CN101253627A - 电路装置及其制造方法 - Google Patents

电路装置及其制造方法 Download PDF

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CN101253627A
CN101253627A CNA2006800318272A CN200680031827A CN101253627A CN 101253627 A CN101253627 A CN 101253627A CN A2006800318272 A CNA2006800318272 A CN A2006800318272A CN 200680031827 A CN200680031827 A CN 200680031827A CN 101253627 A CN101253627 A CN 101253627A
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circuit
lead
circuit substrate
wire
conductive pattern
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CN101253627B (zh
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高草木贞道
坂本则明
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Sanyo Electric Co Ltd
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Abstract

本发明的目的为把内置有发热量大的功率元件的电路装置的结构简单化。本发明的电路装置具备：表面被绝缘层(12)覆盖的电路基板(11)、在绝缘层(12)的表面形成的导电图形(13)、与导电图形(13)电连接的电路元件、与由导电图形(13)构成的焊盘(13A)连接的引线(25)。在由引线(25A)的一部分构成的岛部(18)的上面固着有功率元件(15B)。因此，岛部(18)作为散热器有助于散热。

Description

电路装置及其制造方法
技术领域
本发明涉及电路装置及其制造方法，特别是涉及在电路基板的表面安装有功率类半导体元件的电路装置及其制造方法。
背景技术
参照图9说明现有的混合集成电路装置100的结构(例如参照日本特开平5-102645)。在矩形基板101的表面经由绝缘层102形成有导电图形103。电路元件固着在导电图形103的希望的部位而形成规定的电路。在此，作为电路元件是把半导体元件105A和芯片元件105B与导电图形103连接。引线104与基板101周边部形成的由导电图形103构成的焊盘109连接，作为外部端子起作用。密封树脂108具有把基板101表面形成的电路密封的功能。
半导体元件105A例如是有1安培以上大电流通过的功率类元件，发热量非常大。因此，半导体元件105A被安装在安装于导电图形103的散热器110的上部。散热器110例如由长×宽×厚度＝10mm×10mm×1mm左右的铜等金属片构成。通过采用散热器110而能把半导体元件105A所产生的热积极地向外部放出。
但上述混合集成电路装置100由于采用散热器110而有整体结构变复杂和成本变高的问题。
当把有大电流通过的半导体元件105A配置在导电图形103上，为了向半导体元件105A供给电流就需要在电路基板101上形成宽度宽的导电图形103。具体说就是，由于导电图形103例如被形成为薄到50μm左右，所以为了增大导电图形103的电流容量就需要把其宽度扩展到数mm左右。这有招致装置整体大型化的问题。
在制造方法上也由于需要形成散热器110和向电路基板101上配置，所以有工时增加和制造成本变高的问题。
发明内容
本发明是鉴于上述问题而开发的，本发明的主要目的在于提供一种能使内置有功率类半导体元件的结构简单化的电路装置及其制造方法。
本发明的电路装置具备：电路基板、在所述电路基板上面形成的导电图形、与所述导电图形电连接的电路元件、与所述电路元件电连接并向外部导出的引线，在由所述引线一部分构成的岛部的上面安装所述电路元件，把所述岛部的下面固着在所述电路基板上。
本发明电路装置的制造方法具备：在形成为覆盖电路基板的绝缘层的上面形成导电图形的工序、把电路元件与所述导电图形电连接的工序、把引线固着在所述电路基板表面的工序，在设置于所述引线一部分的岛部固着所述电路元件。
另外，本发明电路装置的制造方法具备：在电路基板的上面经由B阶段状态的绝缘层而粘贴导电箔的工序、把所述导电箔构图而形成导电图形的工序、在由引线的一部分构成的岛部固着电路元件的工序、把所述引线的所述岛部的下面粘贴在所述绝缘层表面的工序。
附图说明
图1(A)是本发明电路装置的立体图，图1(B)是本发明电路装置的立体图；
图2(A)是本发明电路装置的剖面图，图2(B)是本发明电路装置的剖面图；
图3(A)是本发明电路装置的立体图，图3(B)是本发明电路装置的立体图；
图4(A)是说明本发明电路装置制造方法的剖面图，图4(B)是说明本发明电路装置制造方法的剖面图；图4(C)是说明本发明电路装置制造方法的剖面图，图4(D)是说明本发明电路装置制造方法的剖面图，图4(E)是说明本发明电路装置制造方法的剖面图；
图5(A)是说明本发明电路装置制造方法的平面图，图5(B)是说明本发明电路装置制造方法的平面图，图5(C)是说明本发明电路装置制造方法的剖面图；
图6(A)是说明本发明电路装置制造方法的平面图，图6(B)是说明本发明电路装置制造方法的剖面图，图6(C)是说明本发明电路装置制造方法的剖面图；
图7(A)是说明本发明电路装置制造方法的剖面图，图7(B)是说明本发明电路装置制造方法的平面图；
图8(A)是说明本发明电路装置制造方法的平面图，图8(B)是说明本发明电路装置制造方法的剖面图；
图9是说明现有混合集成电路装置的剖面图。
具体实施方式
<第一实施例>
本实施例中，参照图1到图3，作为电路装置的一例来说明混合集成电路装置10的结构。
参照图1说明本发明混合集成电路装置10的结构。图1(A)是从斜上方看混合集成电路装置10的立体图。图1(B)是省略了密封整体的密封树脂14的混合集成电路装置10的立体图。
参照图1(A)和图1(B)，在矩形电路基板11的表面形成有绝缘层12。在绝缘层12表面形成的导电图形13的规定部位电连接有由LSI构成的控制元件15A和芯片元件15C。电路基板11表面形成的导电图形13和电路元件被密封树脂14所覆盖。引线25被从密封树脂14向外部导出。
电路基板11是以(Al)或铜(Cu)等金属为主要材料的金属基板。电路基板11的具体大小例如是长×宽×厚度＝30mm×15mm×1.5mm左右。作为电路基板11在采用由铝构成时，电路基板11的两主面被进行阳极化处理。
绝缘层12形成为把电路基板11的整个上面覆盖。绝缘层12由被高填充有AL2O3等填料的环氧树脂等构成。这样能把内置的电路元件所产生的热经由电路基板11积极地向外部放出。绝缘层12的具体厚度例如是50μm左右。也可以把电路基板11的背面由绝缘层12覆盖。这样，即使把电路基板11的背面从密封树脂14向外部露出，也能使电路基板11的背面与外部绝缘。
导电图形13由铜等金属构成，并形成规定电路并形成在绝缘层12的表面。在引线25导出的边上形成有由导电图形13构成的焊盘13A。且在控制元件15A的周围也形成有多个焊盘13A，焊盘13A与控制元件15A通过金属细线17连接。在此，图示单层的导电图形13，但也可以把经由绝缘层层积的多层导电图形13形成在电路基板11的上面。
导电图形13是把设置在绝缘层12上面的厚度50μm～100μm左右的薄导电膜构图而形成。因此，能把导电图形13的宽度形成为窄到50μm～100μm左右。且能使导电图形13彼此之间离开的距离也窄到50μm～100μm左右。因此，即使控制元件15A是具有数百个电极的元件，也能在控制元件15A的周围形成与电极数对应的焊盘13A。利用微细形成的导电图形13而能在电路基板11的表面形成复杂的电路。
作为与导电图形13电连接的电路元件可以全面地采用有源元件或无源元件。具体地能把晶体管、LSI芯片、二极管、芯片阻抗、芯片电容、电感、热敏电阻、天线、振荡器等作为电路元件采用。并且，树脂密封型的封装件等也能作为电路元件固着在导电图形13上。
参照图1(B)，在电路基板11的上面作为电路元件而配置有控制元件15A、功率元件15B和芯片元件15C。控制电极15A是表面形成有规定电路的LSI，向功率元件15B的控制电极供给电信号。功率元件15B例如是有1安培以上电流通过主电极的元件，由控制元件15A控制其动作。具体地能把MOSFET(Metal-Oxide Semiconductor Field Effect Transistor)、IGBT(Insulated Gate Bipolar Transistor)、IC(Integrated Circuit)、双极型晶体管等作为功率元件15B来采用。在此，功率元件15B被放置在由引线25A的一部分构成的岛部18上面。该事项的详细情况在下面叙述。
密封树脂14通过使用热固性树脂的传递模注塑或使用热塑性树脂的喷射注塑来形成。在此，利用密封树脂14把导电图形13、电路元件、芯片元件15B、金属细线17密封。可以使包括电路基板11背面的电路基板11A整体被密封树脂14覆盖，也可以使电路基板11的背面从密封树脂14露出。
引线25的一端与电路基板11上的焊盘13A电连接，另一端从密封树脂14向外部导出。引线25由以铜(Cu)、铝(Al)或Fe-Ni合金等为主要成分的金属构成。在此，沿电路基板11的相对向的两个侧边设置的焊盘13A上连接有引线25。但也可以沿电路基板11的一个侧边或四个侧边设置焊盘13A，在该焊盘13A上连接引线25。
为了防止有金属露出的电路基板11的侧面与引线25产生短路，引线25形成为曲折的海鸥展翅形状。即在引线25的中部、比电路基板11的外周端部靠近内侧的区域设置有向上方倾斜的部分。因此，由于电路基板11的侧面与引线25离开，所以两者的短路被防止。
本实施例在引线25A的一部分设置有岛部18，把该岛部18的背面粘贴在绝缘层12的上面。把上述的功率元件15B安装在岛部18的上面。这样，由于岛部18作为散热器起作用，所以功率元件15B产生的热经由岛部18、绝缘层12和电路基板11被良好地向外部放出。
岛部18由引线25A的一部分构成，通过把岛部18的背面粘贴在电路基板11的表面而把引线25A固着在电路基板11。在此，把引线25A的一部分的宽度扩大而形成岛部18。岛部18在平面上的大小被形成为比上面安装的功率元件15B大。
引线25A由把厚度0.5mm左右的金属板通过腐蚀加工或冲压加工而形成。因此，与电路基板11上面形成的导电图形13相比，引线25A被形成为较厚。所以由引线25A的一部分构成的岛部18也被形成为较厚，作为散热器发挥功能，有利于散发功率元件15B产生的热。
功率元件15B经由焊锡等导电性接合材料而被固着在引线25A的岛部18的上面。因此，功率元件15B的背面电极不经由电路基板11上的导电图形13地直接与引线25A连接。因此，不需要为了确保大的电流容量而在电路基板11的表面形成宽度宽的导电图形13，所以能把电路基板11制造成小型。引线25A的剖面例如能大到长×宽＝0.5mm×0.5mm左右而充分确保电流容量。
功率元件15B的上面形成的电极经由金属细线17与电路基板11上的焊盘13A连接。在需要电流容量的情况下，作为金属细线17而使用直径150μm左右以上的粗线。
参照图2在下面说明功率元件15B的连接结构。图2(A)和图2(B)是表示功率元件15B固着结构的剖面图。
参照图2(A)，在此把引线25A的岛部18直接固着在覆盖电路基板11上面的绝缘层12上。这时，把岛部18粘贴在B阶段状态的绝缘层12的上面后，通过把绝缘层12加热固化而使岛部18的背面固着在电路基板11。通过形成为这种结构，由于位于岛部18与电路基板11之间的仅有绝缘层12，所以能把功率元件15B产生的热高效率地向外部放出。
图2(B)中岛部18的背面经由焊锡等固着材料16B而被固着在绝缘层12的上面形成的岛状导电图形13上。
这时，安装功率元件15B所使用的接合材料16A与安装岛部18所使用的接合材料16B最好采用熔点不同的材料。
具体说就是把功率元件15B固着在岛部18的上面之后再把岛部18的背面向电路基板11安装时，最好使接合材料16A的熔化温度比接合材料16B的高。这样，在把经由接合材料16A而固着有功率元件15B的岛部18使用熔化的接合材料16B向电路基板11安装的工序中，能防止接合材料16A熔化。
把岛部18固着在电路基板11上之后再把功率元件15B向岛部18安装时，最好使接合材料16B的熔化温度比接合材料16A的高。这样，在使接合材料16A熔化而把功率元件15B向岛部18的上面安装的工序中，能防止固着岛部18所使用的固着材料18B熔化。
参照图3进一步说明引线25A。在上述的说明中引线25A所设置的岛部18固着有一个功率元件15B，但如图3(A)所示，在一个岛部18的上面能安装多个(在此是两个)功率元件15B。如图3(B)所示，相对一个岛部18也可以设置多个引线25A。
<第二实施例>
本实施例中，参照图4说明混合集成电路装置的基本制造方法。
参照图4(A)，首先在电路基板11的整个上面经由绝缘层12粘贴导电箔20。电路基板11由以铜或铝为主要材料的金属构成，例如能采用两主面被阳极氧化的厚度1.5mm左右的铝基板。作为导电箔20例如能采用以厚度50μm～100μm左右的铜为主要材料的导电箔。
绝缘层12由被高填充有Al2O3等填料的环氧树脂等构成，作为粘接电路基板11和导电箔20的粘接材料起作用。绝缘层12还具有使电路基板11与导电箔20绝缘的功能。该工序中绝缘层12也可以是完全被固化的C阶段状态，也可以是半固化的B阶段状态。把绝缘层12设定成C阶段状态时则加热到200度左右，设定成B阶段状态时则加热到100度左右。B阶段状态的绝缘层12具有粘接力。因此，若把绝缘层12设定成B阶段状态，则能在后面的工序中把引线25A的岛部18背面粘贴在绝缘层12的上面。如图2(B)所示，在后面的工序当把引线25A的岛部18向导电图形13固着时，绝缘层12是C阶段状态便可。
参照图4(B)，然后通过把导电箔20构图而形成导电图形13。在此，通过使用未图示的腐蚀保护层的湿式腐蚀来形成导电图形13。本工序中，腐蚀导电箔20以使后工序中要固着引线25A的区域的绝缘层12露出。
参照图4(C)，然后在B阶段状态的绝缘层12的上面粘贴引线25A的岛部18的背面。如上述那样，B阶段状态(半固化状态)的绝缘层12的表面具有粘着力。因此，通过把引线25A的一部分设置的岛部18粘贴在绝缘层12的上面，能把引线25A相对电路基板11固着。把引线25A固着后，通过把绝缘层12加热到200度左右使绝缘层12变成C阶段状态(完全固化状态)。也可以如图示那样预先在岛部18的上面安装功率元件15B。
参照图4(D)，然后在电路基板11的导电图形13上电连接电路元件。在此，把半导体元件即控制元件15A和芯片元件15C固着在导电图形13上。在由岛状导电图形13构成的焊盘13A上也固着有引线25。控制元件15A表面的电极经由金属细线17与导电图形13连接。固着在岛部18上面的功率元件15B也经由金属细线17与电路基板11上的导电图形13连接。
参照图4(E)，然后形成密封树脂14至少把电路基板11的上面密封。在此，使用热固性树脂的传递模注塑把电路基板11的整个面密封。作为密封电路基板11的结构也可以是喷射注塑、灌注、利用壳体材料的密封等。
<第三实施例>
本实施例中，参照图5到图7说明使用引线框40的混合集成电路装置的制造方法。
参照图5，首先准备设置有多个引线25的引线框40。图5(A)是表示引线框40上设置的一个单元46的平面图，图5(B)是表示引线框40整体的平面图，图5(C)是表示引线25A上设置的岛部18的剖面图。图5(A)中把后面工序设置电路基板11的区域以虚线表示。
参照图5(A)，单元46由一端位于安装有电路基板11的区域内的多个引线25构成。引线25在纸面上从左右两个方向向放置有电路基板11的区域延伸。多个引线25通过从外框41延伸的连接杆44相互连接而能防止变形。引线25A的前端部设置有局部被变宽的岛部18。
参照图5(B)，长方形的引线框40中多个上述结构的单元46分开地配置。本实施例中，通过引线框40设置多个单元46来制造混合集成电路装置，由此能把引线接合和注塑工序等一并进行，提高生产性。
参照图5(C)，在此，把电路基板11向引线框40固着之前把功率元件15B固着在引线25A的岛部18。在此，经过由焊锡和导电膏构成的固着材料16A而把功率元件15B的背面固着在岛部18的上面。
参照图6，接着在引线框40上固着电路基板11。图6(A)是表示引线框40的单元46的平面图，图6(B)和图6(C)是表示岛部18上固着有功率元件15B的部位的剖面图。
参照图6(A)，通过把引线25固着在电路基板11周边部形成的焊盘13A而把电路基板11固着在引线框40上。引线25的前端部经由焊锡等固着材料固着在电路基板11上的焊盘13A上。本工序中，在图面中电路基板11的左侧上端部分固着引线25A的岛部18。也可以把岛部18的背面固着在电路基板11上面形成的导电图形13上，也可以粘贴在覆盖电路基板11上面的绝缘层12上。
把半导体元件等电路元件安装在电路基板11上。在此，也可以把预先安装有电路元件的电路基板11固着在引线框40上，也可以把电路基板11固着在引线框40上之后向电路基板11上安装电路元件。被安装的电路元件经由金属细线17与导电图形13连接。
参照图6(B)，在此，把在引线25A的前端部形成的岛部18的背面经由焊锡等接合材料16B固着在岛形状的导电图形13上。且把功率MOS等功率元件15B经由接合材料16A固着在岛部18的上面。功率元件15B上面形成的电极经由金属细线17与导电图形13连接。
如上所述，用于安装功率元件15B的接合材料16A与用于安装岛部18的接合材料16B最好采用熔点不同的材料。
具体说就是把功率元件15B固着在岛部18的上面之后，再把岛部18的背面向电路基板11安装时，最好使接合材料16A的熔化温度比接合材料16B的高。把岛部18固着在电路基板11上之后再把功率元件15B向岛部18安装时，最好使接合材料16B的熔化温度比接合材料16A的高。
参照图6(C)，在此，把岛部18的背面粘贴在B阶段状态的绝缘层12的上面。由于B阶段状态的绝缘层12是半固化状态而粘着性强，所以能把绝缘层12作为粘接材料而把岛部18的背面相对电路基板11固着。这时，把岛部18粘贴在绝缘层12上之后进行用于使绝缘层12固化的加热处理。
参照图7，接着覆盖电路基板11地形成密封树脂。图7(A)是表示使用模具对电路基板11进行注塑的工序的剖面图，图7(B)是表示进行注塑后引线框40的平面图。
参照图7(A)，首先把电路基板11收容在由上模具22A和下模具22B形成的模腔23中。在此，通过使上模具22A和下模具22B与引线25接触而固着电路基板11在模腔23内部的位置。从设置在模具上的注塑口(未图示)向模腔23注入树脂而把电路基板11密封。本实施例进行使用热固化树脂的传递模注塑或使用热塑性树脂的喷射注塑。
参照图7(B)，在上述注塑工序结束后把引线25从引线框40分离。具体说就是在设置有连接杆44的部位把引线25个别分离，把图1所示的混合集成电路装置从引线框40分离。
<第四实施例>
参照图8说明把电路基板11向引线框40固着的其他结构。图8(A)是引线框40的单元46的平面图，图8(B)是设置岛部18的部位的剖面图。
参照图8(A)和图8(B)，与电路基板11的四个角对应来配置前端形成有岛部18的引线25A。把岛部18的背面粘贴在B阶段状态的绝缘层12上。因此，在此通过设置具有岛部18的引线25A而把电路基板11固着在引线框40上。在此，用于支承电路基板11的引线25A也不一定必须是四个，至少配置两个引线25A时就能支承电路基板11。
如上所述，利用配置在电路基板11四角的引线25A来支承电路基板11，这样，对于其他的引线25就不需要具有机械支承电路基板11的功能。因此，能把在电路基板11周边部形成的焊盘13A和引线25经由金属细线17连接。这种使用金属细线17的连接与图1所示的把引线25固着在焊盘13A上的情况相比，能沿电路基板11的侧边设置更多焊盘13A。其理由是在引线接合可能范围能把各个焊盘13A的大小更小型化的缘故。
根据本发明的电路装置，在由引线的一部分构成的岛部的上面安装电路元件，把岛部的背面固着在电路基板上，所以该岛部如上述作为散热器发挥功能。因此，能节省散热器而构成电路装置。由于把电路元件直接固着在引线的一部分即岛部上，所以不需要从电路元件到引线的导电图形的部分。根据这些，能把电路装置的结构简单化而降低成本。
使用B阶段状态的绝缘层的粘接力而能把固着有电路元件的岛部的背面固着在电路基板上。因此，在岛部与电路基板之间仅夹有绝缘层，所以能把安装在岛部上面的电路元件所产生的热良好地向外部放出。
根据本发明电路装置的制造方法，由于不需要把散热器安装到电路基板的工序，所以能减少工序数而降低成本。
把由引线的一部分构成的岛部粘贴在电路基板上面形成的B阶段状态的绝缘层的表面，并通过使绝缘层热固化而把引线固着在电路基板上。因此，能不使用焊锡等固着材料而把引线固着在电路基板上。
在使用连结有多个引线的引线框来制造电路装置时，通过把由引线的一部分构成的岛部的背面粘贴在覆盖电路基板表面的绝缘层上而能把电路基板相对引线框固着。

Claims (11)

1、一种电路装置，其特征在于，具备：电路基板、在所述电路基板上面形成的导电图形、与所述导电图形电连接的电路元件、与所述电路元件电连接并向外部导出的引线，
在由所述引线的一部分构成的岛部的上面安装所述电路元件，
把所述岛部的下面固着在所述电路基板上。
2、如权利要求1所述的电路装置，其特征在于，所述岛部的下面被固着在覆盖所述电路基板上面的绝缘层上。
3、如权利要求1所述的电路装置，其特征在于，把所述岛部的下面粘贴在覆盖所述电路基板上面的B阶段状态的绝缘层上之后，通过把所述绝缘层加热固化将其固着在所述电路基板上。
4、如权利要求1所述的电路装置，其特征在于，所述岛部被固着在所述导电图形上。
5、如权利要求1所述的电路装置，其特征在于，安装在所述岛部上的电路元件经由金属细线与所述导电图形连接。
6、如权利要求1所述的电路装置，其特征在于，所述电路元件包括功率元件和控制所述功率元件的控制元件，
所述控制元件与所述导电图形连接，
所述功率元件被固着在所述岛部。
7、一种电路装置的制造方法，其特征在于，具备：
在形成为覆盖电路基板的绝缘层的上面形成导电图形的工序、
把电路元件与所述导电图形电连接的工序、
把引线固着在所述电路基板表面的工序，
在设置于所述引线一部分的岛部固着所述电路元件。
8、一种电路装置的制造方法，其特征在于，具备：
在电路基板的上面经由B阶段状态的绝缘层而粘贴导电箔的工序、
把所述导电箔构图而形成导电图形的工序、
在由引线的一部分构成的岛部固着电路元件的工序、
把所述引线的所述岛部的下面粘贴在所述绝缘层表面的工序。
9、如权利要求8所述的电路装置的制造方法，其特征在于，
所述引线在连结有多个引线的引线框的状态下被供给，
通过把所述引线所设置的岛部粘贴在B阶段状态的所述绝缘层上，而把所述电路基板固着在所述引线框。
10、如权利要求7或8所述的电路装置的制造方法，其特征在于，把电路元件安装在所述岛部的上面之后，把所述岛部的下面粘贴在所述绝缘层。
11、如权利要求8所述的电路装置的制造方法，其特征在于，在粘贴了所述岛部后，把B阶段状态的所述绝缘层加热固化。
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