JP2020021928A - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP2020021928A
JP2020021928A JP2019033061A JP2019033061A JP2020021928A JP 2020021928 A JP2020021928 A JP 2020021928A JP 2019033061 A JP2019033061 A JP 2019033061A JP 2019033061 A JP2019033061 A JP 2019033061A JP 2020021928 A JP2020021928 A JP 2020021928A
Authority
JP
Japan
Prior art keywords
resin layer
circuit board
printed circuit
board according
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019033061A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020021928A5 (enExample
Inventor
ソン、ヨ−ハン
Yo Han Song
ジャン、ジュン−ヒョン
Junhyeong Jang
ミン、テ−ホン
Tae Hong Ming
チョイ、ジュン−ウー
Jung Woo Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2020021928A publication Critical patent/JP2020021928A/ja
Publication of JP2020021928A5 publication Critical patent/JP2020021928A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2019033061A 2018-07-30 2019-02-26 プリント回路基板 Pending JP2020021928A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0088702 2018-07-30
KR1020180088702A KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판

Publications (2)

Publication Number Publication Date
JP2020021928A true JP2020021928A (ja) 2020-02-06
JP2020021928A5 JP2020021928A5 (enExample) 2020-03-19

Family

ID=69570020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019033061A Pending JP2020021928A (ja) 2018-07-30 2019-02-26 プリント回路基板

Country Status (3)

Country Link
JP (1) JP2020021928A (enExample)
KR (1) KR102163044B1 (enExample)
TW (1) TWI720428B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
KR102846701B1 (ko) * 2020-05-21 2025-08-14 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
WO2025174145A1 (ko) * 2024-02-16 2025-08-21 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
JP2014001274A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051908B1 (ko) 2003-04-15 2011-07-26 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판과 그 제조 방법
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP2006253189A (ja) 2005-03-08 2006-09-21 Fujitsu Ltd 多層回路基板及びその製造方法
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
KR100875955B1 (ko) * 2007-01-25 2008-12-26 삼성전자주식회사 스택 패키지 및 그의 제조 방법
KR101231273B1 (ko) * 2010-12-24 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP6383519B2 (ja) 2011-06-17 2018-08-29 住友ベークライト株式会社 プリント配線板および製造方法
JP5385967B2 (ja) 2011-12-22 2014-01-08 イビデン株式会社 配線板及びその製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
TW201408145A (zh) * 2012-08-14 2014-02-16 古河電氣工業股份有限公司 配線基板及該製造方法以及半導體裝置
KR20170028710A (ko) * 2015-09-04 2017-03-14 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법
JP6836580B2 (ja) * 2016-02-18 2021-03-03 三井金属鉱業株式会社 プリント配線板製造用銅箔、キャリア付銅箔及び銅張積層板、並びにそれらを用いたプリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
JP2014001274A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法

Also Published As

Publication number Publication date
TWI720428B (zh) 2021-03-01
TW202008858A (zh) 2020-02-16
KR102163044B1 (ko) 2020-10-08
KR20200013471A (ko) 2020-02-07

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