TWI723362B - 電子零件封裝裝置 - Google Patents

電子零件封裝裝置 Download PDF

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Publication number
TWI723362B
TWI723362B TW108110637A TW108110637A TWI723362B TW I723362 B TWI723362 B TW I723362B TW 108110637 A TW108110637 A TW 108110637A TW 108110637 A TW108110637 A TW 108110637A TW I723362 B TWI723362 B TW I723362B
Authority
TW
Taiwan
Prior art keywords
electronic component
shaped electronic
holding head
tray
film
Prior art date
Application number
TW108110637A
Other languages
English (en)
Chinese (zh)
Other versions
TW201943005A (zh
Inventor
広瀬圭剛
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW201943005A publication Critical patent/TW201943005A/zh
Application granted granted Critical
Publication of TWI723362B publication Critical patent/TWI723362B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
TW108110637A 2018-03-28 2019-03-27 電子零件封裝裝置 TWI723362B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-063188 2018-03-28
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Publications (2)

Publication Number Publication Date
TW201943005A TW201943005A (zh) 2019-11-01
TWI723362B true TWI723362B (zh) 2021-04-01

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108110637A TWI723362B (zh) 2018-03-28 2019-03-27 電子零件封裝裝置

Country Status (4)

Country Link
JP (1) JP7023154B2 (enExample)
KR (1) KR102253289B1 (enExample)
CN (1) CN110323146B (enExample)
TW (1) TWI723362B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP2022158935A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
JP2022158937A (ja) * 2021-03-31 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
TWI849583B (zh) * 2021-11-19 2024-07-21 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120929A (ja) * 2004-10-22 2006-05-11 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2007201375A (ja) * 2006-01-30 2007-08-09 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
TW200946432A (en) * 2008-04-01 2009-11-16 Panasonic Corp Component mounting apparatus and method
TW201112893A (en) * 2009-08-07 2011-04-01 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component
US20110289772A1 (en) * 2009-01-08 2011-12-01 Kazuaki Kosaka Component mounting apparatus and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2685561B1 (fr) * 1991-12-20 1994-02-04 Thomson Hybrides Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
JP4308772B2 (ja) * 2002-12-02 2009-08-05 パナソニック株式会社 部品供給ヘッド装置、部品供給装置、部品実装装置、及び実装ヘッド部の移動方法
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4518257B2 (ja) * 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
CN101589658B (zh) * 2007-01-25 2012-06-13 松下电器产业株式会社 堆垛托盘供给装置及供给方法、以及部件安装装置及方法
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
CN100561696C (zh) * 2007-03-01 2009-11-18 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法
KR101399973B1 (ko) * 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120929A (ja) * 2004-10-22 2006-05-11 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2007201375A (ja) * 2006-01-30 2007-08-09 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
TW200946432A (en) * 2008-04-01 2009-11-16 Panasonic Corp Component mounting apparatus and method
US20110289772A1 (en) * 2009-01-08 2011-12-01 Kazuaki Kosaka Component mounting apparatus and method
TW201112893A (en) * 2009-08-07 2011-04-01 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component

Also Published As

Publication number Publication date
KR102253289B1 (ko) 2021-05-20
TW201943005A (zh) 2019-11-01
KR20190113604A (ko) 2019-10-08
JP2019176028A (ja) 2019-10-10
CN110323146B (zh) 2022-11-08
CN110323146A (zh) 2019-10-11
JP7023154B2 (ja) 2022-02-21

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