JP7114277B2 - パターン形成装置及び物品の製造方法 - Google Patents

パターン形成装置及び物品の製造方法 Download PDF

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Publication number
JP7114277B2
JP7114277B2 JP2018041198A JP2018041198A JP7114277B2 JP 7114277 B2 JP7114277 B2 JP 7114277B2 JP 2018041198 A JP2018041198 A JP 2018041198A JP 2018041198 A JP2018041198 A JP 2018041198A JP 7114277 B2 JP7114277 B2 JP 7114277B2
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Japan
Prior art keywords
substrate
optical system
light
pattern forming
alignment mark
Prior art date
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Active
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JP2018041198A
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English (en)
Japanese (ja)
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JP2019158926A5 (enExample
JP2019158926A (ja
Inventor
浩史 藤嶋
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Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018041198A priority Critical patent/JP7114277B2/ja
Priority to EP19160584.9A priority patent/EP3537219B1/en
Priority to TW108106986A priority patent/TWI722394B/zh
Priority to US16/292,953 priority patent/US10747116B2/en
Priority to CN201910167636.8A priority patent/CN110244519B/zh
Publication of JP2019158926A publication Critical patent/JP2019158926A/ja
Publication of JP2019158926A5 publication Critical patent/JP2019158926A5/ja
Application granted granted Critical
Publication of JP7114277B2 publication Critical patent/JP7114277B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
JP2018041198A 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法 Active JP7114277B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018041198A JP7114277B2 (ja) 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法
EP19160584.9A EP3537219B1 (en) 2018-03-07 2019-03-04 Pattern forming apparatus and article manufacturing method
TW108106986A TWI722394B (zh) 2018-03-07 2019-03-04 圖案形成裝置及物品製造方法
US16/292,953 US10747116B2 (en) 2018-03-07 2019-03-05 Pattern forming apparatus and article manufacturing method
CN201910167636.8A CN110244519B (zh) 2018-03-07 2019-03-06 图案形成装置、基板保持装置和物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018041198A JP7114277B2 (ja) 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2019158926A JP2019158926A (ja) 2019-09-19
JP2019158926A5 JP2019158926A5 (enExample) 2021-04-15
JP7114277B2 true JP7114277B2 (ja) 2022-08-08

Family

ID=65686727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018041198A Active JP7114277B2 (ja) 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法

Country Status (5)

Country Link
US (1) US10747116B2 (enExample)
EP (1) EP3537219B1 (enExample)
JP (1) JP7114277B2 (enExample)
CN (1) CN110244519B (enExample)
TW (1) TWI722394B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6980562B2 (ja) * 2018-02-28 2021-12-15 キヤノン株式会社 パターン形成装置、アライメントマークの検出方法及びパターン形成方法
JP7659388B2 (ja) 2020-12-08 2025-04-09 キヤノン株式会社 検出装置、検出方法、露光装置、露光システム、物品製造方法、およびプログラム
CN114047137B (zh) * 2021-09-28 2023-09-12 深圳市麓邦技术有限公司 偏振信息转化或复制拼接方法
CN118448324B (zh) * 2024-03-27 2025-06-06 深圳稳顶聚芯技术有限公司 对准装置及对准方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001356488A (ja) 2000-06-14 2001-12-26 Asahi Optical Co Ltd レーザ描画装置
JP2002280299A (ja) 2001-01-15 2002-09-27 Asml Netherlands Bv リソグラフィ装置
JP2003233198A (ja) 2002-02-12 2003-08-22 Konica Corp 画像露光装置
JP2017215489A (ja) 2016-06-01 2017-12-07 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62262426A (ja) * 1986-05-09 1987-11-14 Canon Inc 露光装置
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
JP2535889B2 (ja) * 1987-03-26 1996-09-18 株式会社ニコン 投影光学装置
JP2803667B2 (ja) * 1997-11-17 1998-09-24 株式会社ニコン 露光方法
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
US20090128792A1 (en) * 2007-10-19 2009-05-21 Asml Netherlands B.V. Lithographic apparatus and method
NL1036308A1 (nl) * 2007-12-19 2009-06-22 Asml Netherlands Bv Lithographic method.
CN102483580B (zh) * 2009-08-20 2015-04-01 株式会社尼康 物体处理装置、曝光装置及曝光方法、以及元件制造方法
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
JP6116456B2 (ja) * 2013-09-25 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 描画方法および描画装置
CN105807578A (zh) * 2014-12-29 2016-07-27 上海微电子装备有限公司 一种背面对准测量装置及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001356488A (ja) 2000-06-14 2001-12-26 Asahi Optical Co Ltd レーザ描画装置
JP2002280299A (ja) 2001-01-15 2002-09-27 Asml Netherlands Bv リソグラフィ装置
JP2003233198A (ja) 2002-02-12 2003-08-22 Konica Corp 画像露光装置
JP2017215489A (ja) 2016-06-01 2017-12-07 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法

Also Published As

Publication number Publication date
CN110244519A (zh) 2019-09-17
CN110244519B (zh) 2021-07-09
EP3537219B1 (en) 2023-05-10
EP3537219A1 (en) 2019-09-11
TWI722394B (zh) 2021-03-21
US20190278186A1 (en) 2019-09-12
JP2019158926A (ja) 2019-09-19
US10747116B2 (en) 2020-08-18
TW201939180A (zh) 2019-10-01

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