TWI722394B - 圖案形成裝置及物品製造方法 - Google Patents

圖案形成裝置及物品製造方法 Download PDF

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Publication number
TWI722394B
TWI722394B TW108106986A TW108106986A TWI722394B TW I722394 B TWI722394 B TW I722394B TW 108106986 A TW108106986 A TW 108106986A TW 108106986 A TW108106986 A TW 108106986A TW I722394 B TWI722394 B TW I722394B
Authority
TW
Taiwan
Prior art keywords
substrate
light
pattern forming
alignment mark
optical system
Prior art date
Application number
TW108106986A
Other languages
English (en)
Chinese (zh)
Other versions
TW201939180A (zh
Inventor
藤嶋浩史
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW201939180A publication Critical patent/TW201939180A/zh
Application granted granted Critical
Publication of TWI722394B publication Critical patent/TWI722394B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
TW108106986A 2018-03-07 2019-03-04 圖案形成裝置及物品製造方法 TWI722394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018041198A JP7114277B2 (ja) 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法
JP2018-041198 2018-03-07

Publications (2)

Publication Number Publication Date
TW201939180A TW201939180A (zh) 2019-10-01
TWI722394B true TWI722394B (zh) 2021-03-21

Family

ID=65686727

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108106986A TWI722394B (zh) 2018-03-07 2019-03-04 圖案形成裝置及物品製造方法

Country Status (5)

Country Link
US (1) US10747116B2 (enExample)
EP (1) EP3537219B1 (enExample)
JP (1) JP7114277B2 (enExample)
CN (1) CN110244519B (enExample)
TW (1) TWI722394B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6980562B2 (ja) * 2018-02-28 2021-12-15 キヤノン株式会社 パターン形成装置、アライメントマークの検出方法及びパターン形成方法
JP7659388B2 (ja) 2020-12-08 2025-04-09 キヤノン株式会社 検出装置、検出方法、露光装置、露光システム、物品製造方法、およびプログラム
CN114047137B (zh) * 2021-09-28 2023-09-12 深圳市麓邦技术有限公司 偏振信息转化或复制拼接方法
CN118448324B (zh) * 2024-03-27 2025-06-06 深圳稳顶聚芯技术有限公司 对准装置及对准方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201138008A (en) * 2009-08-20 2011-11-01 Nikon Corp Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
TW201513171A (zh) * 2013-09-25 2015-04-01 Screen Holdings Co Ltd 描繪方法以及描繪裝置
TW201727819A (zh) * 2009-08-20 2017-08-01 尼康股份有限公司 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法
EP3258319A2 (en) * 2016-06-01 2017-12-20 Canon Kabushiki Kaisha Pattern forming apparatus, method for disposing substrate, and method for manufacturing article

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62262426A (ja) * 1986-05-09 1987-11-14 Canon Inc 露光装置
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
JP2535889B2 (ja) * 1987-03-26 1996-09-18 株式会社ニコン 投影光学装置
JP2803667B2 (ja) * 1997-11-17 1998-09-24 株式会社ニコン 露光方法
JP2001356488A (ja) * 2000-06-14 2001-12-26 Asahi Optical Co Ltd レーザ描画装置
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
US6768539B2 (en) * 2001-01-15 2004-07-27 Asml Netherlands B.V. Lithographic apparatus
JP2003233198A (ja) * 2002-02-12 2003-08-22 Konica Corp 画像露光装置
US20090128792A1 (en) * 2007-10-19 2009-05-21 Asml Netherlands B.V. Lithographic apparatus and method
NL1036308A1 (nl) * 2007-12-19 2009-06-22 Asml Netherlands Bv Lithographic method.
CN105807578A (zh) * 2014-12-29 2016-07-27 上海微电子装备有限公司 一种背面对准测量装置及方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201138008A (en) * 2009-08-20 2011-11-01 Nikon Corp Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
TW201727819A (zh) * 2009-08-20 2017-08-01 尼康股份有限公司 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法
TW201839901A (zh) * 2009-08-20 2018-11-01 日商尼康股份有限公司 移動體裝置、曝光裝置、曝光方法、平面面板顯示器之製造方法、以及元件製造方法
TW201513171A (zh) * 2013-09-25 2015-04-01 Screen Holdings Co Ltd 描繪方法以及描繪裝置
EP3258319A2 (en) * 2016-06-01 2017-12-20 Canon Kabushiki Kaisha Pattern forming apparatus, method for disposing substrate, and method for manufacturing article
TW201805739A (zh) * 2016-06-01 2018-02-16 佳能股份有限公司 圖案形成裝置、設置基板的方法及製造物品的方法

Also Published As

Publication number Publication date
CN110244519A (zh) 2019-09-17
JP7114277B2 (ja) 2022-08-08
CN110244519B (zh) 2021-07-09
EP3537219B1 (en) 2023-05-10
EP3537219A1 (en) 2019-09-11
US20190278186A1 (en) 2019-09-12
JP2019158926A (ja) 2019-09-19
US10747116B2 (en) 2020-08-18
TW201939180A (zh) 2019-10-01

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