JP6938825B2 - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP6938825B2
JP6938825B2 JP2019010630A JP2019010630A JP6938825B2 JP 6938825 B2 JP6938825 B2 JP 6938825B2 JP 2019010630 A JP2019010630 A JP 2019010630A JP 2019010630 A JP2019010630 A JP 2019010630A JP 6938825 B2 JP6938825 B2 JP 6938825B2
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JP
Japan
Prior art keywords
resin layer
roughness
circuit board
printed circuit
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019010630A
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English (en)
Japanese (ja)
Other versions
JP2020013977A5 (enExample
JP2020013977A (ja
Inventor
ミン、テ−ホン
小椋　一郎
一郎 小椋
ジャン、ジュン−ヒョン
チョイ、ジュン−ウー
ソン、ヨ−ハン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2020013977A publication Critical patent/JP2020013977A/ja
Publication of JP2020013977A5 publication Critical patent/JP2020013977A5/ja
Application granted granted Critical
Publication of JP6938825B2 publication Critical patent/JP6938825B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2019010630A 2018-07-16 2019-01-24 プリント回路基板 Active JP6938825B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0082454 2018-07-16
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판

Publications (3)

Publication Number Publication Date
JP2020013977A JP2020013977A (ja) 2020-01-23
JP2020013977A5 JP2020013977A5 (enExample) 2020-03-05
JP6938825B2 true JP6938825B2 (ja) 2021-09-22

Family

ID=69170027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019010630A Active JP6938825B2 (ja) 2018-07-16 2019-01-24 プリント回路基板

Country Status (3)

Country Link
JP (1) JP6938825B2 (enExample)
KR (1) KR102214641B1 (enExample)
TW (1) TWI731298B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US12446153B2 (en) * 2020-07-29 2025-10-14 Kyocera Corporation Circuit substrate and method for manufacturing the same
KR102798468B1 (ko) * 2022-09-06 2025-04-23 주식회사 엔트리얼즈 다층 인쇄회로기판 제조방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000036886A1 (en) * 1998-12-16 2000-06-22 Ibiden Co., Ltd. Conductive connecting pin and package board
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG162619A1 (en) 2003-04-15 2010-07-29 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2006191145A (ja) * 2006-03-20 2006-07-20 Kyocera Corp 多層配線基板
KR100752025B1 (ko) 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR101180366B1 (ko) * 2011-02-25 2012-09-10 주식회사 심텍 회로기판 및 그 제조방법
CN204994111U (zh) * 2013-02-15 2016-01-20 株式会社村田制作所 层叠电路基板
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20170079574A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2017175649A1 (ja) * 2016-04-05 2017-10-12 株式会社村田製作所 液晶ポリマー片面積層板
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜
KR102494341B1 (ko) * 2017-11-08 2023-02-01 삼성전기주식회사 인쇄회로기판

Also Published As

Publication number Publication date
TW202007239A (zh) 2020-02-01
KR20200008389A (ko) 2020-01-28
TWI731298B (zh) 2021-06-21
JP2020013977A (ja) 2020-01-23
KR102214641B1 (ko) 2021-02-10

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