CN110323146B - 电子零件封装装置 - Google Patents

电子零件封装装置 Download PDF

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Publication number
CN110323146B
CN110323146B CN201910237691.XA CN201910237691A CN110323146B CN 110323146 B CN110323146 B CN 110323146B CN 201910237691 A CN201910237691 A CN 201910237691A CN 110323146 B CN110323146 B CN 110323146B
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CN
China
Prior art keywords
electronic component
holding head
film
tray
shaped electronic
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Active
Application number
CN201910237691.XA
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English (en)
Chinese (zh)
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CN110323146A (zh
Inventor
広濑圭刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN110323146A publication Critical patent/CN110323146A/zh
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Publication of CN110323146B publication Critical patent/CN110323146B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
CN201910237691.XA 2018-03-28 2019-03-27 电子零件封装装置 Active CN110323146B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置
JP2018-063188 2018-03-28

Publications (2)

Publication Number Publication Date
CN110323146A CN110323146A (zh) 2019-10-11
CN110323146B true CN110323146B (zh) 2022-11-08

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910237691.XA Active CN110323146B (zh) 2018-03-28 2019-03-27 电子零件封装装置

Country Status (4)

Country Link
JP (1) JP7023154B2 (enExample)
KR (1) KR102253289B1 (enExample)
CN (1) CN110323146B (enExample)
TW (1) TWI723362B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
JP2022158935A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
JP2022158937A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
TW202438692A (zh) * 2021-11-19 2024-10-01 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243681A (ja) * 1991-12-20 1993-09-21 Thomson Hybrides レーザ列の配線方法及び該方法によって配線されたレーザ列
CN1720612A (zh) * 2002-12-02 2006-01-11 松下电器产业株式会社 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法
CN101256965A (zh) * 2007-03-01 2008-09-03 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4323410B2 (ja) * 2004-10-22 2009-09-02 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4518257B2 (ja) 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US8328498B2 (en) 2007-01-25 2012-12-11 Panasonic Corporation Component feeding unit and method, and component mounting apparatus and method
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
US8646171B2 (en) * 2008-04-01 2014-02-11 Panasonic Corporation Component mounting apparatus and method
JP4658235B2 (ja) * 2009-01-08 2011-03-23 パナソニック株式会社 部品実装装置及びその方法
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
KR101399973B1 (ko) 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243681A (ja) * 1991-12-20 1993-09-21 Thomson Hybrides レーザ列の配線方法及び該方法によって配線されたレーザ列
CN1720612A (zh) * 2002-12-02 2006-01-11 松下电器产业株式会社 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法
CN101256965A (zh) * 2007-03-01 2008-09-03 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法

Also Published As

Publication number Publication date
TWI723362B (zh) 2021-04-01
TW201943005A (zh) 2019-11-01
CN110323146A (zh) 2019-10-11
JP7023154B2 (ja) 2022-02-21
KR102253289B1 (ko) 2021-05-20
KR20190113604A (ko) 2019-10-08
JP2019176028A (ja) 2019-10-10

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