CN111584441A - 具有改善的散热的电子模块及其制造 - Google Patents
具有改善的散热的电子模块及其制造 Download PDFInfo
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- CN111584441A CN111584441A CN202010100686.7A CN202010100686A CN111584441A CN 111584441 A CN111584441 A CN 111584441A CN 202010100686 A CN202010100686 A CN 202010100686A CN 111584441 A CN111584441 A CN 111584441A
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- insulating layer
- electronic module
- main face
- die pad
- heat sink
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Abstract
本发明公开了电子模块(10),其包括:半导体封装(1),包括管芯焊盘(1.1)、半导体管芯(1.2)和包封体(1.3),其中,所述包封体(1.3)包括第一主面和与所述第一主面相对的第二主面,所述管芯焊盘(1.1)包括第一主面和与所述第一主面相对的第二主面,并且所述半导体管芯(1.2)设置在所述管芯焊盘(1.1)的所述第二主面上;绝缘层(2),设置在所述包封体(1.3)的第一主面的至少一部分上和所述管芯焊盘(1.1)的第一主面上,其中,所述绝缘层(2)是电绝缘且导热的;以及散热器(3),设置在所述绝缘层(2)上或所述绝缘层(2)中。
Description
技术领域
本公开涉及电子模块、电子设备、以及用于制造电子模块的方法。
背景技术
在操作期间,包括半导体管芯的电子模块可能产生热量,该热量可能必须通过一个或多个指定的热路径消散。可以将热路径指向电子模块的顶侧,其中可以将散热装置(例如,散热器)布置在电子模块的顶侧上。可能期望减小半导体管芯与散热装置之间的热阻,以便提高电子模块的散热能力。
发明内容
本公开的第一方面涉及一种电子模块,该电子模块包括:半导体封装,半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;绝缘层,其设置在包封体的第一主面的至少一部分上和管芯焊盘的第一主面上,其中,绝缘层是电绝缘且导热的;以及散热器,其设置在绝缘层上或绝缘层中,使得散热器的主面暴露于外部。
本公开的第二方面涉及一种用于制造电子模块的方法,该方法包括:提供包括管芯焊盘、半导体管芯和包封体的半导体封装,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;向包封体的第一主面上和管芯焊盘的第一主面上施加绝缘层和散热器,使得散热器设置于绝缘层上或绝缘层中,其中,绝缘层是电绝缘且导热的。
本公开的第三方面涉及一种电子设备,包括:半导体封装,该半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;绝缘层,其设置在包封体的第一主面上和管芯焊盘的第一主面上,其中,绝缘层是电绝缘且导热的;第一散热器,其设置在绝缘层上或绝缘层;以及第二散热器,其设置在绝缘层和第一散热器上。
附图说明
包括附图以提供对实施例的进一步理解,并且附图被并入本说明书并构成本说明书的一部分。附图示出了实施例,并且与说明书一起用于解释实施例的原理。其他实施例和实施例的许多预期优点将易于理解,因为通过参考以下详细描述,它们将变得更好理解。
附图的要素不必相对于彼此成比例。相似的附图标记表示对应的相似部分。
图1包括图1A和图1B,并且示出了根据第一方面的电子模块的示例的示意性截面侧视图表示。
图2示出了电子模块的另一示例的示意性截面侧视图表示,该电子模块包括三个半导体管芯并安装在PCB上,其中,外部散热器施加到绝缘层和散热器上。
图3示出了与图2的示例相似的电子模块的另一示例的示意性截面侧视图表示,其中,三个半导体管芯布置在同一个平面中。
图4包括图4A和图4B,并且示出了包括三个平行的外部引线的电子模块的另一实施例的示意性截面侧视图表示(A)和俯视图表示(B)。
图5示出了电子模块的另一示例的示意性截面侧视图表示,其中,散热器包括冷却通道,该冷却通道具有用于冷却介质的入口开口和出口开口。
图6包括图6A和图6B以及电子模块的其他示例的示意性截面侧视图表示,其中,散热器包括基体和施加到基体的层。
图7示出了根据第二方面的制造电子模块的方法的示例的流程图。
图8包括图8A至图8F并且示出了根据制造电子模块的方法的另一示例的在制造的各个阶段中的电子模块的截面侧视图表示。
具体实施方式
在下面的详细描述中,参考形成其一部分的附图,并且在附图中通过图示的方式示出了可以实践本发明的特定实施例。在这方面,参照正在描述的图的取向使用诸如“顶部”、“底部”、“正面”、“背面”、“前导”、“后继”等方向术语。因为实施例的部件可以定位成许多不同的取向,所以方向术语用于说明的目的,而绝不是限制性的。应当理解,在不脱离本发明的范围的情况下,可以利用其他实施例,并且可以进行结构或逻辑上的改变。因此,以下详细描述不应被视为限制性意义,并且本发明的范围由所附权利要求限定。
应当理解,除非另外特别指出,否则本文所述的各种示例性实施方式的特征可以彼此组合。
如在本说明书中所采用的,术语“接合”、“附接”、“连接”、“耦合”和/或“电连接/电耦合”并不意味着元件或层必须直接接触在一起;可以在“接合”、“附接”、“连接”、“耦合”和/或“电连接/电耦合”的元件之间分别设置中间元件或层。然而,根据本公开,上述术语还可以可选地具有特定含义,即元件或层直接接触在一起,即在“接合”、“附接”、“连接”、“耦合”和/或“电连接/电耦合”的元件之间不提供中间元件或层。
此外,关于形成或位于表面“之上”的部分、元件或材料层使用的词语“在...之上”在本文中可以用来表示部分、元件或材料层被定位(例如放置、形成、沉积等)为“间接”在隐含表面上,并且在隐含表面与所述部分、元件或材料层之间布置一个或多个附加的部分、元件或层。然而,关于形成或位于表面“之上”的部分、元件或材料层所使用的词语“在...之上”也可以任选地具有这样的特定含义,即该部分、元件或材料层被定位(例如放置、形成、沉积等)为“直接在”隐含表面“上”,例如与隐含表面直接接触。
下面描述包含半导体管芯的器件或半导体封装。半导体管芯可以是不同类型的,可以通过不同技术来制造,并且可以包括例如集成电、电光或机电电路和/或无源器件。器件可以是功率器件,并且封装可以是功率封装。半导体管芯可以例如被设计为逻辑集成电路、模拟集成电路、混合信号集成电路、功率集成电路、存储电路或集成的无源器件。它们可以包括控制电路、微处理器或微机电部件。此外,它们可以被配置为功率半导体管芯,例如功率MOSFET(金属氧化物半导体场效应晶体管)、IGBT(绝缘栅双极晶体管)、JFET(结栅场效应晶体管)、功率双极晶体管或功率二极管。特别地,可以涉及具有垂直结构的半导体管芯,也就是说,可以以使得电流可以在垂直于半导体管芯的主面的方向上流动的方式来制造半导体管芯。具有垂直结构的半导体管芯尤其可以在其两个主面上,即在其顶侧和底侧上具有接触元件。特别地,功率半导体管芯可以具有垂直结构。举例来说,功率MOSFET的源电极和栅电极可以位于一个主面上,而功率MOSFET的漏电极布置在另一主面上。此外,以下描述的电子模块可以包括集成电路以控制其他半导体管芯的集成电路,例如功率半导体管芯的集成电路。可以基于特定的半导体材料(例如,Si、SiC、SiGe、GaAs、GaN、AlGaAs)来制造半导体管芯,但是也可以基于任何其他半导体材料来制造半导体管芯,并且此外,半导体管芯可以包含非半导体的无机和/或有机材料,例如绝缘体、塑料或金属。
下文描述的电子模块的各种示例可以包括外部接触元件。外部接触元件可以代表半导体封装的外部端子。它们可以从封装外部触及,并且因此可以允许从封装外部与(多个)半导体管芯进行电接触。此外,外部接触元件可以是导热的,并且可以用作散热器以消散由半导体管芯产生的至少部分热量。外部接触元件可以是引线框架的部分,特别是Cu引线框架的部分。
电子模块的半导体封装包括包封体。包封体可以是电介质材料,并且可以由任何适当的硬质塑料、热塑料或热固性材料或层合材料(预浸材料)制成,并且可以通过模制来制成。包封体可以包含填充材料。在其沉积之后,包封体可以仅部分硬化,并且可以在施加能量(例如热、UV光等)以形成包封体之后完全硬化。可以采用各种技术来施加包封体,例如传递模制、压缩模制、注入模制、粉末模制、液体模制、分配、层合或圆顶封装。
详细描述
图1包括图1A和图1B并且在示意性侧视图表示(A)和俯视图表示(B)中示出了根据第一方面的电子模块。图1的电子模块10包括:半导体封装1,该半导体封装1包括管芯焊盘1.1、半导体管芯1.2和包封体1.3,其中包封体1.3包括第一主面和与第一主面相对的第二主面,管芯焊盘1.1包括第一主面和与第一主面相对的第二主面,并且半导体管芯1.2设置在管芯焊盘1.1的第二主面上;绝缘层2,其设置在包封体1.3的第一主面上和管芯焊盘1.1的第一主面上,其中绝缘层2是电绝缘且导热的;以及散热器3,其设置在绝缘层2上或绝缘层2中,使得散热器3的主面暴露于外部。
图1的电子模块10还可以包括外部引线,为清楚起见未示出该外部引线。外部引线可以具有不同的形式,这将在后面的其他示例中示出。
根据第一方面的电子模块的示例,绝缘层2包括树脂基质材料、热固性材料、环氧树脂、硅树脂、热粘合剂、热塑料或热界面材料(TIM)中的一种或多种。另外,任何这样种类的主体材料可以填充有填充材料,该填充材料被配置为改善主体材料的热导率。填充材料可以包括SiO2、Al2O3、AlN、Si3N4、BN或金刚石中的一种或多种的颗粒。绝缘层可以包括>1W/mK的热导率,更具体地>2W/mK的热导率,更具体地>3W/mK的热导率。
根据第一方面的电子模块的示例,散热器3仅由一种均质材料形成,特别是由例如Cu或Al的金属或热界面材料(TIM)形成。散热器3还可以由导电粘合剂、铟焊料、铜膏、相变材料、软Al、纯Al、CNC材料、磁性铁材料、Sn/Ag层、或任何适当材料的多孔层形成。另外,在隔离方面非常重要的情形下,陶瓷也可以用作散热器3,以使得绝缘层2和散热器3的形式的双重隔离似乎是可取的。散热器3还可以在其外表面上包括针状鳍状物或其他冷却结构。
此外,散热器3也可以由包括两种或更多种材料的复合物形成,而不是一种均质材料。特别地,散热器3可以包括基体和设置在基体上的附加层。基体或附加层可以包括以上对于散热器所建议的材料中的一种或多种。其具体示例将在后面示出并解释。在陶瓷的情况下,也可以采用不同的陶瓷层,或者可以将陶瓷层与具有另一种材料的层一起使用。
根据第一方面的电子模块的示例,散热器3包括例如Cu或Al的金属、陶瓷或热界面材料中的一种或多种。此外,散热器3可以形成为板状并且可以具有方形或矩形形状。板的厚度可以在100μm至5mm的范围内。散热器3也可以包括箔,在这种情况下,厚度可以在5μm至100μm的范围内。
根据第一方面的电子模块的示例,管芯焊盘1.1的第一主面的至少一部分与包封体1.3的第一主面共面。根据其另一示例,管芯焊盘1.1的整个第一主面与包封体1.3的第一主面共面。包封体1.3的第一主面也可能包含与管芯焊盘1.1的第一主面不共面的凹槽或其他特定的表面特性。
根据第一方面的电子模块的示例,散热器3嵌入在绝缘层2中,使得散热器3的外表面稍微位于绝缘层2的外表面的上方。
根据第一方面的电子模块的示例,绝缘层2包括>1W/mK的热导率,更具体地>2W/mK的热导率,更具体地>3W/mK的热导率。
根据第一方面的电子模块的示例,管芯焊盘1.1是引线框架的部分。可以提供一个或多个其他管芯焊盘和一个或多个其他半导体管芯,其他半导体管芯中的每个半导体管芯设置在一个或多个其他管芯焊盘中的一个上。
图2示出了电子模块的另一示例的示意性截面侧视图表示。图2的电子模块20包括半导体封装21,该半导体封装21包括引线框架21.1、第一半导体管芯21.2、第二半导体管芯21.3和第三半导体管芯21.4。第一至第三半导体管芯21.2至21.4设置在引线框21.1的不同部分上。第一半导体管芯21.2可以是例如半导体晶体管管芯,例如IGBT管芯。第二半导体管芯21.3可以是例如与第一半导体管芯21.2并联连接的半导体二极管管芯。例如,第三半导体管芯21.4可以是控制器管芯。
半导体封装21还包括包封体21.5,其中,包封体21.5包括第一上主面和与第一上主面相对的第二下主面。第一半导体管芯21.2和第二半导体管芯21.3设置在引线框架21.1的第一部分上,该第一部分暴露于封装的外部并且与包封体21.5的第一上主面至少部分地共面。第三半导体管芯21.4设置在引线框架的另一部分上,该另一部分未暴露于外部并且完全嵌入包封体21.5内。
半导体封装21还包括绝缘层22,该绝缘层22设置在包封体21.5的第一主面上和管芯焊盘21.1的第一主面上,其中,绝缘层22是电绝缘且导热的,并且散热器23可以设置在绝缘层22上或绝缘层22中。绝缘层22和散热器23可以具有与图1的示例的绝缘层22和散热器23相同的特性和特征。在图2的示例中,散热器23可以包括箔。
电子模块20可以被配置为双列直插式(DIP)模块,其通常包括矩形壳体和布置在相对侧上的两排平行的电连接引脚。在客户侧上,电子模块20可以通过通孔的方式安装到印刷电路板(PCB)24,并且外部散热器25可以布置在绝缘层22和散热器23的顶部。
图3示出了电子模块的另一示例的示意性截面侧视图表示。图3的电子模块30类似于图2的电子模块20,因此将不再描述电子模块30的不同部件。电子模块30包括半导体封装31,半导体封装31包括引线框架31.1、第一半导体管芯31.2、第二半导体管芯31.3和第三半导体管芯31.4。第一至第三半导体管芯31.2至31.4设置在引线框架31.1的不同部分上,并且它们在功能上可以类似于图2的示例的第一至第三半导体管芯21.2至21.4。
尽管在图2和图3中已经示出并描述了在特定类型的半导体封装中采用本公开的示例,但是应当强调,本公开可以应用于几乎所有类型的半导体封装,包括所有类型的TO(晶体管轮廓)封装、BGA(球栅阵列)封装、无引线封装、SMD(表面安装器件)封装等。还应该提到的是,例如图1所示的结构也可以在双侧构建,即在半导体封装的另一侧上施加具有嵌入式散热器的绝缘层。
半导体封装31还包括包封体31.5,其中,包封体31.5包括第一上主面和与第一上主面相对的第二下主面。与图2的半导体模块20的不同之处在于,第一至第三半导体管芯31.2至31.4设置在引线框架31.1的全部暴露于封装31的外部并且至少部分与包封体31.5的第一上主面共面的部分上。
半导体封装31还包括设置在包封体31.5的第一主面上和管芯焊盘31.2的第一主面上的绝缘层32,其中,绝缘层32是电绝缘且导热的,并且散热器33设置在绝缘层32上或绝缘层32中。与图2的电子模块20的另一不同之处在于,绝缘层32和散热器33形成得更厚。在客户侧上,电子模块30可以通过通孔方式安装到印刷电路板(PCB)34,并且外部散热器35可以布置在绝缘层32和散热器33的顶部上。在图3的示例中,散热器33可以包括板,特别是Cu板。
图4包括图4A和图4B并且示出了作为晶体管轮廓(TO)封装的示例的电子模块的另一示例的俯视图表示(A)和截面侧视图表示(B)。图4的电子IC模块40包括半导体封装41,该半导体封装41包括其上设置有半导体管芯的管芯焊盘41.1(未示出)。半导体封装41还包括三个平行的外部引线41.2、41.3和41.4。外部引线41.2至41.4和管芯焊盘41.1可以是引线框架的部分。半导体封装41还包括包封体41.5,其形状和特性可以与先前描述的示例的包封体相同或相似。
电子模块40还包括绝缘层42和嵌入在绝缘层42中的散热器43。绝缘层42和散热器43两者可以具有与先前描述的示例的绝缘层和散热器类似或相同的形状和特性。
图5示出了电子模块的另一示例的示意性截面侧视图表示。电子模块50包括半导体封装51,该半导体封装51包括支撑半导体管芯(未示出)的管芯焊盘51.1。半导体封装51还包括包封体51.3,其中管芯焊盘51.1被嵌入在包封体51.3中。半导体封装51、管芯焊盘51.1和包封体51.3可以具有与在先前示例中示出并描述的半导体封装、管芯焊盘和包封体相同的形状和特性。
电子模块50还包括绝缘层52和嵌入绝缘层52内的散热器53。散热器53包括冷却通道53.1,该冷却通道53.1具有用于冷却介质流过冷却通道53.1的入口开口和出口开口。冷却介质可以是液体或气体,并且可以例如是空气或水。在入口开口和出口开口之间可以有一个以上的通道,并且在一个或多个通道的端部处也可以有一个以上的入口开口和一个以上的出口开口。散热器53可以被配置为使得另外可以将外部散热器设置到绝缘层53的上表面上。这样的外部散热器将必须被配置为使得其包含将充当用于冷却进入入口开口和流出出口开口的介质的通道的适当通孔。
图6包括图6A和图6B,并且示出了电子模块的两个不同示例,其中散热器包括基体和施加到基体的附加层。
图6A示出了包括半导体封装61的电子模块60_1,半导体封装61包括支撑半导体管芯(未示出)的管芯焊盘61.1。半导体封装61还包括包封体61.3,其中管芯焊盘61.1被嵌入在包封体61.3中。半导体封装61、管芯焊盘61.1和包封体61.3可以具有与在先前示例中示出并描述的半导体封装、管芯焊盘和包封体相同的形状和特性。
电子模块60_1还包括绝缘层62和嵌入绝缘层62内的散热器63。散热器63包括基体63.1和施加到基体63.1的上表面的附加层63.2。基体63.1的材料可以是以上针对前述的散热器所建议的材料中的任何一种。附加层63.2的材料可以例如是任何种类的热界面材料(TIM)。特别地,可以选择附加层63.2的材料,以改善与要向其施加的外部散热器的热转移。可以制造电子模块60_1,使得在绝缘层62的模制之前将附加层63.2施加到基体63.1上。
图6B示出了电子模块60_2,其类似于图6A的电子模块60_1,因此将相同的附图标记用于部件。唯一的区别是,只有基体63.1嵌入绝缘层62中,而附加层63.2位于绝缘层62上方。电子模块60_2可以制造为使得附加层63.2在绝缘层62的模制之后施加到基体63.1。
图7示出了根据第二方面的制造电子模块的方法的示例的流程图。
根据图7,方法70包括:提供半导体封装,半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊的第二主面上(71);向包封体的第一主面上和管芯焊盘的第一主面上施加绝缘层和散热器,使得散热器设置在绝缘层上或绝缘层中,其中,绝缘层是电绝缘且导热的(72)。
根据图7的方法70的示例,绝缘层和散热器的施加包括模制,特别是压缩模制。更具体地,绝缘层的材料可以以液体形式分配到包封体和管芯焊盘的上表面上,并且然后可以将散热器放置到绝缘层的所分配的液体材料上。之后,可以将组件放置在压缩模制装置中,并且可以将模制装置的上模制工具向下压在绝缘层和散热器的液体材料上。在到达上模制工具的端部位置之后,液态材料可以被固化和硬化。在绝缘层硬化之后,可以将组件从模制装置中取出。整个过程将在下面更详细地描述。
图8包括图8A至图8F并且示出了根据制造电子模块的方法的另一示例的在制造的各个阶段中的电子模块的截面侧视图表示。
图8A示出了半导体封装81,其包括管芯焊盘81.1、设置在管芯焊盘81.1上的半导体管芯81.2、以及包封体,其中嵌入了管芯焊盘81.1和半导体管芯81.2。应当注意,不仅可以提供并处理一个半导体封装,而且替代地可以提供并处理多个半导体封装。
图8B示出了通过分配器82.2分配液体材料82.1。液体材料将被制造到绝缘层,并且原则上可以从上面建议的材料中的任何一种中选择出来。在压缩模制的情况下,例如,可以使用可以在模制后被固化和硬化的环氧树脂。环氧树脂可以包含填充材料,尤其是微粒,以增加要制造的绝缘层的导热性。上面已经建议了颗粒的适当材料。
图8C示出了具有分配的液体材料82.1和放置在分配的液体材料上的散热器83的半导体封装81。散热器83例如可以是一块铜,但是也可以使用上面建议的用于散热器的任何其他材料。
图8D示出了放置在压缩模制装置中的组件。模制装置包括上模制工具84和下模制工具(未示出)。将组件放置到下模制工具上。上模制工具84包括凹陷部分,该凹陷部分的形状和轮廓对应于要制造的绝缘层和散热器的形状和轮廓。可以施加例如1毫巴的真空。上模制工具84向下移动(参见箭头),直到包封体达到端部压力为止。在端部位置,相对于腔的体积、模制的体积以及散热器的体积,上模制工具84的凹陷部分完全被液体材料和散热器填充。
图8E示出了到达上模制工具84的端部位置之后的情形。其后,热量被施加到绝缘层82,使得绝缘层82可以被固化。
图8F示出了在绝缘层82固化并且将产品从模制装置中取出之后的最终产品。图8所示的电子模块对应于图1所示的电子模块。
示例
在下文中,将通过示例的方式描述电子模块以及用于制造电子模块的方法。
示例1是一种电子模块,其包括:半导体封装,该半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;绝缘层,其设置在包封体的第一主面的至少一部分上和管芯焊盘的第一主面上,其中绝缘层是电绝缘且导热的;以及散热器,其设置在绝缘层上或绝缘层中,其中散热器的主面暴露于外部。
示例2是根据示例1的电子模块,其中,绝缘层包括树脂基质材料、热固性材料、环氧树脂、硅树脂、热粘合剂、热塑料或热界面材料(TIM)中的一种或多种。
示例3是根据示例1或2的电子模块,其中,绝缘层包括填充有填充材料的树脂基质材料或主体材料,该填充材料被配置为改善主体材料的热导率。
示例4是根据示例3的电子模块,其中,填充材料包括SiO、AlO、AlN或BN中的一种或多种的颗粒。
示例5是根据前述示例中任一项的电子模块,其中,散热器包括金属、陶瓷或热界面材料板中的一种或多种。
示例6是根据前述示例中任一项的电子模块,其中,散热器形成为板状。
示例7是根据示例6的电子模块,其中,板状散热器的厚度在100μm至5mm的范围内。
示例8是根据示例1至5中任一项的电子模块,其中,散热器由箔形成。
示例9是根据示例8的电子模块,其中,箔的厚度在5μm至100μm的范围内。
示例10是根据前述示例中任一项的电子模块,其中,散热器仅由一种均质材料形成。
示例11是根据示例1至7中任一项的电子模块,其中,散热器由包括两种或更多种材料的复合物形成。
示例12是根据示例11的电子模块,其中,散热器包括基体和设置在基体上的层。
示例13是根据前述示例中任一项的电子模块,其中,管芯焊盘是引线框架的部分。
示例14是根据前述示例中的任一个的电子模块,包括一个或多个其他管芯焊盘和一个或多个其他半导体管芯,一个或多个其他半导体管芯中的每个半导体管芯设置在一个或多个其他管芯焊盘中的一个上。
示例15是电子模块的示例,电子模块包括:半导体封装,该半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;绝缘层,其设置在包封体的第一主面上和管芯焊盘的第一主面上,其中,绝缘层是电绝缘且导热的;第一散热器,其设置在绝缘层上或绝缘层中;以及第二散热器,其设置在绝缘层和第一散热器上。
示例16是用于制造电子模块的方法的示例,该方法包括:提供半导体封装,该半导体封装包括管芯焊盘、半导体管芯和包封体,其中,包封体包括第一主面和与第一主面相对的第二主面,管芯焊盘包括第一主面和与第一主面相对的第二主面,并且半导体管芯设置在管芯焊盘的第二主面上;向包封体的第一主面上和管芯焊盘的第一主面上施加绝缘层和散热器,使得散热器设置于绝缘层上或绝缘层中,其中,绝缘层是电绝缘且导热的。
示例17是根据示例16的方法,其中,施加绝缘层和散热器包括模制。
示例18是根据实施例17的方法,还包括以如下方式施加绝缘层和散热器:将散热器嵌入在绝缘层中,使得散热器的外表面稍微设置于散热器的外表面上方。
示例19是根据示例16至18中任一项的方法,其中,并行制造两个或更多个电子模块。
另外,虽然可能已经关于几个实施方式中的仅一个公开了本发明的实施例的特定特征或方面,但是这种特征或方面可以与其他实施方式的一个或多个其他特征或方面组合,因为其对于任何给定的或特定的应用可能是期望的和有利的。此外,在具体实施方式或权利要求书中使用术语“包括”、“具有”、“带有”或其其他变体的程度上,这些术语旨在以类似于术语“包括”的方式表示包括。此外,应该理解,本发明的实施例可以以分立电路、部分集成电路或完全集成电路或编程装置来实施。而且,术语“示例性”仅意味着示例,而不是最佳或最优的。还应当理解,为了简单和易于理解的目的,以相对于彼此的特定尺寸示出了本文中所描绘的特征和/或元件,并且实际尺寸可能与本文中所示出的实质上不同。
尽管本文已经图示并描述了特定实施例,但是本领域普通技术人员将理解,在不脱离本发明的范围的情况下,可以将各种替代和/或等效实施方式替换为所示出和描述的特定实施例。本申请旨在覆盖本文讨论的具体实施例的任何改编或变型。因此,旨在使本发明仅由权利要求及其等同物限制。
Claims (19)
1.一种电子模块(10),包括:
-半导体封装(1),包括管芯焊盘(1.1)、半导体管芯(1.2)和包封体(1.3),其中,所述包封体(1.3)包括第一主面和与所述第一主面相对的第二主面,所述管芯焊盘(1.1)包括第一主面和与所述第一主面相对的第二主面,并且所述半导体管芯(1.2)设置在所述管芯焊盘(1.1)的所述第二主面上;
-绝缘层(2),设置在所述包封体(1.3)的第一主面的至少一部分上和所述管芯焊盘(1.1)的第一主面上,其中,所述绝缘层(2)是电绝缘且导热的;以及
-散热器(3),设置在所述绝缘层(2)上或所述绝缘层(2)中,其中,所述散热器(3)的主面暴露于外部。
2.根据权利要求1所述的电子模块(10),其中
所述绝缘层(2)包括树脂基质材料、热固性材料、环氧树脂、硅树脂、热粘合剂、热塑料或热界面材料(TIM)中的一种或多种。
3.根据权利要求1或2所述的电子模块(10),其中
所述绝缘层(2)包括填充有填充材料的树脂基质材料或主体材料,所述填充材料被配置为提高所述主体材料的热导率。
4.根据权利要求3所述的电子模块(10),其中
所述填充材料包括SiO、AlO、AlN或BN中的一种或多种的颗粒。
5.根据前述权利要求中的任一项所述的电子模块(10),其中
所述散热器(3)包括金属、陶瓷或热界面材料板中的一种或多种。
6.根据前述权利要求中的任一项所述的电子模块(10),其中
所述散热器(3)形成为板状。
7.根据权利要求6所述的电子模块(10),其中
所述板状散热器(3)的厚度在从100μm至5mm的范围内。
8.根据权利要求1至5中的任一项所述的电子模块(10),其中
所述散热器(3)由箔形成。
9.根据权利要求8所述的电子模块(10),其中
所述箔的厚度在从5μm至100μm的范围内。
10.根据前述权利要求中任一项所述的电子模块(10),其中
所述散热器(3)仅由一种均质材料形成。
11.根据权利要求1至7中任一项所述的电子模块(10),其中
所述散热器(3)由包括两种或更多种材料的复合物形成。
12.根据权利要求11所述的电子模块(10),其中
所述散热器(3)包括基体和设置在所述基体上的层。
13.根据前述权利要求中任一项所述的电子模块(10),其中
所述管芯焊盘(1.1)是引线框架的部分。
14.根据前述权利要求中任一项所述的电子模块(10),包括
一个或多个其他管芯焊盘和一个或多个其他半导体管芯,所述一个或多个其他半导体管芯中的每个半导体管芯设置在所述一个或多个其他管芯焊盘中的一个上。
15.一种电子设备(20;30),包括:
-半导体封装(21;31),包括管芯焊盘(21.1;31.1)、半导体管芯(21.2;31.2)和包封体(21.5;31.5),其中
所述包封体(21.5;31.5)包括第一主面和与所述第一主面相对的第二主面,所述管芯焊盘(21.1;31.1)包括第一主面和与所述第一主面相对的第二主面;并且所述半导体管芯(1.2)设置在所述管芯焊盘(1.1)的所述第二主面上;
-绝缘层(22;32),设置在所述包封体(21.5;31.5)的第一主面上和所述管芯焊盘(21.1;31.1)的第一主面上,其中,所述绝缘层(22;32)是电绝缘且导热的;
-第一散热器(23;33),设置在所述绝缘层(22;32)上或所述绝缘层(22;32)中;以及
-第二散热器(25;35),设置在所述绝缘层(22;32)和所述第一散热器(23;33)上。
16.一种用于制造电子模块的方法,所述方法包括:
-提供半导体封装,所述半导体封装包括管芯焊盘、半导体管芯和包封体,其中
所述包封体包括第一主面和与所述第一主面相对的第二主面,所述管芯焊盘包括第一主面和与所述第一主面相对的第二主面,并且所述半导体管芯设置在所述管芯焊盘的所述第二主面上;
-向所述包封体的第一主面上和所述管芯焊盘的第一主面上施加绝缘层和散热器,使得所述散热器设置在所述绝缘层上或所述绝缘层中,其中,所述绝缘层是电绝缘且导热的。
17.根据权利要求16所述的方法,其中
施加所述绝缘层和所述散热器包括模制。
18.根据权利要求17所述的方法,还包括
以将所述散热器嵌入所述绝缘层中的方式施加所述绝缘层和所述散热器,使得所述散热器的外表面稍微设置于所述绝缘层的外表面上方。
19.根据权利要求16至18中任一项所述的方法,其中
并行制造两个或更多个电子模块。
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