JP7134131B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7134131B2
JP7134131B2 JP2019084802A JP2019084802A JP7134131B2 JP 7134131 B2 JP7134131 B2 JP 7134131B2 JP 2019084802 A JP2019084802 A JP 2019084802A JP 2019084802 A JP2019084802 A JP 2019084802A JP 7134131 B2 JP7134131 B2 JP 7134131B2
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JP
Japan
Prior art keywords
resin
semiconductor device
semiconductor element
mold resin
semiconductor
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Active
Application number
JP2019084802A
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English (en)
Japanese (ja)
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JP2020181917A (ja
JP2020181917A5 (https=
Inventor
祥 小杉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2019084802A priority Critical patent/JP7134131B2/ja
Priority to US16/736,501 priority patent/US11164812B2/en
Priority to DE102020110616.5A priority patent/DE102020110616B4/de
Priority to CN202010316092.XA priority patent/CN111863742B/zh
Publication of JP2020181917A publication Critical patent/JP2020181917A/ja
Publication of JP2020181917A5 publication Critical patent/JP2020181917A5/ja
Application granted granted Critical
Publication of JP7134131B2 publication Critical patent/JP7134131B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2019084802A 2019-04-26 2019-04-26 半導体装置 Active JP7134131B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019084802A JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置
US16/736,501 US11164812B2 (en) 2019-04-26 2020-01-07 Semiconductor device
DE102020110616.5A DE102020110616B4 (de) 2019-04-26 2020-04-20 Halbleitervorrichtung
CN202010316092.XA CN111863742B (zh) 2019-04-26 2020-04-21 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019084802A JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2020181917A JP2020181917A (ja) 2020-11-05
JP2020181917A5 JP2020181917A5 (https=) 2021-07-26
JP7134131B2 true JP7134131B2 (ja) 2022-09-09

Family

ID=72840145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019084802A Active JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置

Country Status (4)

Country Link
US (1) US11164812B2 (https=)
JP (1) JP7134131B2 (https=)
CN (1) CN111863742B (https=)
DE (1) DE102020110616B4 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7649171B2 (ja) * 2021-03-17 2025-03-19 ローム株式会社 半導体装置
JP7594950B2 (ja) * 2021-03-17 2024-12-05 ローム株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005232313A (ja) 2004-02-19 2005-09-02 Mitsubishi Electric Corp 熱伝導性樹脂シートおよびこれを用いたパワーモジュール
US20140055173A1 (en) 2012-08-21 2014-02-27 Mitsubishi Electric Corporation Power module
WO2015104834A1 (ja) 2014-01-10 2015-07-16 三菱電機株式会社 電力半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536745A (ja) 1991-08-01 1993-02-12 Shinko Electric Ind Co Ltd 封止金型及び封止方法
JPH0595014A (ja) 1991-10-02 1993-04-16 Hitachi Ltd 封止体形成方法
JP3345241B2 (ja) * 1995-11-30 2002-11-18 三菱電機株式会社 半導体装置
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
JP3390661B2 (ja) * 1997-11-13 2003-03-24 三菱電機株式会社 パワーモジュール
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
JP3740116B2 (ja) 2002-11-11 2006-02-01 三菱電機株式会社 モールド樹脂封止型パワー半導体装置及びその製造方法
JP5272191B2 (ja) 2007-08-31 2013-08-28 三菱電機株式会社 半導体装置および半導体装置の製造方法
KR101204564B1 (ko) * 2011-09-30 2012-11-23 삼성전기주식회사 전력 모듈 패키지 및 그 제조 방법
JP6797002B2 (ja) * 2016-11-18 2020-12-09 三菱電機株式会社 半導体装置および半導体装置の製造方法
US11031355B2 (en) 2017-07-03 2021-06-08 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005232313A (ja) 2004-02-19 2005-09-02 Mitsubishi Electric Corp 熱伝導性樹脂シートおよびこれを用いたパワーモジュール
US20060188727A1 (en) 2004-02-19 2006-08-24 Mitsubishi Denki Kabushiki Kaisha Thermally conductive resin sheet and power module using the same
US20140055173A1 (en) 2012-08-21 2014-02-27 Mitsubishi Electric Corporation Power module
JP2014041852A (ja) 2012-08-21 2014-03-06 Mitsubishi Electric Corp パワーモジュール
CN103633077A (zh) 2012-08-21 2014-03-12 三菱电机株式会社 功率模块
WO2015104834A1 (ja) 2014-01-10 2015-07-16 三菱電機株式会社 電力半導体装置
US20160233151A1 (en) 2014-01-10 2016-08-11 Mitsubishi Electric Corporation Power semiconductor device

Also Published As

Publication number Publication date
CN111863742A (zh) 2020-10-30
JP2020181917A (ja) 2020-11-05
DE102020110616B4 (de) 2026-01-15
US11164812B2 (en) 2021-11-02
US20200343173A1 (en) 2020-10-29
CN111863742B (zh) 2024-06-07
DE102020110616A1 (de) 2020-10-29

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