JP7135864B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP7135864B2 JP7135864B2 JP2018555044A JP2018555044A JP7135864B2 JP 7135864 B2 JP7135864 B2 JP 7135864B2 JP 2018555044 A JP2018555044 A JP 2018555044A JP 2018555044 A JP2018555044 A JP 2018555044A JP 7135864 B2 JP7135864 B2 JP 7135864B2
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- thermosetting resin
- metal foil
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Description
工程(I):熱硬化性樹脂組成物が含まれる熱硬化性樹脂フィルム上に、能動面を有する半導体素子を1つ以上、熱硬化性樹脂フィルムと半導体素子の能動面とが接するように配置する。
工程(II):熱硬化性樹脂フィルム上に配置された半導体素子を半導体封止用部材で封止する。
工程(III):工程(II)の後、熱硬化性樹脂フィルム若しくはその硬化物に、半導体素子の能動面にまで至る開口を設ける。
工程(IV):開口に導体を充填する又は開口の内側に導体層を形成する。
多官能エポキシ樹脂(A)は、エポキシ基を2個以上有する樹脂であれば、特に限定されないが、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ナフタレン型エポキシ樹脂、アラルキルノボラック型エポキシ樹脂、フルオレン型エポキシ樹脂、キサンテン型エポキシ樹脂等が挙げられる。金属箔又はめっき銅との接着性の観点から、ビフェニル構造を有することが好ましく、ビフェニル構造を有する多官能エポキシ樹脂又はビフェニル構造を有するアラルキルノボラック型エポキシ樹脂がより好ましい。
活性エステル硬化剤(B)は、エステル基を1分子中に1個以上有し、エポキシ樹脂の硬化作用を有するものをいう。活性エステル硬化剤(B)としては、特に制限はないが、例えば、脂肪族又は芳香族カルボン酸と脂肪族又は芳香族ヒドロキシ化合物とから得られるエステル化合物等が挙げられる。これらの中でも、脂肪族カルボン酸、脂肪族ヒドロキシ化合物等から得られるエステル化合物は、脂肪族鎖を含むことにより有機溶媒への可溶性及びエポキシ樹脂との相溶性を高くできる傾向にある。また、芳香族カルボン酸、芳香族ヒドロキシ化合物等から得られるエステル化合物は、芳香族環を有することで耐熱性を高められる傾向にある。
成分(C)は、フェノール性水酸基を有するポリブタジエン変性されたポリアミド樹脂であれば、特に制限はないが、ジアミン由来の構造単位と、フェノール性水酸基を含有するジカルボン酸由来の構造単位と、フェノール性水酸基を含有しないジカルボン酸由来の構造単位と、両末端にカルボキシ基を有するポリブタジエン由来の構造単位とを有するものが好ましい。具体的には、下記一般式(i)で表される構造単位、下記一般式(ii)で表される構造単位、及び下記一般式(iii)で表される構造単位を有するものが好ましく挙げられる。
第一の熱硬化性樹脂組成物は、更にリン系硬化促進剤(D)を含有することが好ましい。リン系硬化促進剤(D)としては、リン原子を含有し、多官能エポキシ樹脂(A)と活性エステル硬化剤(B)との反応を促進させる硬化促進剤であれば特に制限なく使用することができる。
第一の熱硬化性樹脂組成物は、充填材(E)を含有していてもよい。充填材(E)としては、無機充填材、有機充填材等が挙げられる。充填材(E)を含有することで、第一の樹脂層をレーザー加工する際に樹脂の飛散をより低減できる。
第一の熱硬化性樹脂組成物は、シアネート樹脂(F)を含有していてもよい。シアネート樹脂(F)は、特に限定されず、例えば、ビスフェノールA型、ビスフェノールF型、ビスフェノールS型等のビスフェノール型シアネート樹脂、フェノールノボラック型、アルキルフェノールノボラック型等のノボラック型シアネート樹脂、ジシクロペンタジエン型シアネート樹脂、及びこれらが一部トリアジン化したプレポリマーなどが挙げられる。これらのシアネート樹脂(F)は単独で又は2種以上を組み合わせて使用してもよい。
第一の熱硬化性樹脂組成物は、上記各成分の他に、本発明の効果を阻害しない範囲で、必要に応じて他の熱硬化性樹脂、熱可塑性樹脂、並びに難燃剤、酸化防止剤、流動調整剤、硬化促進剤等の添加剤などを含有することができる。
ポリイミド化合物(G)は、N-置換マレイミド基を少なくとも2個有するマレイミド化合物(a1)由来の構造単位とジアミン化合物(a2)由来の構造単位とを有するものである。
装置:(ポンプ:L-6200型[株式会社日立ハイテクノロジーズ製])
(検出器:L-3300型RI[株式会社日立ハイテクノロジーズ製])
(カラムオーブン:L-655A-52[株式会社日立ハイテクノロジーズ製])
カラム:ガードカラム;TSK Guardcolumn HHR-L + カラム;TSK gel-G4000HHR+TSK gel-G2000HHR(すべて東ソー株式会社製、商品名)
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
流量:1.00mL/分
測定温度:40℃
本実施形態において、変性ポリブタジエン(H)は、化学変性されているポリブタジエンであれば、特に限定されない。変性ポリブタジエン(H)を用いると、得られる絶縁層において、無機充填材(J)と樹脂成分との分離、光沢ムラ等を低減できる。
無機充填材(J)としては、特に限定されず、例えば、シリカ、アルミナ、硫酸バリウム、タルク、クレー、雲母粉、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、酸化マグネシウム、窒化ホウ素、ホウ酸アルミニウム、チタン酸バリウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、チタン酸ビスマス、酸化チタン、ジルコン酸バリウム、ジルコン酸カルシウム等が挙げられる。得られる絶縁層をより低熱膨張化できる観点から、成分(J)は、シリカが好ましい。
第一の樹脂層は、本実施形態の第一の熱硬化性樹脂組成物を含むものである。第一の樹脂層を設けることにより、例えば、本実施形態の複合フィルムを用いて半導体装置を製造する場合において、タック性を向上させやすくなる。
第二の樹脂層は、本実施形態に係る半導体装置の製造において、本実施形態の熱硬化性樹脂組成物を含む第一の樹脂層の硬化物と、金属箔3との間に位置し、金属箔3との接着性を向上させることができる。第二の樹脂層は、半導体素子の能動面側に再配線を形成するときの絶縁層となり、スルーホール、ビアホール等の開口が設けられ、それらの中に導体が充填される又はそれらの内側に導体層が形成されるという役割も果たす。
工程(V):金属箔3’及び導体9上に配線パターン12を形成する(図4の(a))。
工程(VI):配線パターン12が設けられている以外の部分(金属箔3’)を除去する(図4の(b))。
工程(VII):配線パターン12及び複合フィルムの硬化物(第1の絶縁層)7上に、上記配線パターンにまで至る開口を有する第2の絶縁層を形成する。
工程(VIII):上記開口に、外部接続用端子を形成する。
i)熱硬化性樹脂フィルムの状態での加熱
ii)支持体と貼り合わせるときの加熱
iii)半導体素子の封止時の加熱
iv)半導体素子の封止後、支持体を除去する前の加熱
v)第2の絶縁層の形成時の加熱
vi)めっきによる配線形成後の加熱
Claims (6)
- 支持体と該支持体上に設けられた金属箔とを備える支持体付金属箔の前記金属箔上に貼り合わされた、熱硬化性樹脂組成物が含まれる熱硬化性樹脂フィルム上に、能動面を有する半導体素子を1つ以上、前記熱硬化性樹脂フィルムと前記半導体素子の前記能動面とが接するように配置する工程(I)と、
前記熱硬化性樹脂フィルム上に配置された前記半導体素子を半導体封止用部材で封止する工程(II)と、
前記工程(II)の後、前記支持体を除去して、前記金属箔及び前記熱硬化性樹脂フィルム若しくはその硬化物に、前記半導体素子の前記能動面にまで至る開口を設ける工程(III)と、
前記開口に導体を充填する又は前記開口の内側に導体層を形成する工程(IV)と、
を備える、半導体装置の製造方法。 - 前記熱硬化性樹脂フィルムが、熱硬化性樹脂組成物を含む第一の樹脂層と、第二の樹脂層とを含む、複合フィルムであり、
前記工程(I)において、前記第一の樹脂層上に前記半導体素子を配置する、請求項1に記載の半導体装置の製造方法。 - 前記第一の樹脂層が、官能エポキシ樹脂(A)、活性エステル硬化剤(B)、及びフェノール性水酸基含有ポリブタジエン変性ポリアミド樹脂(C)を含有し、
前記第二の樹脂層が、N-置換マレイミド基を少なくとも2個有するマレイミド化合物(a1)由来の構造単位とジアミン化合物(a2)由来の構造単位とを有するポリイミド化合物(G)、変性ポリブタジエン(H)、及び無機充填材(J)を含有する、請求項2に記載の半導体装置の製造方法。 - 前記工程(IV)の後、
前記金属箔及び前記導体上に配線パターンを形成する工程(V)と、
前記配線パターンが設けられている部分以外の金属箔を除去する工程(VI)と、
前記配線パターン及び前記熱硬化性樹脂フィルムの硬化物上に、前記配線パターンにまで至る第二の開口を有する第2の絶縁層を形成する工程(VII)と、
前記第二の開口に、外部接続用端子を形成する工程(VIII)と、
を更に備える、請求項1~3のいずれか一項に記載の半導体装置の製造方法。 - 前記熱硬化性樹脂フィルムの前記半導体素子と接する面の25℃におけるタック力が、5gf以上40gf以下である、請求項1~4のいずれか一項に記載の半導体装置の製造方法。
- 前記熱硬化性樹脂フィルムの硬化物の5GHzの誘電正接が0.005以下である、請求項1~5のいずれか一項に記載の半導体装置の製造方法。
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- 2017-12-06 KR KR1020197018960A patent/KR102479357B1/ko active IP Right Grant
- 2017-12-06 CN CN201780075387.9A patent/CN110036472A/zh active Pending
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TW201826413A (zh) | 2018-07-16 |
KR20190090838A (ko) | 2019-08-02 |
KR102479357B1 (ko) | 2022-12-19 |
JPWO2018105662A1 (ja) | 2019-10-24 |
US11049825B2 (en) | 2021-06-29 |
TWI756318B (zh) | 2022-03-01 |
EP3553816A1 (en) | 2019-10-16 |
EP3553816A4 (en) | 2020-05-06 |
US20200194391A1 (en) | 2020-06-18 |
WO2018105662A1 (ja) | 2018-06-14 |
CN110036472A (zh) | 2019-07-19 |
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