JP2020013977A5 - - Google Patents
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- Publication number
- JP2020013977A5 JP2020013977A5 JP2019010630A JP2019010630A JP2020013977A5 JP 2020013977 A5 JP2020013977 A5 JP 2020013977A5 JP 2019010630 A JP2019010630 A JP 2019010630A JP 2019010630 A JP2019010630 A JP 2019010630A JP 2020013977 A5 JP2020013977 A5 JP 2020013977A5
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- circuit board
- printed circuit
- board according
- roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 31
- 239000011347 resin Substances 0.000 claims 31
- 229920001187 thermosetting polymer Polymers 0.000 claims 12
- 229920005992 thermoplastic resin Polymers 0.000 claims 9
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 4
- 229920001955 polyphenylene ether Polymers 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0082454 | 2018-07-16 | ||
| KR1020180082454A KR102214641B1 (ko) | 2018-07-16 | 2018-07-16 | 인쇄회로기판 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020013977A JP2020013977A (ja) | 2020-01-23 |
| JP2020013977A5 true JP2020013977A5 (enExample) | 2020-03-05 |
| JP6938825B2 JP6938825B2 (ja) | 2021-09-22 |
Family
ID=69170027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019010630A Active JP6938825B2 (ja) | 2018-07-16 | 2019-01-24 | プリント回路基板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6938825B2 (enExample) |
| KR (1) | KR102214641B1 (enExample) |
| TW (1) | TWI731298B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102880997B1 (ko) | 2020-03-02 | 2025-11-04 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 모듈 |
| WO2022024907A1 (ja) * | 2020-07-29 | 2022-02-03 | 京セラ株式会社 | 回路基板およびその製造方法 |
| KR102798468B1 (ko) * | 2022-09-06 | 2025-04-23 | 주식회사 엔트리얼즈 | 다층 인쇄회로기판 제조방법 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035214B1 (en) * | 1998-12-16 | 2011-10-11 | Ibiden Co., Ltd. | Conductive connecting pin for package substance |
| JP2003258435A (ja) * | 2002-03-07 | 2003-09-12 | Shinko Electric Ind Co Ltd | 配線基板用シート材料及び多層配線基板 |
| KR101097076B1 (ko) | 2003-04-15 | 2011-12-22 | 덴끼 가가꾸 고교 가부시키가이샤 | 금속 베이스 회로 기판과 그 제조 방법 |
| JP2006191145A (ja) * | 2006-03-20 | 2006-07-20 | Kyocera Corp | 多層配線基板 |
| KR100752025B1 (ko) | 2006-07-10 | 2007-08-28 | 삼성전기주식회사 | 인쇄회로기판의 제조 방법 |
| KR100815319B1 (ko) * | 2006-08-30 | 2008-03-19 | 삼성전기주식회사 | 고밀도 인쇄회로기판 및 그 제조 방법 |
| JP5855905B2 (ja) * | 2010-12-16 | 2016-02-09 | 日本特殊陶業株式会社 | 多層配線基板及びその製造方法 |
| KR101180366B1 (ko) * | 2011-02-25 | 2012-09-10 | 주식회사 심텍 | 회로기판 및 그 제조방법 |
| CN204994111U (zh) * | 2013-02-15 | 2016-01-20 | 株式会社村田制作所 | 层叠电路基板 |
| JP5885791B2 (ja) * | 2013-08-20 | 2016-03-15 | Ｊｘ金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法 |
| JP5658399B1 (ja) * | 2014-05-21 | 2015-01-21 | 株式会社フジクラ | プリント配線板 |
| JP6653466B2 (ja) * | 2014-06-05 | 2020-02-26 | パナソニックＩｐマネジメント株式会社 | 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法 |
| KR102473405B1 (ko) * | 2015-10-30 | 2022-12-02 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| KR20170079574A (ko) * | 2015-12-30 | 2017-07-10 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| WO2017175649A1 (ja) * | 2016-04-05 | 2017-10-12 | 株式会社村田製作所 | 液晶ポリマー片面積層板 |
| JP7114214B2 (ja) * | 2016-05-24 | 2022-08-08 | 味の素株式会社 | 接着フィルム |
| TWM543773U (zh) * | 2017-01-26 | 2017-06-21 | 長興材料工業股份有限公司 | 感光型乾膜 |
| KR102494341B1 (ko) * | 2017-11-08 | 2023-02-01 | 삼성전기주식회사 | 인쇄회로기판 |
-
2018
- 2018-07-16 KR KR1020180082454A patent/KR102214641B1/ko active Active
-
2019
- 2019-01-24 JP JP2019010630A patent/JP6938825B2/ja active Active
- 2019-01-29 TW TW108103192A patent/TWI731298B/zh active
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