JP7023154B2 - 電子部品実装装置 - Google Patents

電子部品実装装置 Download PDF

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Publication number
JP7023154B2
JP7023154B2 JP2018063188A JP2018063188A JP7023154B2 JP 7023154 B2 JP7023154 B2 JP 7023154B2 JP 2018063188 A JP2018063188 A JP 2018063188A JP 2018063188 A JP2018063188 A JP 2018063188A JP 7023154 B2 JP7023154 B2 JP 7023154B2
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JP
Japan
Prior art keywords
electronic component
shaped electronic
holding head
mounting
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018063188A
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English (en)
Japanese (ja)
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JP2019176028A5 (enExample
JP2019176028A (ja
Inventor
圭剛 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2018063188A priority Critical patent/JP7023154B2/ja
Priority to KR1020190032935A priority patent/KR102253289B1/ko
Priority to CN201910237691.XA priority patent/CN110323146B/zh
Priority to TW108110637A priority patent/TWI723362B/zh
Publication of JP2019176028A publication Critical patent/JP2019176028A/ja
Publication of JP2019176028A5 publication Critical patent/JP2019176028A5/ja
Application granted granted Critical
Publication of JP7023154B2 publication Critical patent/JP7023154B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2018063188A 2018-03-28 2018-03-28 電子部品実装装置 Active JP7023154B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置
KR1020190032935A KR102253289B1 (ko) 2018-03-28 2019-03-22 전자 부품 실장 장치
CN201910237691.XA CN110323146B (zh) 2018-03-28 2019-03-27 电子零件封装装置
TW108110637A TWI723362B (zh) 2018-03-28 2019-03-27 電子零件封裝裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Publications (3)

Publication Number Publication Date
JP2019176028A JP2019176028A (ja) 2019-10-10
JP2019176028A5 JP2019176028A5 (enExample) 2021-04-22
JP7023154B2 true JP7023154B2 (ja) 2022-02-21

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018063188A Active JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Country Status (4)

Country Link
JP (1) JP7023154B2 (enExample)
KR (1) KR102253289B1 (enExample)
CN (1) CN110323146B (enExample)
TW (1) TWI723362B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP2022158935A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
JP2022158937A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
TWI849583B (zh) * 2021-11-19 2024-07-21 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202877A (ja) 2005-01-19 2006-08-03 Hitachi High-Tech Electronics Engineering Co Ltd 半導体装置実装装置
WO2008090976A1 (ja) 2007-01-25 2008-07-31 Panasonic Corporation 段積みトレイの供給装置及び供給方法、並びに部品実装装置及び方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2685561B1 (fr) * 1991-12-20 1994-02-04 Thomson Hybrides Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
JP4308772B2 (ja) * 2002-12-02 2009-08-05 パナソニック株式会社 部品供給ヘッド装置、部品供給装置、部品実装装置、及び実装ヘッド部の移動方法
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4323410B2 (ja) * 2004-10-22 2009-09-02 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
CN100561696C (zh) * 2007-03-01 2009-11-18 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法
CN101981681B (zh) * 2008-04-01 2012-10-24 松下电器产业株式会社 零件安装装置及方法
JP4658235B2 (ja) * 2009-01-08 2011-03-23 パナソニック株式会社 部品実装装置及びその方法
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
KR101399973B1 (ko) * 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202877A (ja) 2005-01-19 2006-08-03 Hitachi High-Tech Electronics Engineering Co Ltd 半導体装置実装装置
WO2008090976A1 (ja) 2007-01-25 2008-07-31 Panasonic Corporation 段積みトレイの供給装置及び供給方法、並びに部品実装装置及び方法

Also Published As

Publication number Publication date
KR102253289B1 (ko) 2021-05-20
TW201943005A (zh) 2019-11-01
KR20190113604A (ko) 2019-10-08
JP2019176028A (ja) 2019-10-10
CN110323146B (zh) 2022-11-08
CN110323146A (zh) 2019-10-11
TWI723362B (zh) 2021-04-01

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