JP2020021928A5 - - Google Patents

Download PDF

Info

Publication number
JP2020021928A5
JP2020021928A5 JP2019033061A JP2019033061A JP2020021928A5 JP 2020021928 A5 JP2020021928 A5 JP 2020021928A5 JP 2019033061 A JP2019033061 A JP 2019033061A JP 2019033061 A JP2019033061 A JP 2019033061A JP 2020021928 A5 JP2020021928 A5 JP 2020021928A5
Authority
JP
Japan
Prior art keywords
resin layer
circuit board
printed circuit
board according
inclined surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019033061A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020021928A (ja
Filing date
Publication date
Priority claimed from KR1020180088702A external-priority patent/KR102163044B1/ko
Application filed filed Critical
Publication of JP2020021928A publication Critical patent/JP2020021928A/ja
Publication of JP2020021928A5 publication Critical patent/JP2020021928A5/ja
Pending legal-status Critical Current

Links

JP2019033061A 2018-07-30 2019-02-26 プリント回路基板 Pending JP2020021928A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0088702 2018-07-30
KR1020180088702A KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판

Publications (2)

Publication Number Publication Date
JP2020021928A JP2020021928A (ja) 2020-02-06
JP2020021928A5 true JP2020021928A5 (enExample) 2020-03-19

Family

ID=69570020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019033061A Pending JP2020021928A (ja) 2018-07-30 2019-02-26 プリント回路基板

Country Status (3)

Country Link
JP (1) JP2020021928A (enExample)
KR (1) KR102163044B1 (enExample)
TW (1) TWI720428B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
KR102846701B1 (ko) * 2020-05-21 2025-08-14 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
WO2025174145A1 (ko) * 2024-02-16 2025-08-21 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051908B1 (ko) 2003-04-15 2011-07-26 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판과 그 제조 방법
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP2006253189A (ja) 2005-03-08 2006-09-21 Fujitsu Ltd 多層回路基板及びその製造方法
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
KR100875955B1 (ko) * 2007-01-25 2008-12-26 삼성전자주식회사 스택 패키지 및 그의 제조 방법
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
KR101231273B1 (ko) * 2010-12-24 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP6383519B2 (ja) 2011-06-17 2018-08-29 住友ベークライト株式会社 プリント配線板および製造方法
JP5385967B2 (ja) 2011-12-22 2014-01-08 イビデン株式会社 配線板及びその製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
TW201408145A (zh) * 2012-08-14 2014-02-16 古河電氣工業股份有限公司 配線基板及該製造方法以及半導體裝置
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法
KR20170028710A (ko) * 2015-09-04 2017-03-14 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법
JP6836580B2 (ja) * 2016-02-18 2021-03-03 三井金属鉱業株式会社 プリント配線板製造用銅箔、キャリア付銅箔及び銅張積層板、並びにそれらを用いたプリント配線板の製造方法

Similar Documents

Publication Publication Date Title
US8933556B2 (en) Wiring board
KR101562486B1 (ko) 다층배선기판 및 그 제조방법
JP2020013976A5 (enExample)
JP2017123459A5 (enExample)
JP2020021928A5 (enExample)
JP6383519B2 (ja) プリント配線板および製造方法
JP2009283739A5 (enExample)
JP7238241B2 (ja) プリント回路基板
US20150340309A1 (en) Printed wiring board, semiconductor package, and method for manufacturing printed wiring board
JP6721143B2 (ja) プリント回路基板及びその製造方法
US20150257268A1 (en) Printed wiring board and method for manufacturing printed wiring board
JP2020013977A5 (enExample)
CN105530768B (zh) 一种电路板的制作方法及电路板
CN104968138B (zh) 一种印刷电路板
CN101242710A (zh) 一种多层电路板及其制造方法
KR102128508B1 (ko) 인쇄회로기판
KR20180013017A (ko) 인쇄회로기판
CN111406444A (zh) 制造柔性印刷电路板的方法以及柔性印刷电路板
CN205385603U (zh) 一种mems麦克风
CN104780705B (zh) 基板和制造基板的方法
CN207531166U (zh) 一种具有加固结构的多层pcb板
KR102812877B1 (ko) 회로 기판
KR102152875B1 (ko) 인쇄회로기판 및 이의 제조 방법
KR101147344B1 (ko) 인쇄회로기판의 제조방법 및 인쇄회로기판
JP2016154184A (ja) 印刷配線板およびその製造方法