KR102163044B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102163044B1
KR102163044B1 KR1020180088702A KR20180088702A KR102163044B1 KR 102163044 B1 KR102163044 B1 KR 102163044B1 KR 1020180088702 A KR1020180088702 A KR 1020180088702A KR 20180088702 A KR20180088702 A KR 20180088702A KR 102163044 B1 KR102163044 B1 KR 102163044B1
Authority
KR
South Korea
Prior art keywords
resin layer
layer
circuit board
printed circuit
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180088702A
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English (en)
Korean (ko)
Other versions
KR20200013471A (ko
Inventor
송요한
최정우
장준형
민태홍
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020180088702A priority Critical patent/KR102163044B1/ko
Priority to TW108106195A priority patent/TWI720428B/zh
Priority to JP2019033061A priority patent/JP2020021928A/ja
Publication of KR20200013471A publication Critical patent/KR20200013471A/ko
Application granted granted Critical
Publication of KR102163044B1 publication Critical patent/KR102163044B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020180088702A 2018-07-30 2018-07-30 인쇄회로기판 Active KR102163044B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180088702A KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판
TW108106195A TWI720428B (zh) 2018-07-30 2019-02-23 印刷電路板
JP2019033061A JP2020021928A (ja) 2018-07-30 2019-02-26 プリント回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180088702A KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200013471A KR20200013471A (ko) 2020-02-07
KR102163044B1 true KR102163044B1 (ko) 2020-10-08

Family

ID=69570020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180088702A Active KR102163044B1 (ko) 2018-07-30 2018-07-30 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP2020021928A (enExample)
KR (1) KR102163044B1 (enExample)
TW (1) TWI720428B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
KR102846701B1 (ko) * 2020-05-21 2025-08-14 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
WO2025174145A1 (ko) * 2024-02-16 2025-08-21 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253189A (ja) 2005-03-08 2006-09-21 Fujitsu Ltd 多層回路基板及びその製造方法
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP5066192B2 (ja) 2007-11-28 2012-11-07 京セラ株式会社 配線基板及び実装構造体
JP2013131727A (ja) 2011-12-22 2013-07-04 Ibiden Co Ltd 配線板及びその製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP2016219848A (ja) 2011-06-17 2016-12-22 住友ベークライト株式会社 プリント配線板および製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051908B1 (ko) 2003-04-15 2011-07-26 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판과 그 제조 방법
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
KR100875955B1 (ko) * 2007-01-25 2008-12-26 삼성전자주식회사 스택 패키지 및 그의 제조 방법
KR101231273B1 (ko) * 2010-12-24 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
TW201408145A (zh) * 2012-08-14 2014-02-16 古河電氣工業股份有限公司 配線基板及該製造方法以及半導體裝置
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法
KR20170028710A (ko) * 2015-09-04 2017-03-14 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법
JP6836580B2 (ja) * 2016-02-18 2021-03-03 三井金属鉱業株式会社 プリント配線板製造用銅箔、キャリア付銅箔及び銅張積層板、並びにそれらを用いたプリント配線板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253189A (ja) 2005-03-08 2006-09-21 Fujitsu Ltd 多層回路基板及びその製造方法
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP5066192B2 (ja) 2007-11-28 2012-11-07 京セラ株式会社 配線基板及び実装構造体
JP2016219848A (ja) 2011-06-17 2016-12-22 住友ベークライト株式会社 プリント配線板および製造方法
JP2013131727A (ja) 2011-12-22 2013-07-04 Ibiden Co Ltd 配線板及びその製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板

Also Published As

Publication number Publication date
TWI720428B (zh) 2021-03-01
TW202008858A (zh) 2020-02-16
JP2020021928A (ja) 2020-02-06
KR20200013471A (ko) 2020-02-07

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