KR102214641B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102214641B1
KR102214641B1 KR1020180082454A KR20180082454A KR102214641B1 KR 102214641 B1 KR102214641 B1 KR 102214641B1 KR 1020180082454 A KR1020180082454 A KR 1020180082454A KR 20180082454 A KR20180082454 A KR 20180082454A KR 102214641 B1 KR102214641 B1 KR 102214641B1
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KR
South Korea
Prior art keywords
resin layer
circuit board
printed circuit
roughness
rough surface
Prior art date
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Application number
KR1020180082454A
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English (en)
Korean (ko)
Other versions
KR20200008389A (ko
Inventor
민태홍
최정우
송요한
장준형
오구라 이치로
Original Assignee
삼성전기주식회사
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020180082454A priority Critical patent/KR102214641B1/ko
Priority to JP2019010630A priority patent/JP6938825B2/ja
Priority to TW108103192A priority patent/TWI731298B/zh
Publication of KR20200008389A publication Critical patent/KR20200008389A/ko
Application granted granted Critical
Publication of KR102214641B1 publication Critical patent/KR102214641B1/ko
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020180082454A 2018-07-16 2018-07-16 인쇄회로기판 Active KR102214641B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판
JP2019010630A JP6938825B2 (ja) 2018-07-16 2019-01-24 プリント回路基板
TW108103192A TWI731298B (zh) 2018-07-16 2019-01-29 印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200008389A KR20200008389A (ko) 2020-01-28
KR102214641B1 true KR102214641B1 (ko) 2021-02-10

Family

ID=69170027

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180082454A Active KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP6938825B2 (enExample)
KR (1) KR102214641B1 (enExample)
TW (1) TWI731298B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US12446153B2 (en) * 2020-07-29 2025-10-14 Kyocera Corporation Circuit substrate and method for manufacturing the same
KR102798468B1 (ko) * 2022-09-06 2025-04-23 주식회사 엔트리얼즈 다층 인쇄회로기판 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752025B1 (ko) 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1845759A1 (en) * 1998-12-16 2007-10-17 Ibiden Co., Ltd. Conductive connecting pin and package substrate
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG162620A1 (en) 2003-04-15 2010-07-29 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2006191145A (ja) * 2006-03-20 2006-07-20 Kyocera Corp 多層配線基板
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR101180366B1 (ko) * 2011-02-25 2012-09-10 주식회사 심텍 회로기판 및 그 제조방법
JP6004078B2 (ja) * 2013-02-15 2016-10-05 株式会社村田製作所 積層回路基板、積層回路基板の製造方法
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20170079574A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2017175649A1 (ja) * 2016-04-05 2017-10-12 株式会社村田製作所 液晶ポリマー片面積層板
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜
KR102494341B1 (ko) * 2017-11-08 2023-02-01 삼성전기주식회사 인쇄회로기판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752025B1 (ko) 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법

Also Published As

Publication number Publication date
JP2020013977A (ja) 2020-01-23
KR20200008389A (ko) 2020-01-28
TWI731298B (zh) 2021-06-21
JP6938825B2 (ja) 2021-09-22
TW202007239A (zh) 2020-02-01

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