JP7127744B2 - 樹脂多層基板および樹脂多層基板の製造方法 - Google Patents

樹脂多層基板および樹脂多層基板の製造方法 Download PDF

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Publication number
JP7127744B2
JP7127744B2 JP2021533990A JP2021533990A JP7127744B2 JP 7127744 B2 JP7127744 B2 JP 7127744B2 JP 2021533990 A JP2021533990 A JP 2021533990A JP 2021533990 A JP2021533990 A JP 2021533990A JP 7127744 B2 JP7127744 B2 JP 7127744B2
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Prior art keywords
coil conductor
conductor pattern
overlapping portion
adjacent
coil
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JP2021533990A
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Japanese (ja)
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JPWO2021015097A1 (https=
JPWO2021015097A5 (https=
Inventor
麟太朗 杉
啓介 荒木
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2021533990A 2019-07-19 2020-07-16 樹脂多層基板および樹脂多層基板の製造方法 Active JP7127744B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019133246 2019-07-19
JP2019133246 2019-07-19
PCT/JP2020/027689 WO2021015097A1 (ja) 2019-07-19 2020-07-16 樹脂多層基板および樹脂多層基板の製造方法

Publications (3)

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JPWO2021015097A1 JPWO2021015097A1 (https=) 2021-01-28
JPWO2021015097A5 JPWO2021015097A5 (https=) 2022-02-17
JP7127744B2 true JP7127744B2 (ja) 2022-08-30

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JP2021533990A Active JP7127744B2 (ja) 2019-07-19 2020-07-16 樹脂多層基板および樹脂多層基板の製造方法

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Country Link
US (1) US12586707B2 (https=)
JP (1) JP7127744B2 (https=)
CN (1) CN216752238U (https=)
WO (1) WO2021015097A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7287216B2 (ja) * 2019-09-24 2023-06-06 Tdk株式会社 コイル構造体
JP7814841B2 (ja) * 2021-02-18 2026-02-17 Tdk株式会社 積層コイル部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118059A (ja) 2006-11-07 2008-05-22 Tdk Corp コモンモードチョークコイル
WO2015005161A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 電子部品
WO2015079941A1 (ja) 2013-11-28 2015-06-04 株式会社村田製作所 多層基板の製造方法、多層基板および電磁石
WO2018174133A1 (ja) 2017-03-24 2018-09-27 株式会社村田製作所 多層基板、アクチュエータおよび多層基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110907A (ja) * 1988-10-19 1990-04-24 Toko Inc 積層インダクタとそのインダクタンス調整方法
JP3821083B2 (ja) * 2002-10-11 2006-09-13 株式会社デンソー 電子機器
CN101589444B (zh) * 2007-12-26 2013-03-27 株式会社村田制作所 层叠型电子器件及包括该器件的电子器件模块
JP5636842B2 (ja) * 2010-09-24 2014-12-10 株式会社村田製作所 多層アンテナの製造方法
US8836460B2 (en) * 2012-10-18 2014-09-16 International Business Machines Corporation Folded conical inductor
JP2015050422A (ja) * 2013-09-04 2015-03-16 株式会社村田製作所 樹脂多層基板およびその製造方法
CN205080957U (zh) * 2013-12-06 2016-03-09 株式会社村田制作所 电感元件及电子设备
DE102015222400A1 (de) * 2015-11-13 2017-06-08 Schaeffler Technologies AG & Co. KG Multilayer-Platine und Verfahren zu deren Herstellung
WO2017159437A1 (ja) * 2016-03-15 2017-09-21 株式会社村田製作所 回路基板およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118059A (ja) 2006-11-07 2008-05-22 Tdk Corp コモンモードチョークコイル
WO2015005161A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 電子部品
WO2015079941A1 (ja) 2013-11-28 2015-06-04 株式会社村田製作所 多層基板の製造方法、多層基板および電磁石
WO2018174133A1 (ja) 2017-03-24 2018-09-27 株式会社村田製作所 多層基板、アクチュエータおよび多層基板の製造方法

Also Published As

Publication number Publication date
WO2021015097A1 (ja) 2021-01-28
US20220130592A1 (en) 2022-04-28
CN216752238U (zh) 2022-06-14
JPWO2021015097A1 (https=) 2021-01-28
US12586707B2 (en) 2026-03-24

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