TWI720428B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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Publication number
TWI720428B
TWI720428B TW108106195A TW108106195A TWI720428B TW I720428 B TWI720428 B TW I720428B TW 108106195 A TW108106195 A TW 108106195A TW 108106195 A TW108106195 A TW 108106195A TW I720428 B TWI720428 B TW I720428B
Authority
TW
Taiwan
Prior art keywords
resin layer
hole
circuit
protrusion
layer
Prior art date
Application number
TW108106195A
Other languages
English (en)
Chinese (zh)
Other versions
TW202008858A (zh
Inventor
宋堯韓
張俊亨
閔太泓
崔晸宇
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW202008858A publication Critical patent/TW202008858A/zh
Application granted granted Critical
Publication of TWI720428B publication Critical patent/TWI720428B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW108106195A 2018-07-30 2019-02-23 印刷電路板 TWI720428B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0088702 2018-07-30
KR1020180088702A KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판

Publications (2)

Publication Number Publication Date
TW202008858A TW202008858A (zh) 2020-02-16
TWI720428B true TWI720428B (zh) 2021-03-01

Family

ID=69570020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108106195A TWI720428B (zh) 2018-07-30 2019-02-23 印刷電路板

Country Status (3)

Country Link
JP (1) JP2020021928A (enExample)
KR (1) KR102163044B1 (enExample)
TW (1) TWI720428B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
KR102846701B1 (ko) * 2020-05-21 2025-08-14 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
WO2025174145A1 (ko) * 2024-02-16 2025-08-21 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201408145A (zh) * 2012-08-14 2014-02-16 古河電氣工業股份有限公司 配線基板及該製造方法以及半導體裝置
TWI626151B (zh) * 2016-02-18 2018-06-11 三井金屬鑛業股份有限公司 Copper foil for manufacturing printed wiring board, copper foil with carrier, copper-clad laminate, and method for producing printed wiring board using the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA05011216A (es) 2003-04-15 2005-12-14 Denki Kagaku Kogyo Kk Tablero de circuitos con base de metal y su metodo de fabricacion.
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP2006253189A (ja) * 2005-03-08 2006-09-21 Fujitsu Ltd 多層回路基板及びその製造方法
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
KR100875955B1 (ko) * 2007-01-25 2008-12-26 삼성전자주식회사 스택 패키지 및 그의 제조 방법
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
KR101231273B1 (ko) * 2010-12-24 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
WO2012172792A1 (ja) * 2011-06-17 2012-12-20 住友ベークライト株式会社 プリント配線板および製造方法
JP5385967B2 (ja) * 2011-12-22 2014-01-08 イビデン株式会社 配線板及びその製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法
KR20170028710A (ko) * 2015-09-04 2017-03-14 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201408145A (zh) * 2012-08-14 2014-02-16 古河電氣工業股份有限公司 配線基板及該製造方法以及半導體裝置
TWI626151B (zh) * 2016-02-18 2018-06-11 三井金屬鑛業股份有限公司 Copper foil for manufacturing printed wiring board, copper foil with carrier, copper-clad laminate, and method for producing printed wiring board using the same

Also Published As

Publication number Publication date
JP2020021928A (ja) 2020-02-06
KR102163044B1 (ko) 2020-10-08
KR20200013471A (ko) 2020-02-07
TW202008858A (zh) 2020-02-16

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