JP7109862B2 - 半導体ウェーハの加工方法 - Google Patents
半導体ウェーハの加工方法 Download PDFInfo
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- JP7109862B2 JP7109862B2 JP2018130981A JP2018130981A JP7109862B2 JP 7109862 B2 JP7109862 B2 JP 7109862B2 JP 2018130981 A JP2018130981 A JP 2018130981A JP 2018130981 A JP2018130981 A JP 2018130981A JP 7109862 B2 JP7109862 B2 JP 7109862B2
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Description
11a 表面
11b 裏面
11c 歪み層
11d 除去領域
11e 切削溝
13 機能層
13a 第1の絶縁膜
13b 第2の絶縁膜
13c 第3の絶縁膜
13d 第4の絶縁膜
13e 配線層
13f ビア
13g 金属電極
13h 開口
13i 表面
13j 変質層
13k 除去領域
15 半導体デバイス
17 分割予定ライン(ストリート)
19 保護層
19A 縁部
19B 上部
19a,19b 除去領域
21 デバイスウェーハ
21a 表面
21b デバイスチップ
23 水溶性樹脂
25 レーザー加工溝
25a 第1の拡張溝
25b 第2の拡張溝
27a 支持テープ(ダイシングテープ)
27b フレーム
29 ウェーハユニット
30 マスク層
30a,30b 開口
32 下地金属層
34 バンプ
40 切削ブレード
50 研削装置
52 チャックテーブル
52a 保持面
54 スピンドル
56 ホイールマウント
58 研削ホイール
58a 環状基台
58b 研削砥石
L レーザービーム
P1,P2,P3 プラズマ
A 仕上げ厚さ
Claims (5)
- 配線層と該配線層上に位置する金属電極とを含み半導体ウェーハの表面に形成された機能層を有する複数の半導体デバイスと、該機能層上に位置し且つ該複数の半導体デバイスを区画する分割予定ラインとを形成するデバイス形成ステップと、
該機能層の表面を絶縁性の保護層で被覆しデバイスウェーハを形成する保護層被覆ステップと、
該機能層及び該半導体ウェーハに対して吸収性を有する波長のレーザービームを該分割予定ラインに沿って照射し、該半導体ウェーハ、該保護層及び該機能層を部分的に除去して該半導体ウェーハを露出させることによりレーザー加工溝を形成するレーザー加工溝形成ステップと、
該レーザー加工溝以外に残留する該保護層のうち、該金属電極上の領域を除いた領域を、マスク層で覆うマスク層形成ステップと、
該マスク層を介して該保護層に対して第1のガスを用いたプラズマエッチングを行い、該金属電極を露出させる第1のエッチングステップと、
第1のエッチングステップ後の該マスク層を介して該レーザー加工溝に対して第2のガスを用いたプラズマエッチングを行い、該マスク層から露出する該機能層と該半導体ウェーハの一部とを除去して、該レーザー加工溝を幅方向および深さ方向に拡張する第2のエッチングステップと、
該第2のエッチングステップで拡張された該レーザー加工溝に沿って該半導体ウェーハをデバイスチップに分割する分割ステップと、を備え、
該マスク層形成ステップで形成された、該レーザー加工溝の周辺に位置する該マスク層の該レーザー加工溝側の縁部は、該レーザー加工溝の縁部よりも外側に後退しており、
該レーザー加工溝の周辺の該保護層の上部は、該マスク層から露出されていることを特徴とする半導体ウェーハの加工方法。 - 該保護層被覆ステップの後且つ該レーザー加工溝形成ステップの前に、該デバイスウェーハの表面を水溶性樹脂で被覆する水溶性樹脂被覆ステップと、
該レーザー加工溝形成ステップの後且つ該マスク層形成ステップの前に、該デバイスウェーハを洗浄して該レーザー加工溝形成ステップで発生したデブリとともに該水溶性樹脂を除去する洗浄ステップと、を更に備えることを特徴とする請求項1に記載の半導体ウェーハの加工方法。 - 該分割ステップは、第2のエッチングステップで拡張された該レーザー加工溝に沿って該半導体ウェーハを切削ブレードで切削する切削ステップであることを特徴とする請求項1又は2に記載の半導体ウェーハの加工方法。
- 該第2のエッチングステップで拡張された該レーザー加工溝は、該半導体ウェーハの該表面から該デバイスチップの仕上げ厚さを超える深さまで形成され、
該分割ステップでは、該半導体ウェーハの該表面の反対側に位置する裏面を研削して該半導体ウェーハを仕上げ厚さに加工するとともに該第2のエッチングステップで拡張された該レーザー加工溝に沿って該半導体ウェーハを分割することを特徴とする請求項1又は2に記載の半導体ウェーハの加工方法。 - 該第1のエッチングステップで露出された該金属電極上にバンプを形成するバンプ形成ステップを更に備えることを特徴とする請求項1から4のいずれかに記載の半導体ウェーハの加工方法。
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DE102019210185A1 (de) | 2020-01-16 |
KR20200006498A (ko) | 2020-01-20 |
DE102019210185B4 (de) | 2022-06-23 |
TWI800665B (zh) | 2023-05-01 |
US10796962B2 (en) | 2020-10-06 |
TW202006810A (zh) | 2020-02-01 |
US20200020585A1 (en) | 2020-01-16 |
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