195522A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021508855A
Other languages
Japanese (ja)
Other versions
JP7136333B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195522A1 publication Critical patent/JPWO2020195522A1/ja
Application granted granted Critical
Publication of JP7136333B2 publication Critical patent/JP7136333B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2021508855A 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法 Active JP7136333B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062900 2019-03-28
JP2019062900 2019-03-28
PCT/JP2020/008131 WO2020195522A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020195522A1 true JPWO2020195522A1 (https=) 2020-10-01
JP7136333B2 JP7136333B2 (ja) 2022-09-13

Family

ID=72609287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508855A Active JP7136333B2 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Country Status (5)

Country Link
US (2) US12308170B2 (https=)
JP (1) JP7136333B2 (https=)
KR (2) KR102546723B1 (https=)
CN (1) CN113632187B (https=)
WO (1) WO2020195522A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) * 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
WO2005083727A1 (ja) * 2004-02-27 2005-09-09 Murata Manufacturing Co., Ltd. 積層型セラミック電子部品及びその製造方法
JP2010199168A (ja) * 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) * 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) * 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) * 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2058410C (en) * 1991-06-25 1996-08-27 Iwao Ueno Laminated semiconductor ceramic capacitor with a grain boundary-insulated structure and a method for producing the same
US6132486A (en) * 1998-11-09 2000-10-17 Symmco, Inc. Powdered metal admixture and process
US6829136B2 (en) * 2002-11-29 2004-12-07 Murata Manufacturing Co., Ltd. Dielectric ceramic, method for making the same, and monolithic ceramic capacitor
CN100583328C (zh) * 2004-04-23 2010-01-20 株式会社村田制作所 电子元件及其制造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Ｔｄｋ株式会社 電子部品及びその実装構造
US8291585B2 (en) * 2007-08-22 2012-10-23 Tdk Corporation Method for manufacturing electronic component
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101079382B1 (ko) * 2009-12-22 2011-11-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP6015221B2 (ja) * 2012-08-07 2016-10-26 株式会社村田製作所 セラミック電子部品の製造方法
CN105531774B (zh) * 2013-09-24 2018-10-26 株式会社村田制作所 层叠陶瓷电子部件
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
US11371122B2 (en) * 2019-02-28 2022-06-28 Taiyo Yuden Co., Ltd. Magnetic alloy powder and method for manufacturing same, as well as coil component made of magnetic alloy powder and circuit board carrying same
WO2020195523A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) * 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
WO2005083727A1 (ja) * 2004-02-27 2005-09-09 Murata Manufacturing Co., Ltd. 積層型セラミック電子部品及びその製造方法
JP2010199168A (ja) * 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) * 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) * 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) * 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Also Published As

Publication number Publication date
KR20210122840A (ko) 2021-10-12
CN113632187A (zh) 2021-11-09
KR102678753B1 (ko) 2024-06-27
KR102546723B1 (ko) 2023-06-21
CN113632187B (zh) 2023-06-27
KR20230092016A (ko) 2023-06-23
US20210375544A1 (en) 2021-12-02
US20240186066A1 (en) 2024-06-06
WO2020195522A1 (ja) 2020-10-01
JP7136333B2 (ja) 2022-09-13
US12308170B2 (en) 2025-05-20

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