CN111863742B - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN111863742B
CN111863742B CN202010316092.XA CN202010316092A CN111863742B CN 111863742 B CN111863742 B CN 111863742B CN 202010316092 A CN202010316092 A CN 202010316092A CN 111863742 B CN111863742 B CN 111863742B
Authority
CN
China
Prior art keywords
semiconductor device
semiconductor element
semiconductor
gate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010316092.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN111863742A (zh
Inventor
小杉祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN111863742A publication Critical patent/CN111863742A/zh
Application granted granted Critical
Publication of CN111863742B publication Critical patent/CN111863742B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN202010316092.XA 2019-04-26 2020-04-21 半导体装置 Active CN111863742B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019084802A JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置
JP2019-084802 2019-04-26

Publications (2)

Publication Number Publication Date
CN111863742A CN111863742A (zh) 2020-10-30
CN111863742B true CN111863742B (zh) 2024-06-07

Family

ID=72840145

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010316092.XA Active CN111863742B (zh) 2019-04-26 2020-04-21 半导体装置

Country Status (4)

Country Link
US (1) US11164812B2 (https=)
JP (1) JP7134131B2 (https=)
CN (1) CN111863742B (https=)
DE (1) DE102020110616B4 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7649171B2 (ja) * 2021-03-17 2025-03-19 ローム株式会社 半導体装置
JP7594950B2 (ja) * 2021-03-17 2024-12-05 ローム株式会社 半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10178030A (ja) * 1996-12-19 1998-06-30 Denso Corp 樹脂封止型半導体装置の製造方法
US5814878A (en) * 1995-11-30 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH11204724A (ja) * 1997-11-13 1999-07-30 Mitsubishi Electric Corp パワーモジュール
JP2009059923A (ja) * 2007-08-31 2009-03-19 Mitsubishi Electric Corp 半導体装置
CN103035584A (zh) * 2011-09-30 2013-04-10 三星电机株式会社 功率模块封装及制造该功率模块封装的方法
CN103633077A (zh) * 2012-08-21 2014-03-12 三菱电机株式会社 功率模块
CN105900234A (zh) * 2014-01-10 2016-08-24 三菱电机株式会社 电力半导体装置
JP2018082113A (ja) * 2016-11-18 2018-05-24 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536745A (ja) 1991-08-01 1993-02-12 Shinko Electric Ind Co Ltd 封止金型及び封止方法
JPH0595014A (ja) 1991-10-02 1993-04-16 Hitachi Ltd 封止体形成方法
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
JP3740116B2 (ja) 2002-11-11 2006-02-01 三菱電機株式会社 モールド樹脂封止型パワー半導体装置及びその製造方法
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
US11031355B2 (en) 2017-07-03 2021-06-08 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814878A (en) * 1995-11-30 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH10178030A (ja) * 1996-12-19 1998-06-30 Denso Corp 樹脂封止型半導体装置の製造方法
JPH11204724A (ja) * 1997-11-13 1999-07-30 Mitsubishi Electric Corp パワーモジュール
JP2009059923A (ja) * 2007-08-31 2009-03-19 Mitsubishi Electric Corp 半導体装置
CN103035584A (zh) * 2011-09-30 2013-04-10 三星电机株式会社 功率模块封装及制造该功率模块封装的方法
CN103633077A (zh) * 2012-08-21 2014-03-12 三菱电机株式会社 功率模块
CN105900234A (zh) * 2014-01-10 2016-08-24 三菱电机株式会社 电力半导体装置
JP2018082113A (ja) * 2016-11-18 2018-05-24 三菱電機株式会社 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
CN111863742A (zh) 2020-10-30
JP2020181917A (ja) 2020-11-05
DE102020110616B4 (de) 2026-01-15
US11164812B2 (en) 2021-11-02
US20200343173A1 (en) 2020-10-29
JP7134131B2 (ja) 2022-09-09
DE102020110616A1 (de) 2020-10-29

Similar Documents

Publication Publication Date Title
US7714455B2 (en) Semiconductor packages and methods of fabricating the same
US6369455B1 (en) Externally-embedded heat-dissipating device for ball grid array integrated circuit package
CN101174616B (zh) 电路装置
US8624408B2 (en) Circuit device and method of manufacturing the same
US7190067B2 (en) Semiconductor package with exposed heat sink and the heat sink thereof
JP4146785B2 (ja) 電力用半導体装置
CN101253627A (zh) 电路装置及其制造方法
CN103165587A (zh) 半导体封装
JP2008263210A (ja) 電力用半導体装置
US7034385B2 (en) Topless semiconductor package
CN111863742B (zh) 半导体装置
CN111584441A (zh) 具有改善的散热的电子模块及其制造
JP5341339B2 (ja) 回路装置
CN217507316U (zh) 芯片封装结构
JP5308108B2 (ja) 回路装置の製造方法
JP2017092250A (ja) 半導体装置及びその製造方法
CN207124188U (zh) 散热件及具有散热件的芯片封装件
US8614397B2 (en) Circuit device
JP2008112928A (ja) 回路装置の製造方法
KR20240103056A (ko) 전자 컴포넌트 및 전자 컴포넌트를 생성하기 위한 방법
CN202839586U (zh) 一种采用弹性装置的无外引脚扁平半导体封装结构
US20230005846A1 (en) Semiconductor device and a method of manufacture
KR101474067B1 (ko) 열전도 모듈
WO2013061603A1 (ja) 回路装置の製造方法
TWI253731B (en) Semiconductor package

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
TG01 Patent term adjustment
TG01 Patent term adjustment